EP3320694A1 - Mems circuit board module having an integrated piezoelectric structure, and electroacoustic transducer arrangement - Google Patents
Mems circuit board module having an integrated piezoelectric structure, and electroacoustic transducer arrangementInfo
- Publication number
- EP3320694A1 EP3320694A1 EP16760706.8A EP16760706A EP3320694A1 EP 3320694 A1 EP3320694 A1 EP 3320694A1 EP 16760706 A EP16760706 A EP 16760706A EP 3320694 A1 EP3320694 A1 EP 3320694A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- printed circuit
- membrane
- mems
- board module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012528 membrane Substances 0.000 claims abstract description 76
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 238000001228 spectrum Methods 0.000 claims abstract description 9
- 238000004873 anchoring Methods 0.000 claims description 14
- 230000008878 coupling Effects 0.000 claims description 11
- 238000010168 coupling process Methods 0.000 claims description 11
- 238000005859 coupling reaction Methods 0.000 claims description 11
- 239000002131 composite material Substances 0.000 claims description 10
- 239000000835 fiber Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims 1
- 230000010355 oscillation Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 105
- 239000000758 substrate Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 230000003014 reinforcing effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000012876 carrier material Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000003679 aging effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
- H04R7/06—Plane diaphragms comprising a plurality of sections or layers
- H04R7/10—Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
Definitions
- the present invention relates to a MEMS printed circuit board module for a sound transducer arrangement for generating and / or detecting surge waves in the audible wavelength spectrum with a printed circuit board and a multilayer piezoelectric structure by means of which a membrane provided for this purpose can be set into vibration and / or vibrations of a membrane can be detected. Furthermore, the invention relates to a sound transducer arrangement for generating and / or detecting sound waves in the audible wavelength spectrum with a membrane, a cavity and a MEMS printed circuit board module comprising a printed circuit board and a multilayer piezoelectric structure, by means of which the membrane vibratable and / or Vibrations of the membrane can be detected. In addition, the invention relates to a manufacturing method for a corresponding MEMS printed circuit board module and / or a corresponding sound transducer arrangement.
- MEMS microelectromechanical systems.
- cavity is to be understood as meaning a cavity by means of which the sound pressure of the MEMS-type random-wave transducer can be amplified
- Such systems are installed particularly in electronic devices which offer only little installation space but have to withstand high loads
- a MEMS transducer is known for generating and / or detecting sound waves in the audible wavelength spectrum with a carrier substrate, a cavity formed in the carrier substrate and a multi-layered piezoelectric membrane structure in such a MEMS acoustic transducer, the semiconductor becomes silicon as a material for carrier substrates
- this material is very expensive, which has a negative effect on the manufacturing costs of such MEMS sound transducers. It is therefore an object of the present invention to provide a MEMS printed circuit board module, a sound transducer arrangement and a manufacturing method, so that the production costs can be reduced.
- the object is achieved by a MEMS printed circuit board module, a sound transducer arrangement and a manufacturing method according to the independent patent claims.
- the MEMS board module includes a circuit board.
- the printed circuit board is preferably made of an electrically insulating material and preferably comprises at least one electrical conductive layer.
- the MEMS PCB module includes a structure.
- the structure is multilayered and piezoelectric. By means of this structure, a membrane provided for this purpose can be set in vibration. Alternatively or additionally, vibrations of the membrane can be detected by means of the piezoelectric structure.
- the structure thus acts as an actuator and / or sensor.
- the multilayer piezoelectric structure is directly connected to the printed circuit board. In this case, preferably at least one layer of the structure is formed by the conductive layer of the printed circuit board.
- the proposed MEMS circuit board module can be easily and inexpensively manufactured. In this way, it is also possible to embed electrical components directly into the printed circuit board and to connect them with the components provided for this purpose, such as the structure solely by means of simple plated-through holes.
- the proposed MEMS PCB module by the at least partially integrative formation of the structure in the circuit board very can be designed to save space, since additional components, in particular additional carrier substrates, can be saved.
