HK1247033A2 - A device and a method combining laser cutting and electromagnetic welding for parts manufacturing - Google Patents

A device and a method combining laser cutting and electromagnetic welding for parts manufacturing

Info

Publication number
HK1247033A2
HK1247033A2 HK18105044A HK18105044A HK1247033A2 HK 1247033 A2 HK1247033 A2 HK 1247033A2 HK 18105044 A HK18105044 A HK 18105044A HK 18105044 A HK18105044 A HK 18105044A HK 1247033 A2 HK1247033 A2 HK 1247033A2
Authority
HK
Hong Kong
Prior art keywords
welding
raw material
recycling
cutting platform
laser
Prior art date
Application number
HK18105044A
Other languages
Chinese (zh)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of HK1247033A2 publication Critical patent/HK1247033A2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K28/00—Welding or cutting not covered by any of the preceding groups, e.g. electrolytic welding
    • B23K28/02—Combined welding or cutting procedures or apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor

Abstract

本發明公開了一種結合激光切割和電磁焊接的零件製造設備及方法，包括激光切割系統，原材料傳送回收系統（4），運輸系統，電磁焊接系統以及控制系統（1）；激光切割系統包括激光器（2）和切割平臺（5），激光器（2）位於切割平臺（5）正上方；原材料傳送回收系統（4）包括原料卷和回收卷，原料卷與回收卷分別位於切割平臺（5）的兩側，金屬料帶（3）穿過切割平臺（5）由回收卷帶動金屬料帶（3）在切割平臺（5）上前移；運輸系統包括三軸軌道（9）和吸盤組件（8），吸盤組件（8）可自由的在三軸軌道（9）上運動；電磁焊接系統包括電磁線圈裝置（10）和焊接工作臺（11）；電磁線圈裝置（10）可自由的在三軸軌道（9）運動，焊接工作臺（11）為升降臺隨焊接層的增加而逐漸下降。本發明可以縮減成本，縮短加工時長；且對各種尺寸範圍的零件均有良好的適用性。The invention discloses a part manufacturing equipment and method combining laser cutting and electromagnetic welding, including a laser cutting system, a raw material conveying and recycling system (4), a transportation system, an electromagnetic welding system and a control system (1); the laser cutting system includes a laser ( 2) and the cutting platform (5), the laser (2) is located directly above the cutting platform (5); the raw material conveying and recycling system (4) includes the raw material roll and the recycling roll, and the raw material roll and the recycling roll are located on the two sides of the cutting platform (5) On the side, the metal strip (3) passes through the cutting platform (5) and the recycling roll drives the metal strip (3) forward on the cutting platform (5); the transportation system includes a three-axis track (9) and a suction cup assembly (8) , The chuck assembly (8) can move freely on the three-axis track (9); the electromagnetic welding system includes the electromagnetic coil device (10) and the welding table (11); the electromagnetic coil device (10) can move freely on the three-axis track (9) Movement, the welding table (11) is a lifting table that gradually decreases with the increase of the welding layer. The invention can reduce the cost and shorten the processing time; and has good applicability to parts in various size ranges.

HK18105044A 2018-02-11 2018-04-18 A device and a method combining laser cutting and electromagnetic welding for parts manufacturing HK1247033A2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810141402.1A CN108188606B (en) 2018-02-11 2018-02-11 Part manufacturing equipment and method combining laser cutting and electromagnetic welding

Publications (1)

Publication Number Publication Date
HK1247033A2 true HK1247033A2 (en) 2018-09-14

Family

ID=62593664

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18105044A HK1247033A2 (en) 2018-02-11 2018-04-18 A device and a method combining laser cutting and electromagnetic welding for parts manufacturing

Country Status (2)

