HK1252418A1 - 具有連續的凹進部的電路板模塊以及與之相關的聲音轉換器組件以及製作方法 - Google Patents

具有連續的凹進部的電路板模塊以及與之相關的聲音轉換器組件以及製作方法

Info

Publication number
HK1252418A1
HK1252418A1 HK18111715.1A HK18111715A HK1252418A1 HK 1252418 A1 HK1252418 A1 HK 1252418A1 HK 18111715 A HK18111715 A HK 18111715A HK 1252418 A1 HK1252418 A1 HK 1252418A1
Authority
HK
Hong Kong
Prior art keywords
circuit board
production method
transducer assembly
board module
sonic transducer
Prior art date
Application number
HK18111715.1A
Other languages
English (en)
Inventor
Clerici Beltrami Andrea Rusconi
Ferruccio Bottoni
Original Assignee
USound GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by USound GmbH filed Critical USound GmbH
Publication of HK1252418A1 publication Critical patent/HK1252418A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/02—Loudspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0058—Packages or encapsulation for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0035—Testing
    • B81C99/004—Testing during manufacturing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/097—Interconnects arranged on the substrate or the lid, and covered by the package seal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0005—Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems, or methods for manufacturing the same
    • B81C99/0025—Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems not provided for in B81C99/001 - B81C99/002
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Computer Hardware Design (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Otolaryngology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
HK18111715.1A 2015-05-13 2018-09-12 具有連續的凹進部的電路板模塊以及與之相關的聲音轉換器組件以及製作方法 HK1252418A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102015107557.1A DE102015107557A1 (de) 2015-05-13 2015-05-13 Leiterplattenmodul mit durchgehender Aussparung sowie diesbezügliche Schallwandleranordnung sowie Herstellungsverfahren

Publications (1)

Publication Number Publication Date
HK1252418A1 true HK1252418A1 (zh) 2019-05-24

Family

ID=56014977

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18111715.1A HK1252418A1 (zh) 2015-05-13 2018-09-12 具有連續的凹進部的電路板模塊以及與之相關的聲音轉換器組件以及製作方法

Country Status (11)

Country Link
US (1) US10206046B2 (zh)
EP (1) EP3295680B1 (zh)
KR (1) KR20180014727A (zh)
CN (1) CN107836121B (zh)
AU (1) AU2016261304B2 (zh)
CA (1) CA2985723A1 (zh)
DE (1) DE102015107557A1 (zh)
HK (1) HK1252418A1 (zh)
MY (1) MY178847A (zh)
SG (2) SG10201907304XA (zh)
WO (1) WO2016180841A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015116707A1 (de) * 2015-10-01 2017-04-06 USound GmbH Flexible MEMS-Leiterplatteneinheit sowie Schallwandleranordnung
TWI707586B (zh) * 2018-08-14 2020-10-11 美律實業股份有限公司 微機電揚聲器
US11078071B2 (en) 2018-10-19 2021-08-03 Encite Llc Haptic actuators fabricated by roll-to-roll processing
DE102019101325A1 (de) 2019-01-17 2020-07-23 USound GmbH Herstellungsverfahren für mehrere MEMS-Schallwandler
KR102375721B1 (ko) * 2019-11-04 2022-03-17 (주)에스제이인스트루먼트 초음파 트랜스듀서 조립체

Family Cites Families (18)

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US3701865A (en) * 1971-06-25 1972-10-31 Industrial Research Prod Inc Acoustic transducer having diaphragm pivoted in its surround
DE4229244A1 (de) * 1992-09-02 1994-03-03 Basf Ag Verfahren zur Herstellung von Mikrostrukturkörpern
US5870482A (en) 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone
US8617934B1 (en) 2000-11-28 2013-12-31 Knowles Electronics, Llc Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages
US7166910B2 (en) * 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
CN101198854B (zh) 2005-06-10 2012-06-20 米其林研究和技术股份有限公司 附着于电子封装外壳的压电传感器的使用
DE102005053767B4 (de) * 2005-11-10 2014-10-30 Epcos Ag MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
CN201114763Y (zh) * 2007-10-09 2008-09-10 东莞泉声电子有限公司 一种硅传声器
JP5269659B2 (ja) * 2009-03-17 2013-08-21 株式会社オーディオテクニカ コンデンサマイクロホンユニット、コンデンサマイクロホンユニットの製造方法、及びコンデンサマイクロホン
US8338208B2 (en) * 2009-12-31 2012-12-25 Texas Instruments Incorporated Micro-electro-mechanical system having movable element integrated into leadframe-based package
JP5348073B2 (ja) * 2010-06-01 2013-11-20 船井電機株式会社 電気音響変換素子搭載基板及びマイクロホンユニット、並びにそれらの製造方法
US9407997B2 (en) * 2010-10-12 2016-08-02 Invensense, Inc. Microphone package with embedded ASIC
DE102011084393A1 (de) 2011-10-13 2013-04-18 Robert Bosch Gmbh Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren
CN103999484B (zh) 2011-11-04 2017-06-30 美商楼氏电子有限公司 作为声学设备中的屏障的嵌入式电介质和制造方法
DE102011086764A1 (de) 2011-11-22 2013-05-23 Robert Bosch Gmbh MEMS-Chippackage und Verfahren zum Herstellen eines MEMS-Chippackages
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US9082883B2 (en) * 2013-03-04 2015-07-14 Unisem (M) Berhad Top port MEMS cavity package and method of manufacture thereof

Also Published As

Publication number Publication date
MY178847A (en) 2020-10-21
US20180091905A1 (en) 2018-03-29
US10206046B2 (en) 2019-02-12
SG11201709340PA (en) 2017-12-28
CN107836121A (zh) 2018-03-23
CA2985723A1 (en) 2016-11-17
EP3295680A1 (de) 2018-03-21
SG10201907304XA (en) 2019-09-27
AU2016261304B2 (en) 2020-10-08
WO2016180841A1 (de) 2016-11-17
CN107836121B (zh) 2020-10-23
DE102015107557A1 (de) 2016-11-17
AU2016261304A1 (en) 2017-12-14
KR20180014727A (ko) 2018-02-09
EP3295680B1 (de) 2019-07-10

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