- the use of a corresponding printed circuit board technology results in considerable cost savings, since the high cost factor of the expensive silicon for the carrier substrate is eliminated. Likewise, in this way, if required, even larger speakers can be produced inexpensively.
- the circuit board is designed as a structural support, in particular as a support frame, of the structure.
- the structure which preferably comprises at least one cantilever or cantilever, is thus deflectable relative to the printed circuit board along a lifting axis or z-axis.
- the structural support therefore serves as a base or support element for the structure which can be deflected relative thereto.
- the circuit board has a recess.
- the recess preferably extends completely through the printed circuit board.
- the structure is arranged frontally in the region of an opening of the recess.
- the structure is arranged inside the recess.
- the recess extends along the z-axis or lifting axis, in the direction of which the membrane provided for this purpose is able to oscillate. In this way, the recess at least partially forms a cavity of the sound transducer assembly.
- the MEMS printed circuit board module can thus be designed to save space, since additional components, in particular additional housing parts, for dimensioning the cavity can be made smaller or even completely saved.
- the volume of the cavity can be adjusted by increasing the size of the cut-out in the circuit board itself to the individual application, if a higher sound pressure is required.
- the recess may be closed by the circuit board itself or by a housing part.
- the cavity of the transducer assembly can be quickly, easily and inexpensively adapted to the particular application by means of the recess.
- the structure is fixedly connected to the printed circuit board in an anchoring area facing the printed circuit board, in particular by means of lamination.
- the structure is embedded in the printed circuit board and / or laminated in its anchoring area. The structure can thus be inexpensively integrated during the manufacturing process of the circuit board in this.
- the structure is an actuator structure.
- the actuator structure is preferably formed from at least one piezoelectric layer. If the acoustic transducer arrangement for which the MEMS printed circuit board module is provided, for example as a loudspeaker, the actuator structure can be excited in such a way that a membrane intended for generating sound energy is caused to vibrate. On the other hand, if the sound transducer arrangement functions as a microphone, the vibrations are converted by the actuator structure into electrical signals.
- the actuator structure can thus be individually and inexpensively adapted to different requirements, in particular via an application-specific integrated circuit (ASIC).
- ASIC application-specific integrated circuit
- the structure is a sensor structure.
- the sensor structure preferably forms a position sensor, by means of which the deflection of a membrane provided for this purpose can be detected and evaluated. Based on the evaluation, the actuator structure can be controlled in a regulated manner so that the membrane is is deflected. External influences and aging effects can be compensated in this way.
- the structure comprises at least one supporting layer of metal, in particular of copper.
- the support layer preferably has a thickness of 1 to 50 ⁇ . Due to the electrically conductive base layer, the electronic components of the MEMS board module can be interconnected. By using the very fine support layer, the structure is very compact.
- the printed circuit board is a multilayer fiber composite component.
- the printed circuit board has several layers of electrically insulating material. Between the insulating layers, electrical conductive layers of copper are arranged, which can be interconnected by means of through-contacts. Since the structure is directly connected to the printed circuit board, the connections necessary for the functioning of the MEMS printed circuit board module can be realized in a cost-effective and space-saving manner by a printed circuit board designed in this way.
- the printed circuit board is a laminated fiber composite component.
- a printed circuit board is formed, the individual layers are connected to each other so stable that the functioning of the system is guaranteed even with shocks or other external influences.
- the printed circuit board has at least one electrical conductive layer made of metal.
- the electrical conductive layer forms the base layer of the structure.
- the structure has at least one piezoelectric layer, which is preferably electrically coupled to the supporting layer. The mechanical movement of the structure necessary for the deflection of the membrane can thus be easily realized since the electrical voltage of the support layer can be used directly by the piezo layer without additional contacts. Likewise, an electrical voltage can be generated by the deflection of the membrane and thus the sound waves can be detected.
- the piezoelectric layer is advantageously electrically decoupled from the carrier layer. The decoupling is carried out by an arranged between the piezoelectric layer and the supporting layer insulating layer.
- the multilayer structure has two piezoelectric layers. These are preferably each arranged between two electrode layers. In this case, one, in particular four electrode layers, may be formed by the carrier layer.
