HK1250192A1 - 具有集成壓電結構的mems電路板模塊，以及電聲換能器裝置 - Google Patents

具有集成壓電結構的mems電路板模塊，以及電聲換能器裝置

Info

Publication number
HK1250192A1
HK1250192A1 HK18109454.0A HK18109454A HK1250192A1 HK 1250192 A1 HK1250192 A1 HK 1250192A1 HK 18109454 A HK18109454 A HK 18109454A HK 1250192 A1 HK1250192 A1 HK 1250192A1
Authority
HK
Hong Kong
Prior art keywords
circuit board
electroacoustic transducer
board module
transducer arrangement
piezoelectric structure
Prior art date
Application number
HK18109454.0A
Other languages
English (en)
Inventor
安德里亞•韋斯高尼•克萊里西•貝爾特拉米
費魯喬•博托尼
Original Assignee
USound GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by USound GmbH filed Critical USound GmbH
Publication of HK1250192A1 publication Critical patent/HK1250192A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/06—Plane diaphragms comprising a plurality of sections or layers
    • H04R7/10—Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Micromachines (AREA)
HK18109454.0A 2015-10-01 2018-07-20 具有集成壓電結構的mems電路板模塊，以及電聲換能器裝置 HK1250192A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015116640.2A DE102015116640A1 (de) 2015-10-01 2015-10-01 MEMS-Leiterplattenmodul mit integrierter piezoelektrischer Struktur sowie Schallwandleranordnung
PCT/EP2016/070796 WO2017055012A1 (de) 2015-10-01 2016-09-05 Mems-leiterplattenmodul mit integrierter piezoelektrischer struktur sowie schallwandleranordnung

Publications (1)

Publication Number Publication Date
HK1250192A1 true HK1250192A1 (zh) 2018-11-30

Family

ID=56877029

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18109454.0A HK1250192A1 (zh) 2015-10-01 2018-07-20 具有集成壓電結構的mems電路板模塊，以及電聲換能器裝置

Country Status (10)

Country Link
US (1) US10433063B2 (zh)
EP (1) EP3320694B1 (zh)
KR (1) KR20180061187A (zh)
CN (1) CN108141669B (zh)
AU (1) AU2016332481B2 (zh)
CA (1) CA2997567A1 (zh)
DE (1) DE102015116640A1 (zh)
HK (1) HK1250192A1 (zh)
SG (2) SG10202002939QA (zh)
WO (1) WO2017055012A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015116640A1 (de) * 2015-10-01 2017-04-06 USound GmbH MEMS-Leiterplattenmodul mit integrierter piezoelektrischer Struktur sowie Schallwandleranordnung
DE102017114142A1 (de) 2017-06-26 2018-12-27 USound GmbH Schallwandleranordnung mit einer MEMS-Einheit
DE102017125117A1 (de) * 2017-10-26 2019-05-02 USound GmbH Schallwandleranordnung
CN110085735A (zh) * 2018-01-26 2019-08-02 安徽奥飞声学科技有限公司 Mems压电扬声器及其制备方法
WO2019144370A1 (zh) * 2018-01-26 2019-08-01 刘端 Mems压电扬声器及其制备方法
DE102018203812A1 (de) * 2018-03-13 2019-09-19 Christian-Albrechts-Universität Zu Kiel Ferroelektrisches material, mems-bauteil mit einem ferroelektrischen material, mems-vorrichtung mit einem ersten mems-bauteil, verfahren zur herstellung eines mems-bauteils und verfahren zur herstellung eines cmos-kompatiblen mems-bauteils
TWI707586B (zh) * 2018-08-14 2020-10-11 美律實業股份有限公司 微機電揚聲器
EP3620756B1 (de) * 2018-09-10 2021-07-14 Deutsches Institut für Lebensmitteltechnik e.V. Druckfestes gehäuse mit stromdurchführung
TWI683460B (zh) * 2018-11-30 2020-01-21 美律實業股份有限公司 揚聲器結構
CN110856085B (zh) * 2018-11-30 2021-07-09 美律电子(深圳)有限公司 扬声器结构
DE102019101325A1 (de) 2019-01-17 2020-07-23 USound GmbH Herstellungsverfahren für mehrere MEMS-Schallwandler
CN110290449A (zh) * 2019-05-09 2019-09-27 安徽奥飞声学科技有限公司 一种音频装置及电子设备
DE102019116080A1 (de) * 2019-06-13 2020-12-17 USound GmbH MEMS-Schallwandler mit einer aus Polymer ausgebildeten Membran
DE102020200771B4 (de) 2020-01-23 2023-03-30 Vitesco Technologies Germany Gmbh Fluidsensorvorrichtung zum Erfassen des Füllstands und/oder der Qualität eines Fluids und Verfahren zum Herstellen derselben
IT202000010264A1 (it) * 2020-05-07 2021-11-07 St Microelectronics Srl Attuatore piezoelettrico avente un sensore di deformazione e relativo procedimento di fabbricazione
IT202000010261A1 (it) 2020-05-07 2021-11-07 St Microelectronics Srl Attuatore piezoelettrico dotato di una struttura deformabile avente migliorate proprieta' meccaniche e relativo procedimento di fabbricazione