Country Link
CN (1) CN108188606B (en)
HK (1) HK1247033A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109822236B (en) * 2019-04-04 2023-11-28 中国工程物理研究院机械制造工艺研究所 Device for cutting and welding pipeline
CN112975192B (en) * 2021-04-30 2021-09-17 国网甘肃省电力公司电力科学研究院 Automatic welding equipment for electric iron accessories
CN113275733B (en) * 2021-06-22 2022-06-24 南昌航空大学 Electromagnetic pulse material increasing device and method for aviation multi-runner pipe fitting
CN113399808B (en) * 2021-06-22 2022-07-19 南昌航空大学 Electromagnetic pulse material increasing device and method for aerospace thin-wall ring piece

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2793715B1 (en) * 1999-05-21 2001-07-13 Renault METHOD FOR JOINING BY WELDING PLATES WITH DIFFERENT MELTING TEMPERATURES AND TOOL FOR SUCH ASSEMBLY
JP2007015018A (en) * 2005-06-08 2007-01-25 Asahi Kasei Chemicals Corp Magnesium composite material and its manufacturing method
CN101480753B (en) * 2009-01-14 2011-01-05 深圳大学 Rapid shaping method for manufacturing metal laminated solid mass
CN203209918U (en) * 2013-05-09 2013-09-25 南京铁道职业技术学院 Laminated solid manufacturing device used for directly forming metal parts
CN103737176B (en) * 2013-12-30 2016-08-31 华中科技大学 A kind of laser and electromagnetic pulse complex welding method and equipment
CN105252145B (en) * 2015-10-19 2017-10-20 华南理工大学 A kind of method and apparatus of sheet metal superposition manufacture complicated shape part
CN106181016A (en) * 2016-07-29 2016-12-07 西安交通大学 The electromagnetic pulse of bimetallic stratiform composite board soldering joint drives welding system and method
CN207952980U (en) * 2018-02-11 2018-10-12 香港生产力促进局 A kind of part manufacturing equipment of combination laser cutting and electromagnetism welding

Also Published As

Publication number Publication date
CN108188606A (en) 2018-06-22
CN108188606B (en) 2020-06-02

Similar Documents

Publication Publication Date Title
HK1247033A2 (en) A device and a method combining laser cutting and electromagnetic welding for parts manufacturing
TW200733259A (en) Film bonding method, film bonding apparatus, and semiconductor device manufacturing method
TW200739785A (en) Object conveyance apparatus, exposure apparatus, object temperature regulation apparatus, object conveyance method, and method of producing microdevice
MX2017004356A (en) Perception-based robotic manipulation system and method for automated truck unloader that unloads/unpacks product from trailers and containers.
ATE460247T1 (en) LASER PROCESSING METHOD AND APPARATUS
MXPA05010961A (en) Apparatus and method for mechanically bonding and cutting an article.
WO2014202415A3 (en) Device and method for additively producing at least one component region of a component
MX2018000991A (en) Device for cutting sheet metal plates out of a sheet metal strip.
EP4234244A3 (en) Airflow control for additive manufacturing
NZ721141A (en) Device and method for manufacturing welded shaped steel
MX2016003779A (en) Device and method for guiding metal strips having wear bodies.
SG11202113102PA (en) Laser source and method for forming the same
SA520420331B1 (en) Device and method for guiding metal strips, comprising grinding bodies with support element
TW200719431A (en) Making method for semiconductor device and semiconductor device the same
JP2015153837A5 (en)
MX2019006085A (en) Weakening apparatus and method for weakening packaging materials.
EP4001373A4 (en) Bonding film, tape for wafer processing, method for producing bonded object, and bonded object and pasted object
EP4024627A4 (en) Semiconductor laser drive device, electronic apparatus, and method for manufacturing semiconductor laser drive device
MY181556A (en) Coated product manufacturing method and manufacturing device
JP2015016983A5 (en)
JP2019119094A5 (en)
SG10201708699QA (en) Method of Forming Three-Dimensional Wire Loops and Wire Loops Formed Using the Method
MY195655A (en) Joining Device and Method for Joining Strips to Form a Tire Component
JP2015193503A5 (en)
MX2021000962A (en) Abrasive article and method for forming.

Legal Events

Date Code Title Description
PF2 Short-term patent ceased to have effect under s.126(2) (not payment of maintenance fee and has 6-month grace period to pay)

Effective date: 20220418