- the support layer is preferably made of a metal, in particular copper. If the structure has multiple piezoelectric layers, the structure can generate more force and cause greater deflection. In this regard, it is further advantageous if the structure has more than two piezoelectric layers.
- a piezoelectric layer of the structure is designed as a sensor and another piezoelectric layer as an actuator.
- a piezoelectric layer may also comprise a plurality of separate regions, one of which is formed as a sensor and another region as an actuator.
- the piezoelectric layer is preferably arranged between two electrode layers.
- the support layer forms one of these two electrode layers.
- the structure has a central region, to which a coupling element is attached.
- the coupling element and the printed circuit board are preferably made of the same material, in particular a fiber composite material.
- the coupling element can be connected to the membrane provided for this purpose so that it can be deflected as a result of a lifting movement of the structure in the z-direction or along the lifting axis.
- the structure has an actuator sensor area.
- This area is in each case arranged between the anchoring area and the central area.
- the actuator / sensor area is connected to the central area via at least one flexible connecting element.
- the voltage generated via the piezoelectric effect can be detected by the sensor system and provided for evaluation, so that the actual position of the membrane can be determined in a simple manner.
- the actuator vSensor region allows different geometries to be formed to efficiently control different regions and modes of vibration. By integrated into the circuit board structure and the actuator / sensor area, the performance and sound quality of the transducer assembly can be increased without additional space requirements.
- An ASIC is advantageously completely encapsulated embedded in the circuit board.
- additional electrical components are completely encapsulated embedded in the circuit board.
- the functionality of the transducer assembly can be made without additional carrier material.
- the ASIC or the additional electrical components can be integrated into the printed circuit board in the manufacturing process and connected to the associated components by means of plated-through holes.
- circuit board has at least one external contact for electrical connection to an external device having.
- the external contact is arranged freely accessible on an outer side of the printed circuit board module.
- the acoustic transducer assembly comprises a diaphragm, a cavity and a MEMS printed circuit board module.
- the MEMS circuit board module comprises a multilayer piezoelectric structure. By means of the piezoelectric structure, the membrane is set into vibration. Alternatively or additionally, vibrations of the membrane can be detected by means of the structure.
- the MEMS printed circuit board module is formed according to the preceding description, wherein said features may be present individually or in any combination.
- the transducer assembly By integrated into the circuit board structure, the transducer assembly can be produced inexpensively.
- the structure, in particular its support layer, can be easily embedded in the printed circuit board during the layered production and connected to the required electronic components. As a result, different types of circuit board can be realized in a simple manner.
- the membrane is connected directly in its edge region with the circuit board.
- the sound transducer arrangement comprises a membrane module.
- the membrane module has the membrane and a membrane frame.
- the membrane frame holds the membrane in its edge area.
- the membrane module is connected via the membrane frame to the MEMS printed circuit board module.
- the modular construction of the sound transducer arrangement makes it possible to independently test the individual modules, in particular the MEMS printed circuit board module and the membrane module, prior to assembly for its functionality. Faulty modules can be affected by the The inventive sound transducer assembly can be identified early, so that the number of defective systems can be reduced in this way.
- the cavity is at least partially formed by a recess of the circuit board.
- the cavity is formed by a housing part, in particular made of metal or plastic.
- the housing part is preferably at the
- the cavity can be quickly, easily and inexpensively adapted to the particular application without having to change the circuit board.
- the membrane advantageously has a, in particular multi-layer, reinforcing element.
- the reinforcing element By the reinforcing element, the sensitive membrane is protected from damage caused by excessive movement of the membrane due to excessive sound pressure or external shock or shock.
- the membrane is connected in an inner connection region with a coupling element of the MEMS printed circuit board module. Through the structure, a lifting movement can be generated, by means of which the membrane is deflectable.
- a manufacturing method for a MEMS printed circuit board module and / or a sound transducer arrangement is also proposed.
- the MEMS circuit board module and the sound transducer assembly are formed according to the foregoing description, wherein said features may be present individually or in any combination.
