SG10202002939QA - Mems printed circuit board module with integrated piezoelectric structure and sound transducer assembly - Google Patents
Mems printed circuit board module with integrated piezoelectric structure and sound transducer assemblyInfo
- Publication number
- SG10202002939QA SG10202002939QA SG10202002939QA SG10202002939QA SG10202002939QA SG 10202002939Q A SG10202002939Q A SG 10202002939QA SG 10202002939Q A SG10202002939Q A SG 10202002939QA SG 10202002939Q A SG10202002939Q A SG 10202002939QA SG 10202002939Q A SG10202002939Q A SG 10202002939QA
- Authority
- SG
- Singapore
- Prior art keywords
- circuit board
- printed circuit
- transducer assembly
- sound transducer
- board module
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
- H04R7/06—Plane diaphragms comprising a plurality of sections or layers
- H04R7/10—Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Micromachines (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102015116640.2A DE102015116640A1 (en) | 2015-10-01 | 2015-10-01 | MEMS printed circuit board module with integrated piezoelectric structure and sound transducer arrangement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10202002939QA true SG10202002939QA (en) | 2020-05-28 |
Family
ID=56877029
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10202002939QA SG10202002939QA (en) | 2015-10-01 | 2016-09-05 | Mems printed circuit board module with integrated piezoelectric structure and sound transducer assembly |
| SG11201802051UA SG11201802051UA (en) | 2015-10-01 | 2016-09-05 | Mems printed circuit board module with integrated piezoelectric structure and sound transducer assembly |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201802051UA SG11201802051UA (en) | 2015-10-01 | 2016-09-05 | Mems printed circuit board module with integrated piezoelectric structure and sound transducer assembly |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US10433063B2 (en) |
| EP (1) | EP3320694B1 (en) |
| KR (1) | KR20180061187A (en) |
| CN (1) | CN108141669B (en) |
| AU (1) | AU2016332481B2 (en) |
| CA (1) | CA2997567A1 (en) |
| DE (1) | DE102015116640A1 (en) |
| HK (1) | HK1250192A1 (en) |
| SG (2) | SG10202002939QA (en) |
| WO (1) | WO2017055012A1 (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015116640A1 (en) * | 2015-10-01 | 2017-04-06 | USound GmbH | MEMS printed circuit board module with integrated piezoelectric structure and sound transducer arrangement |
| DE102017114142A1 (en) | 2017-06-26 | 2018-12-27 | USound GmbH | Sound transducer arrangement with a MEMS unit |
| DE102017125117A1 (en) * | 2017-10-26 | 2019-05-02 | USound GmbH | Transducer array |
| WO2019144370A1 (en) * | 2018-01-26 | 2019-08-01 | 刘端 | Mems piezoelectric speaker and preparation method therefor |
| CN110085735A (en) * | 2018-01-26 | 2019-08-02 | 安徽奥飞声学科技有限公司 | MEMS piezoelectric speaker and preparation method thereof |
| DE102018203812A1 (en) | 2018-03-13 | 2019-09-19 | Christian-Albrechts-Universität Zu Kiel | FERROELECTRIC MATERIAL, MEMS COMPONENT WITH A FERROELECTRIC MATERIAL, MEMS DEVICE WITH A FIRST MEMS COMPONENT, METHOD FOR PRODUCING A MEMS COMPONENT, AND METHOD FOR PRODUCING A CMOS COMPATIBLE MEMS COMPONENT |
| TWI707586B (en) * | 2018-08-14 | 2020-10-11 | 美律實業股份有限公司 | Mems speaker |
| EP3620756B1 (en) * | 2018-09-10 | 2021-07-14 | Deutsches Institut für Lebensmitteltechnik e.V. | Pressure-resistant housing with electricity feed-through |
| CN110856085B (en) * | 2018-11-30 | 2021-07-09 | 美律电子(深圳)有限公司 | Loudspeaker structure |
| TWI683460B (en) * | 2018-11-30 | 2020-01-21 | 美律實業股份有限公司 | Speaker structure |
| DE102019101325A1 (en) * | 2019-01-17 | 2020-07-23 | USound GmbH | Manufacturing process for multiple MEMS transducers |
| CN110290449A (en) * | 2019-05-09 | 2019-09-27 | 安徽奥飞声学科技有限公司 | A kind of audio devices and electronic equipment |
| DE102019116080A1 (en) * | 2019-06-13 | 2020-12-17 | USound GmbH | MEMS sound transducer with a membrane made of polymer |
