SG11201802576RA - Flexible mems printed circuit board unit and sound transducer assembly - Google Patents
Flexible mems printed circuit board unit and sound transducer assemblyInfo
- Publication number
- SG11201802576RA SG11201802576RA SG11201802576RA SG11201802576RA SG11201802576RA SG 11201802576R A SG11201802576R A SG 11201802576RA SG 11201802576R A SG11201802576R A SG 11201802576RA SG 11201802576R A SG11201802576R A SG 11201802576RA SG 11201802576R A SG11201802576R A SG 11201802576RA
- Authority
- SG
- Singapore
- Prior art keywords
- circuit board
- printed circuit
- board unit
- transducer assembly
- sound transducer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
- H04R17/005—Piezoelectric transducers; Electrostrictive transducers using a piezoelectric polymer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/02—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0307—Anchors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/07—Interconnects
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
- Micromachines (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102015116707.7A DE102015116707A1 (en) | 2015-10-01 | 2015-10-01 | Flexible MEMS printed circuit board unit and sound transducer arrangement |
| PCT/EP2016/073166 WO2017055384A1 (en) | 2015-10-01 | 2016-09-29 | Flexible mems circuit board unit, and electroacoustic transducer arrangement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201802576RA true SG11201802576RA (en) | 2018-04-27 |
Family
ID=57044953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201802576RA SG11201802576RA (en) | 2015-10-01 | 2016-09-29 | Flexible mems printed circuit board unit and sound transducer assembly |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US10425741B2 (en) |
| EP (1) | EP3381202B1 (en) |
| KR (1) | KR20180061219A (en) |
| CN (1) | CN108141673B (en) |
| AU (1) | AU2016329109B2 (en) |
| CA (1) | CA3000054A1 (en) |
| DE (1) | DE102015116707A1 (en) |
| HK (1) | HK1255865A1 (en) |
| MY (1) | MY183684A (en) |
| SG (1) | SG11201802576RA (en) |
| WO (1) | WO2017055384A1 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017114142A1 (en) * | 2017-06-26 | 2018-12-27 | USound GmbH | Sound transducer arrangement with a MEMS unit |
| CN109413544B (en) * | 2017-08-17 | 2021-02-02 | 鹏鼎控股(深圳)股份有限公司 | Circuit board, method of manufacturing the same, and speaker including the same |
| DE102017125117A1 (en) * | 2017-10-26 | 2019-05-02 | USound GmbH | Transducer array |
| TWI683460B (en) * | 2018-11-30 | 2020-01-21 | 美律實業股份有限公司 | Speaker structure |
| IT201900001017A1 (en) * | 2019-01-23 | 2020-07-23 | St Microelectronics Srl | MICROELECTROMECHANICAL ELECTROACOUSTIC TRANSDUCER WITH PIEZOELECTRIC ACTUATION AND RELATED MANUFACTURING PROCEDURE |
| CN110290449A (en) * | 2019-05-09 | 2019-09-27 | 安徽奥飞声学科技有限公司 | A kind of audio devices and electronic equipment |
| DE102019116080A1 (en) * | 2019-06-13 | 2020-12-17 | USound GmbH | MEMS sound transducer with a membrane made of polymer |
| CN110784803B (en) * | 2019-12-31 | 2020-05-05 | 共达电声股份有限公司 | Flexible circuit board and loudspeaker |
| IT202000015073A1 (en) * | 2020-06-23 | 2021-12-23 | St Microelectronics Srl | MICROELECTROMECHANICAL MEMBRANE TRANSDUCER WITH ACTIVE DAMPER |
| CN111918187B (en) * | 2020-07-08 | 2021-10-29 | 瑞声科技（南京）有限公司 | MEMS loudspeaker |
| WO2022006815A1 (en) * | 2020-07-09 | 2022-01-13 | 诺思(天津)微系统有限责任公司 | Mems piezoelectric loudspeaker |
| CN111918188B (en) * | 2020-07-10 | 2021-12-14 | 瑞声科技（南京）有限公司 | MEMS loudspeaker and manufacturing process thereof |
| DE102020121337A1 (en) * | 2020-08-13 | 2022-02-17 | Tdk Electronics Ag | Piezoelectric transducer and method for adjusting the electromechanical properties of a piezoelectric transducer |
| CN112911470A (en) * | 2021-01-25 | 2021-06-04 | 精拓丽音科技（北京）有限公司 | Loudspeaker module |