- a multilayer printed circuit board is produced.
- at least one metallic conductive layer and a plurality of printed circuit board carrier layers are interconnected by lamination.
- the printed circuit board carrier layers are in particular made of fiber composite material.
- a multilayer piezoelectric structure is formed and connected to the circuit board in an anchoring area facing the circuit board directly and firmly connected by lamination. A piezoelectric layer of the structure is thus laminated into the multilayer printed circuit board, in particular directly on the conductive layer.
- the layered structure of printed circuit boards made of copper foils and printed circuit board carrier layers, in particular carrier material, can thus be easily and inexpensively connected to the production of the structure.
- all necessary for functionality, embedded in the circuit board components can be easily contacted with each other.
- only the individual conductive layers must be connected by means of plated-through holes by the manufacturing method according to the invention.
- the PCB geometry can be inexpensively adapted to individual applications.
- FIG. 1 shows a MEMS printed circuit board module in a sectional view
- FIG. 2 shows a detailed detail of the MEMS printed circuit board module shown in FIG. 1 in the connection region between a piezoelectric structure and a printed circuit board,
- FIG. 3 shows a further exemplary embodiment of the MEMS printed circuit board module in a detail section
- FIG. 4 shows a schematic detail view of a piezoelectric structure
- FIG. 5 shows a second embodiment of a piezoelectric structure in a schematic detail view
- FIG. 6 shows a sound transducer arrangement in a sectional view
- FIG. 7 shows a second exemplary embodiment of a sound transducer arrangement in a sectional view
- FIG. 8 shows a third exemplary embodiment of a piezoelectric structure with an actuator / sensor region in a plan view.
- FIG. 1 shows a MEMS printed circuit board module 1 in a sectional view.
- the MEMS printed circuit board module 1 is provided for a sound transducer arrangement 2 (see Figures 6 and 7) for generating and / or detecting sound waves in the audible wavelength spectrum.
- the MEMS printed circuit board module 1 essentially comprises a printed circuit board 4 and a multilayer, in particular piezoelectric, structure 5.
- the printed circuit board 4 is a multilayer composite fiber component with at least one electrical conductive layer 8 made of metal.
- the printed circuit board 4 comprises an ASIC 27 and / or passive electronic additional components 28 which are completely integrated in the printed circuit board 4.
- the ASIC 27 and / or the passive electronic additional components 28 are thus completely encapsulated by the printed circuit board 4.
- the printed circuit board 4 has a recess 17 with a first opening 18 and a second opening 19 opposite the first opening 18.
- the recess 17 thus extends completely through the printed circuit board 4. It is a continuous hole, so that the circuit board 4 is designed as a circumferentially closed frame, in particular as a support frame 15.
- this support frame 15 in addition to the ASIC 27, the additional components 28 and the structure 5, in particular in an anchoring region 21, integrated.
- the structure 5 is connected directly to the circuit board 4 inside the recess 17.
- the circuit board 4 accordingly forms a structural support, which carries the structure 5 and with respect to which the structure 5 can be deflected.
- the piezoelectric structure 5 has a support layer 7 and a piezoelectric functional region 9. In its outer area, the structure 5 has the anchoring area 21. In this the printed circuit board 4 facing anchoring region 21, the structure 5 is fixed to the circuit board 4, in particular the conductive layer 8, respectively.
- the conductive layer 8 essentially forms the base layer 7 of the structure 5, which is integrated in the printed circuit board 4 in this way.
- the structure 5 has a central region 22, which is arranged substantially centrally in the interior of the recess 17.
- the structure 5 is connected in this central region 21 via at least one flexible connecting element 26 with a coupling element 23.
- the coupling element 23 and the printed circuit board 4 are preferably made of the same material, in particular a fiber composite material.
- the recess 17 at least partially forms a cavity 20 of the sound transducer arrangement 2, which is completely shown in FIGS. 6 and 7.
- the circuit board 4 also has an external contact 29 for electrical connection to an external device, not shown here.
- FIG. 2 shows a detail of the MEMS printed circuit board module 1 according to FIG. 1 in cross section, in particular in the connection region between the printed circuit board 4 and the structure 5.