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2848036B1 (fr) * 2002-11-28 2005-08-26 St Microelectronics Sa Support pour resonateur acoustique, resonateur acoustique et circuit integre correspondant
US8120232B2 (en) * 2009-01-20 2012-02-21 Palo Alto Research Center Incorporated Sensors and actuators using piezo polymer layers
KR101609270B1 (ko) * 2009-08-12 2016-04-06 삼성전자주식회사 압전형 마이크로 스피커 및 그 제조 방법
KR101573517B1 (ko) * 2009-10-12 2015-12-02 삼성전자주식회사 압전형 마이크로 스피커
DE102010005654A1 (de) * 2010-01-19 2011-07-21 E.G.O. Elektro-Gerätebau GmbH, 75038 Signalgebeeinrichtung mit einem elektrischen akustischen Signalgeber
CN102075836B (zh) * 2011-01-18 2012-11-21 张家港市玉同电子科技有限公司 单膜式压电陶瓷扬声器
US9106994B2 (en) * 2013-03-14 2015-08-11 Abatech Electronics Co., Ltd. Ultra-slim speaker structure
US9596756B2 (en) * 2013-09-06 2017-03-14 Apple Inc. Electronic device with printed circuit board noise reduction using elastomeric damming and damping structures
CN203722817U (zh) * 2013-11-20 2014-07-16 张家港市玉同电子科技有限公司 用于手机、平板电脑中的单晶压电陶瓷发声器结构
DE102013114826A1 (de) 2013-12-23 2015-06-25 USound GmbH Mikro-elektromechanischer Schallwandler mit schallenergiereflektierender Zwischenschicht
US9309105B2 (en) 2014-03-06 2016-04-12 Infineon Technologies Ag Sensor structure for sensing pressure waves and ambient pressure
DE102014106753B4 (de) * 2014-05-14 2022-08-11 USound GmbH MEMS-Lautsprecher mit Aktuatorstruktur und davon beabstandeter Membran
DE102015116640A1 (de) * 2015-10-01 2017-04-06 USound GmbH MEMS-Leiterplattenmodul mit integrierter piezoelektrischer Struktur sowie Schallwandleranordnung

Also Published As

Publication number Publication date
EP3320694B1 (de) 2019-11-13
US20180249252A1 (en) 2018-08-30
DE102015116640A1 (de) 2017-04-06
CA2997567A1 (en) 2017-04-06
AU2016332481A1 (en) 2018-04-12
SG10202002939QA (en) 2020-05-28
CN108141669A (zh) 2018-06-08
CN108141669B (zh) 2021-01-22
US10433063B2 (en) 2019-10-01
AU2016332481B2 (en) 2020-07-16
SG11201802051UA (en) 2018-04-27
KR20180061187A (ko) 2018-06-07
WO2017055012A1 (de) 2017-04-06
EP3320694A1 (de) 2018-05-16

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