| DE102020200771B4 (en) | 2020-01-23 | 2023-03-30 | Vitesco Technologies Germany Gmbh | Fluid sensor device for detecting the filling level and/or the quality of a fluid and method for producing the same |
| IT202000010264A1 (en) * | 2020-05-07 | 2021-11-07 | St Microelectronics Srl | PIEZOELECTRIC ACTUATOR HAVING A DEFORMATION SENSOR AND RELATED MANUFACTURING PROCEDURE |
| IT202000010261A1 (en) | 2020-05-07 | 2021-11-07 | St Microelectronics Srl | PIEZOELECTRIC ACTUATOR EQUIPPED WITH A DEFORMABLE STRUCTURE HAVING IMPROVED MECHANICAL PROPERTIES AND RELATED MANUFACTURING PROCEDURE |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2848036B1 (en) * | 2002-11-28 | 2005-08-26 | St Microelectronics Sa | SUPPORT FOR ACOUSTIC RESONATOR, ACOUSTIC RESONATOR AND CORRESPONDING INTEGRATED CIRCUIT |
| US8120232B2 (en) * | 2009-01-20 | 2012-02-21 | Palo Alto Research Center Incorporated | Sensors and actuators using piezo polymer layers |
| KR101609270B1 (en) * | 2009-08-12 | 2016-04-06 | 삼성전자주식회사 | Piezoelectric micro speaker and method of manufacturing the same |
| KR101573517B1 (en) | 2009-10-12 | 2015-12-02 | 삼성전자주식회사 | Piezoelectric micro speaker |
| DE102010005654A1 (en) * | 2010-01-19 | 2011-07-21 | E.G.O. Elektro-Gerätebau GmbH, 75038 | Signaling device with an electrical acoustic signal generator |
| CN102075836B (en) * | 2011-01-18 | 2012-11-21 | 张家港市玉同电子科技有限公司 | Single-diaphragm piezoelectric ceramic loudspeaker |
| US9106994B2 (en) * | 2013-03-14 | 2015-08-11 | Abatech Electronics Co., Ltd. | Ultra-slim speaker structure |
| US9596756B2 (en) * | 2013-09-06 | 2017-03-14 | Apple Inc. | Electronic device with printed circuit board noise reduction using elastomeric damming and damping structures |
| CN203722817U (en) * | 2013-11-20 | 2014-07-16 | 张家港市玉同电子科技有限公司 | Monocrystalline piezoelectric-ceramic sounder structure for mobile phone and tablet PC |
| DE102013114826A1 (en) | 2013-12-23 | 2015-06-25 | USound GmbH | Microelectromechanical sound transducer with sound energy-reflecting intermediate layer |
| US9309105B2 (en) | 2014-03-06 | 2016-04-12 | Infineon Technologies Ag | Sensor structure for sensing pressure waves and ambient pressure |
| DE102014106753B4 (en) | 2014-05-14 | 2022-08-11 | USound GmbH | MEMS loudspeaker with actuator structure and diaphragm spaced therefrom |
| DE102015116640A1 (en) * | 2015-10-01 | 2017-04-06 | USound GmbH | MEMS printed circuit board module with integrated piezoelectric structure and sound transducer arrangement |
-
2015
- 2015-10-01 DE DE102015116640.2A patent/DE102015116640A1/en active Pending
-
2016
- 2016-09-05 CN CN201680057170.0A patent/CN108141669B/en active Active
- 2016-09-05 AU AU2016332481A patent/AU2016332481B2/en not_active Ceased
- 2016-09-05 SG SG10202002939QA patent/SG10202002939QA/en unknown
- 2016-09-05 US US15/758,070 patent/US10433063B2/en active Active
- 2016-09-05 EP EP16760706.8A patent/EP3320694B1/en active Active
- 2016-09-05 SG SG11201802051UA patent/SG11201802051UA/en unknown
- 2016-09-05 CA CA2997567A patent/CA2997567A1/en not_active Abandoned
- 2016-09-05 WO PCT/EP2016/070796 patent/WO2017055012A1/en active Application Filing
- 2016-09-05 KR KR1020187008583A patent/KR20180061187A/en not_active Application Discontinuation
-
2018
- 2018-07-20 HK HK18109454.0A patent/HK1250192A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CA2997567A1 (en) | 2017-04-06 |
| HK1250192A1 (en) | 2018-11-30 |
| CN108141669B (en) | 2021-01-22 |
| SG11201802051UA (en) | 2018-04-27 |
| WO2017055012A1 (en) | 2017-04-06 |
| AU2016332481A1 (en) | 2018-04-12 |
| US10433063B2 (en) | 2019-10-01 |
| EP3320694A1 (en) | 2018-05-16 |
| US20180249252A1 (en) | 2018-08-30 |
| EP3320694B1 (en) | 2019-11-13 |
| AU2016332481B2 (en) | 2020-07-16 |
| KR20180061187A (en) | 2018-06-07 |
| DE102015116640A1 (en) | 2017-04-06 |
| CN108141669A (en) | 2018-06-08 |
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