- the multilayer printed circuit board 4 is a laminated fiber composite component which has at least a first conductive layer 8 and a second conductive layer 34.
- the two conductive layers 8, 34 are electrically decoupled from each other by printed circuit board carrier layers 14.
- the structure 5 is connected to the circuit board 4 in its anchoring area 21.
- the first conductive layer 8 of the printed circuit board 4 forms the base layer 7 of the structure 5.
- the piezoelectric functional region 9 (see Figures 4 and 5) is supported by the support layer 7.
- the support layer 7 is laminated in the circuit board 4 and thus verbuden with this directly.
- the functional area 9 is firmly connected to the printed circuit board 4 via the supporting layer 7.
- the functional layer 9 can be laminated on the support layer 7.
- FIG. 3 shows a further embodiment of the MEMS printed circuit board module 1, the following essentially addressing the differences with respect to the already described embodiment.
- the same reference numerals are used in the following description of the other embodiments for the same features. So- far these are not explained again in detail, their design and mode of action corresponds to the features already described above. The differences described below can be combined with the features of the respective preceding and following embodiments.
- FIG. 3 shows the MEMS printed circuit board module 1 in a detail section, the structure 5 not being arranged inside the recess 17 but in the region of the first opening 18.
- the first conductive layer 8 is connected directly to the base layer 7. It would also be conceivable to connect the structure 5 in the region of the second opening 19 with the printed circuit board 4.
- the functional region 9 is at least partially embedded in the printed circuit board 4 and is supported by the carrier layer 7 in the region of the first opening 18.
- the circuit board 4 accordingly forms a structural support, which carries the structure 5 and with respect to which the structure 5 can be deflected.
- the second conductive layer 34 is connected to the ASIC 27.
- the ASIC 27 represents an encapsulated control, which is electrically connected to the second conductive layer 34.
- the ASIC 27 is encapsulated in a cavity of the circuit board 4.
- the ASIC 27 may also be coated or cast with synthetic resin.
- the additional electrical component 28 may be coupled to one of the conductive layers 8, 34.
- FIG. 4 shows a detailed view of the piezoelectric structure 5.
- the structure 5 has the carrier layer 7 as well as the functional region 9.
- the functional area 9 comprises a piezoelectric layer 10, which preferably consists of lead zirconate titanate (PZT) and / or aluminum nitride (ALN).
- PZT lead zirconate titanate
- APN aluminum nitride
- the piezoelectric layer 10 is embedded between an upper electrode layer 12 and a lower electrode layer 13.
- the carrying Layer 7 of the printed circuit board 4 forms the lower electrode layer 13, wherein the structure 5 is embedded or integrated directly into the printed circuit board 4 via this.
- FIG. 5 shows a further embodiment of the structure 5.
- this exemplary embodiment has a piezo layer 10, which is sandwiched between two electrode layers 12, 13.
- This layer combination represents the basis for the embodiment described below.
- the same reference numerals are used for the same features in comparison to the embodiment shown in Figure 4. If these are not explained again, their design and mode of action corresponds to the features already described above.
- the structure 5 has, in addition to the two electrode layers 12, 13 and the piezo layer 10, an insulating layer 11, which is formed in particular from silicon oxide.
- the lower electrode layer 13 is not formed in this embodiment by the support layer 7 of the circuit board 4 itself, but by an additional layer in the functional area 9. Through the insulating layer 1 1, the lower electrode layer 13 is electrically decoupled from the support layer 7.
- FIG. 6 shows a first embodiment of the sound transducer arrangement 2 in a sectional view.
- the sound transducer assembly 2 comprises the MEMS printed circuit board module 1, the membrane 6 and the membrane frame 16.
- the membrane 6 is accommodated in the z-direction or along the lifting axis swingably from the membrane frame 1 6.
- the membrane 6 and the membrane frame 1 6 essentially form a membrane module 3.
- the printed circuit board 4 is connected in its outer frame region with an outer connection region 33 of the membrane module 3, in particular with the membrane frame 1 6.