| CN113645556A (en) * | 2021-08-27 | 2021-11-12 | 歌尔微电子股份有限公司 | MEMS microphone packaging structure and packaging method |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5723597U (en) * | 1980-07-09 | 1982-02-06 | ||
| JPS58159598U (en) * | 1982-04-20 | 1983-10-24 | セイコーエプソン株式会社 | Buzzer structure of small electronic game device |
| KR100491179B1 (en) * | 2001-11-21 | 2005-05-24 | 마츠시타 덴끼 산교 가부시키가이샤 | Thinned circuit substrate and its manufacturing method |
| KR100512960B1 (en) * | 2002-09-26 | 2005-09-07 | 삼성전자주식회사 | Flexible MEMS transducer and its manufacturing method, and flexible MEMS wireless microphone |
| JP2005045691A (en) * | 2003-07-24 | 2005-02-17 | Taiyo Yuden Co Ltd | Piezoelectric vibrator |
| US8251903B2 (en) * | 2007-10-25 | 2012-08-28 | Valencell, Inc. | Noninvasive physiological analysis using excitation-sensor modules and related devices and methods |
| JP5707323B2 (en) * | 2008-06-30 | 2015-04-30 | ザ・リージェンツ・オブ・ザ・ユニバーシティ・オブ・ミシガンＴｈｅ Ｒｅｇｅｎｔｓ Ｏｆ Ｔｈｅ Ｕｎｉｖｅｒｓｉｔｙ Ｏｆ Ｍｉｃｈｉｇａｎ | Piezoelectric MEMS microphone |
| KR101561663B1 (en) * | 2009-08-31 | 2015-10-21 | 삼성전자주식회사 | Piezoelectric micro speaker having piston diaphragm and method of manufacturing the same |
| KR101573517B1 (en) | 2009-10-12 | 2015-12-02 | 삼성전자주식회사 | Piezoelectric micro speaker |
| DE102010005654A1 (en) * | 2010-01-19 | 2011-07-21 | E.G.O. Elektro-Gerätebau GmbH, 75038 | Signaling device with an electrical acoustic signal generator |
| CN102271302B (en) * | 2011-06-30 | 2013-11-06 | 国光电器股份有限公司 | Piezoelectric loudspeaker |
| US8811636B2 (en) * | 2011-11-29 | 2014-08-19 | Qualcomm Mems Technologies, Inc. | Microspeaker with piezoelectric, metal and dielectric membrane |
| CN202488701U (en) * | 2012-01-11 | 2012-10-10 | 瑞声光电科技(常州)有限公司 | Piezoelectric device and loudspeaker |
| US9510103B2 (en) * | 2013-09-09 | 2016-11-29 | Audio Pixels Ltd. | Microelectromechanical apparatus for generating a physical effect |
| CN203675318U (en) * | 2013-11-20 | 2014-06-25 | 张家港市玉同电子科技有限公司 | Panel-type loudspeaker used for cell phone or tablet PC |
| DE102013114826A1 (en) | 2013-12-23 | 2015-06-25 | USound GmbH | Microelectromechanical sound transducer with sound energy-reflecting intermediate layer |
| CN204350297U (en) * | 2015-02-06 | 2015-05-20 | 歌尔声学股份有限公司 | Piezoelectric speaker |
| DE102015107557A1 (en) * | 2015-05-13 | 2016-11-17 | USound GmbH | Circuit board module with a continuous recess and related sound transducer arrangement and manufacturing method |
-
2015
- 2015-10-01 DE DE102015116707.7A patent/DE102015116707A1/en not_active Withdrawn
-
2016
- 2016-09-29 CA CA3000054A patent/CA3000054A1/en not_active Abandoned
- 2016-09-29 WO PCT/EP2016/073166 patent/WO2017055384A1/en active Application Filing
- 2016-09-29 KR KR1020187009776A patent/KR20180061219A/en not_active Application Discontinuation
- 2016-09-29 EP EP16774929.0A patent/EP3381202B1/en active Active
- 2016-09-29 CN CN201680057508.2A patent/CN108141673B/en active Active
- 2016-09-29 SG SG11201802576RA patent/SG11201802576RA/en unknown
- 2016-09-29 AU AU2016329109A patent/AU2016329109B2/en not_active Ceased
- 2016-09-29 MY MYPI2018701295A patent/MY183684A/en unknown
- 2016-09-29 US US15/761,943 patent/US10425741B2/en active Active
-
2018
- 2018-11-22 HK HK18114941.1A patent/HK1255865A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| AU2016329109B2 (en) | 2021-02-11 |
| KR20180061219A (en) | 2018-06-07 |
| CN108141673A (en) | 2018-06-08 |
| WO2017055384A1 (en) | 2017-04-06 |
| MY183684A (en) | 2021-03-08 |
| US10425741B2 (en) | 2019-09-24 |
| AU2016329109A1 (en) | 2018-04-26 |
| HK1255865A1 (en) | 2019-08-30 |
| CN108141673B (en) | 2020-06-26 |
| US20180279053A1 (en) | 2018-09-27 |
| EP3381202B1 (en) | 2021-12-29 |
| EP3381202A1 (en) | 2018-10-03 |
| CA3000054A1 (en) | 2017-04-06 |
| DE102015116707A1 (en) | 2017-04-06 |
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