HK1224275A1 - 用於微電子機械設備的薄覆蓋 - Google Patents

用於微電子機械設備的薄覆蓋

Info

Publication number
HK1224275A1
HK1224275A1 HK16112582.1A HK16112582A HK1224275A1 HK 1224275 A1 HK1224275 A1 HK 1224275A1 HK 16112582 A HK16112582 A HK 16112582A HK 1224275 A1 HK1224275 A1 HK 1224275A1
Authority
HK
Hong Kong
Prior art keywords
mems devices
thin capping
capping
thin
mems
Prior art date
Application number
HK16112582.1A
Other languages
English (en)
Inventor
Edvard Klvesten
Thorbjrn Ebefors
Niklas Svedin
Original Assignee
Silex Microsystems Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silex Microsystems Ab filed Critical Silex Microsystems Ab
Publication of HK1224275A1 publication Critical patent/HK1224275A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00095—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/01—Switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0271—Resonators; ultrasonic resonators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0118—Cantilevers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/094—Feed-through, via
    • B81B2207/095—Feed-through, via through the lid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0147—Film patterning
    • B81C2201/015—Imprinting
    • B81C2201/0153—Imprinting techniques not provided for in B81C2201/0152
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/03—Processes for manufacturing substrate-free structures
    • B81C2201/036—Hot embossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0145—Hermetically sealing an opening in the lid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Micromachines (AREA)
HK16112582.1A 2013-08-26 2016-11-02 用於微電子機械設備的薄覆蓋 HK1224275A1 (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE1350972 2013-08-26
SE1350980 2013-08-27
PCT/SE2014/050973 WO2015030657A1 (en) 2013-08-26 2014-08-26 Thin capping for mems devices

Publications (1)

Publication Number Publication Date
HK1224275A1 true HK1224275A1 (zh) 2017-08-18

Family

ID=52587047

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16112582.1A HK1224275A1 (zh) 2013-08-26 2016-11-02 用於微電子機械設備的薄覆蓋

Country Status (6)

Country Link
US (1) US9718674B2 (zh)
EP (1) EP3038974B1 (zh)
CN (1) CN105916801B (zh)
HK (1) HK1224275A1 (zh)
SE (1) SE538311C2 (zh)
WO (1) WO2015030657A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107924881B (zh) * 2015-08-18 2020-07-31 三菱电机株式会社 半导体装置
DE102016200497A1 (de) * 2016-01-15 2017-07-20 Robert Bosch Gmbh Verfahren zum Herstellen eines mikromechanischen Bauelements
DE102017223372A1 (de) * 2017-12-20 2019-06-27 Robert Bosch Gmbh Laserbondverfahren und mikromechanische Vorrichtung mit Laserbondverbindung
CN114388366B (zh) * 2022-03-22 2022-05-31 湖北江城芯片中试服务有限公司 封装壳体的制备方法及封装芯片的制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7416961B2 (en) * 2001-03-14 2008-08-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for structuring a flat substrate consisting of a glass-type material
US20040016995A1 (en) 2002-07-25 2004-01-29 Kuo Shun Meen MEMS control chip integration
US20040259325A1 (en) 2003-06-19 2004-12-23 Qing Gan Wafer level chip scale hermetic package
US7230512B1 (en) * 2003-08-19 2007-06-12 Triquint, Inc. Wafer-level surface acoustic wave filter package with temperature-compensating characteristics
KR100594716B1 (ko) 2004-07-27 2006-06-30 삼성전자주식회사 공동부를 구비한 캡 웨이퍼, 이를 이용한 반도체 칩, 및그 제조방법
US7204737B2 (en) * 2004-09-23 2007-04-17 Temic Automotive Of North America, Inc. Hermetically sealed microdevice with getter shield
KR100599088B1 (ko) * 2005-06-20 2006-07-12 삼성전자주식회사 반도체 소자 패키지용 캡 및 그 제조방법
KR100750741B1 (ko) 2006-09-15 2007-08-22 삼성전기주식회사 캡 웨이퍼, 이를 구비한 반도체 칩, 및 그 제조방법
KR100831405B1 (ko) * 2006-10-02 2008-05-21 (주) 파이오닉스 웨이퍼 본딩 패키징 방법
DK1962344T3 (da) * 2007-02-25 2012-07-02 Samsung Electronics Co Ltd Emballager til elektroniske indretninger og fremgangsmåder til fremstilling
SE534510C2 (sv) 2008-11-19 2011-09-13 Silex Microsystems Ab Funktionell inkapsling
US8569090B2 (en) * 2010-12-03 2013-10-29 Babak Taheri Wafer level structures and methods for fabricating and packaging MEMS
US8987059B2 (en) * 2012-01-04 2015-03-24 Taiwan Semiconductor Manufacturing Company, Ltd. MEMS devices and methods of forming same
SE537869C2 (sv) 2012-11-01 2015-11-03 Silex Microsystems Ab Substratgenomgående vior
US9630832B2 (en) * 2013-12-19 2017-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method of manufacturing

Also Published As

Publication number Publication date
EP3038974A1 (en) 2016-07-06
WO2015030657A1 (en) 2015-03-05
CN105916801B (zh) 2017-10-10
EP3038974A4 (en) 2017-07-26
SE1351530A1 (sv) 2015-02-27
US9718674B2 (en) 2017-08-01
SE538311C2 (sv) 2016-05-10
CN105916801A (zh) 2016-08-31
EP3038974B1 (en) 2020-12-16
US20160207758A1 (en) 2016-07-21

Similar Documents

Publication Publication Date Title
EP2891836A4 (en) MECHANICAL SEAL DEVICE
EP3011890A4 (en) Introduction device
HK1214224A1 (zh) 新穎的器件
HK1222689A1 (zh) 分離裝置
EP2960770A4 (en) Device
EP3006789A4 (en) Mechanical seal device
HK1201942A1 (zh) 用於結合超穎表面元件的眼科裝置的方法
EP3020955A4 (en) Sealing device
HK1212289A1 (zh) 分離裝置
EP3043230A4 (en) Force-sense-imparting operation device
EP3015356A4 (en) MAINTENANCE DEVICE
EP2974869A4 (en) DEVICE FOR DISCHARGING DROPLETS
EP2948968A4 (en) ELECTROMECHANICAL DEVICE
HK1212288A1 (zh) 分離裝置
HK1224275A1 (zh) 用於微電子機械設備的薄覆蓋
EP2987587A4 (en) Positioning device
EP3090175A4 (en) Microfluidic device
EP3079227A4 (en) Calculation device
EP2862811A4 (en) COVERING
EP3020320A4 (en) Introduction device
EP3006275A4 (en) Airbag device
EP2949956A4 (en) Engagement device
EP3029701A4 (en) Switch-operation-determining device
EP3015748A4 (en) Sealing device
EP3048313A4 (en) Component-securing device