- the membrane 6 thus spans the membrane frame 1 6 and is stiffened in its central region.
- the recess 17 at least partially forms a cavity 20 of the acoustic transducer assembly 2.
- the cavity 20 is closed by a housing part 30 on the side of the MEMS printed circuit board module 1 facing away from the membrane frame 16.
- the housing part 30 is formed of metal or plastic and has a housing cavity 35, which forms the cavity 20 in addition to the recess 17.
- the size of the housing cavity 35 can be selected depending on the sound pressure to be generated.
- the structure 5 is arranged below the membrane 6 and / or substantially parallel to it.
- the base layer 7 of the structure 5 is directly connected to one of the conductive layers 8, 34 of the printed circuit board 4 and deflected relative thereto in the z-direction.
- the piezoelectric layer 10 is designed to produce a unidirectional or bidirectional lifting movement of the structure 5 for the deflection of the membrane 6.
- the piezoelectric layer 10 thus cooperates with the membrane 6 in order to convert electrical signals into acoustically perceptible sound waves. Alternatively, the acoustically perceptible sound waves can be converted into electrical signals.
- the structure 5 is connected via not shown in the figures contacts with the ASIC 27.
- the sound transducer assembly 2 can thus be controlled or operated via the ASIC 27, so that for example by the piezoelectric structure 5, the membrane 6 for generating sound energy relative to the membrane frame 1 6 can be set in vibration.
- FIG. 7 shows a further embodiment of the sound transducer arrangement 2, the following essentially addressing the differences with respect to the already described embodiment.
- the further embodiments for the same the same reference numerals used. Unless these are explained again in detail, their design and mode of action corresponds to the features already described above. The differences described below can be combined with the features of the respective preceding and following embodiments.
- a reinforcing element 31 is arranged, which itself is not connected to the membrane frame 16.
- the reinforcing element 31 can thus oscillate together with the membrane 6 with respect to the membrane frame 1 6 in the z direction.
- the inner connecting portion 32 of the diaphragm 6 is stiffened in this way.
- the membrane frame 16 is formed in this embodiment of the circuit board 4 itself and consequently of the same material. The membrane frame 1 6 and the circuit board 4 are thus integrally formed.
- the sound transducer arrangement 2 does not have any separate housing parts 30.
- the cavity 20 is here formed and closed by the circuit board 4 itself.
- Figure 8 shows a third embodiment of a structure 5 in a plan view.
- the structure 5, which is designed in particular as a cantilever arm, has at least one actuator region 24 and a sensor region 25.
- the actuator V sensor region 24, 25 is arranged between the anchoring region 21 and the central region 22.
- the connection to the central region 22 is effected via at least one flexible connecting element 26.
- the sensor region 25 is preferably designed as a position sensor in order to provide the ASIC 27 with a sensor signal dependent on the diaphragm deflection.
- the elastic vibration properties of the connecting element 26 are taken into account.
- the over the piezoelectric The effect generated voltage, which is approximately proportional to the deflection of the structure 5, is tapped and evaluated via the electrode layers 12, 13 (compare FIGS. 4 and 5). Based on the control signal, the structure 5 can be controlled by the ASIC 27.
- the sensor region 25 and the actuator region 24 are formed by a common piezoelectric layer 10.
- at least one region is a sensor region 25, by means of which two actuator regions 24 are spaced apart from one another.
- the actuator regions 24 are electrically isolated from each other.
- the two regions 24, 25 may be formed from mutually different material, in particular from lead zirconate titanate or aluminum nitride.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Micromachines (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015116640.2A DE102015116640B4 (en) | 2015-10-01 | 2015-10-01 | MEMS circuit board module with integrated piezoelectric structure and transducer arrangement |
PCT/EP2016/070796 WO2017055012A1 (en) | 2015-10-01 | 2016-09-05 | Mems circuit board module having an integrated piezoelectric structure, and electroacoustic transducer arrangement |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3320694A1 true EP3320694A1 (en) | 2018-05-16 |
EP3320694B1 EP3320694B1 (en) | 2019-11-13 |
Family
ID=56877029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16760706.8A Active EP3320694B1 (en) | 2015-10-01 | 2016-09-05 | Mems circuit board module having an integrated piezoelectric structure, and electroacoustic transducer arrangement |
Country Status (10)
Country | Link |
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US (1) | US10433063B2 (en) |
EP (1) | EP3320694B1 (en) |
KR (1) | KR20180061187A (en) |
CN (1) | CN108141669B (en) |
AU (1) | AU2016332481B2 (en) |
CA (1) | CA2997567A1 (en) |
DE (1) | DE102015116640B4 (en) |
HK (1) | HK1250192A1 (en) |
SG (2) | SG10202002939QA (en) |
WO (1) | WO2017055012A1 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015116640B4 (en) * | 2015-10-01 | 2024-09-05 | USound GmbH | MEMS circuit board module with integrated piezoelectric structure and transducer arrangement |
DE102017114142A1 (en) * | 2017-06-26 | 2018-12-27 | USound GmbH | Sound transducer arrangement with a MEMS unit |
DE102017125117A1 (en) | 2017-10-26 | 2019-05-02 | USound GmbH | Transducer array |
CN110085735B (en) * | 2018-01-26 | 2024-08-02 | 安徽奥飞声学科技有限公司 | MEMS piezoelectric loudspeaker and preparation method thereof |
WO2019144370A1 (en) * | 2018-01-26 | 2019-08-01 | 刘端 | Mems piezoelectric speaker and preparation method therefor |
DE102018203812A1 (en) | 2018-03-13 | 2019-09-19 | Christian-Albrechts-Universität Zu Kiel | FERROELECTRIC MATERIAL, MEMS COMPONENT WITH A FERROELECTRIC MATERIAL, MEMS DEVICE WITH A FIRST MEMS COMPONENT, METHOD FOR PRODUCING A MEMS COMPONENT, AND METHOD FOR PRODUCING A CMOS COMPATIBLE MEMS COMPONENT |
TWI707586B (en) * | 2018-08-14 | 2020-10-11 | 美律實業股份有限公司 | Mems speaker |
EP3620756B1 (en) * | 2018-09-10 | 2021-07-14 | Deutsches Institut für Lebensmitteltechnik e.V. | Pressure-resistant housing with electricity feed-through |
TWI683460B (en) * | 2018-11-30 | 2020-01-21 | 美律實業股份有限公司 | Speaker structure |
CN110856085B (en) * | 2018-11-30 | 2021-07-09 | 美律电子(深圳)有限公司 | Loudspeaker structure |
DE102019101325A1 (en) * | 2019-01-17 | 2020-07-23 | USound GmbH | Manufacturing process for multiple MEMS transducers |
CN110290449A (en) * | 2019-05-09 | 2019-09-27 | 安徽奥飞声学科技有限公司 | A kind of audio devices and electronic equipment |
DE102019116080A1 (en) * | 2019-06-13 | 2020-12-17 | USound GmbH | MEMS sound transducer with a membrane made of polymer |
DE102020200771B4 (en) | 2020-01-23 | 2023-03-30 | Vitesco Technologies Germany Gmbh | Fluid sensor device for detecting the filling level and/or the quality of a fluid and method for producing the same |
IT202000010261A1 (en) | 2020-05-07 | 2021-11-07 | St Microelectronics Srl | PIEZOELECTRIC ACTUATOR EQUIPPED WITH A DEFORMABLE STRUCTURE HAVING IMPROVED MECHANICAL PROPERTIES AND RELATED MANUFACTURING PROCEDURE |
IT202000010264A1 (en) * | 2020-05-07 | 2021-11-07 | St Microelectronics Srl | PIEZOELECTRIC ACTUATOR HAVING A DEFORMATION SENSOR AND RELATED MANUFACTURING PROCEDURE |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2848036B1 (en) * | 2002-11-28 | 2005-08-26 | St Microelectronics Sa | SUPPORT FOR ACOUSTIC RESONATOR, ACOUSTIC RESONATOR AND CORRESPONDING INTEGRATED CIRCUIT |
US8120232B2 (en) * | 2009-01-20 | 2012-02-21 | Palo Alto Research Center Incorporated | Sensors and actuators using piezo polymer layers |
KR101609270B1 (en) * | 2009-08-12 | 2016-04-06 | 삼성전자주식회사 | Piezoelectric micro speaker and method of manufacturing the same |
KR101573517B1 (en) * | 2009-10-12 | 2015-12-02 | 삼성전자주식회사 | Piezoelectric micro speaker |
DE102010005654A1 (en) * | 2010-01-19 | 2011-07-21 | E.G.O. Elektro-Gerätebau GmbH, 75038 | Signaling device with an electrical acoustic signal generator |
CN102075836B (en) * | 2011-01-18 | 2012-11-21 | 张家港市玉同电子科技有限公司 | Single-diaphragm piezoelectric ceramic loudspeaker |
US9106994B2 (en) * | 2013-03-14 | 2015-08-11 | Abatech Electronics Co., Ltd. | Ultra-slim speaker structure |
US9596756B2 (en) * | 2013-09-06 | 2017-03-14 | Apple Inc. | Electronic device with printed circuit board noise reduction using elastomeric damming and damping structures |
CN203722817U (en) * | 2013-11-20 | 2014-07-16 | 张家港市玉同电子科技有限公司 | Monocrystalline piezoelectric-ceramic sounder structure for mobile phone and tablet PC |
DE102013114826A1 (en) | 2013-12-23 | 2015-06-25 | USound GmbH | Microelectromechanical sound transducer with sound energy-reflecting intermediate layer |
US9309105B2 (en) | 2014-03-06 | 2016-04-12 | Infineon Technologies Ag | Sensor structure for sensing pressure waves and ambient pressure |
DE102014106753B4 (en) | 2014-05-14 | 2022-08-11 | USound GmbH | MEMS loudspeaker with actuator structure and diaphragm spaced therefrom |
DE102015116640B4 (en) * | 2015-10-01 | 2024-09-05 | USound GmbH | MEMS circuit board module with integrated piezoelectric structure and transducer arrangement |
-
2015
- 2015-10-01 DE DE102015116640.2A patent/DE102015116640B4/en active Active
-
2016
- 2016-09-05 AU AU2016332481A patent/AU2016332481B2/en not_active Ceased
- 2016-09-05 KR KR1020187008583A patent/KR20180061187A/en not_active Application Discontinuation
- 2016-09-05 CN CN201680057170.0A patent/CN108141669B/en active Active
- 2016-09-05 WO PCT/EP2016/070796 patent/WO2017055012A1/en active Application Filing
- 2016-09-05 SG SG10202002939QA patent/SG10202002939QA/en unknown
- 2016-09-05 EP EP16760706.8A patent/EP3320694B1/en active Active
- 2016-09-05 CA CA2997567A patent/CA2997567A1/en not_active Abandoned
- 2016-09-05 US US15/758,070 patent/US10433063B2/en active Active
- 2016-09-05 SG SG11201802051UA patent/SG11201802051UA/en unknown
-
2018
- 2018-07-20 HK HK18109454.0A patent/HK1250192A1/en unknown
Also Published As
Publication number | Publication date |
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AU2016332481B2 (en) | 2020-07-16 |
SG11201802051UA (en) | 2018-04-27 |
US20180249252A1 (en) | 2018-08-30 |
CA2997567A1 (en) | 2017-04-06 |
AU2016332481A1 (en) | 2018-04-12 |
KR20180061187A (en) | 2018-06-07 |
SG10202002939QA (en) | 2020-05-28 |
CN108141669B (en) | 2021-01-22 |
CN108141669A (en) | 2018-06-08 |
HK1250192A1 (en) | 2018-11-30 |
EP3320694B1 (en) | 2019-11-13 |
DE102015116640A1 (en) | 2017-04-06 |
DE102015116640B4 (en) | 2024-09-05 |
WO2017055012A1 (en) | 2017-04-06 |
US10433063B2 (en) | 2019-10-01 |
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