HK1209551A1 - 多透鏡陣列模塊中的緊湊間隔件 - Google Patents

多透鏡陣列模塊中的緊湊間隔件

Info

Publication number
HK1209551A1
HK1209551A1 HK15110262.3A HK15110262A HK1209551A1 HK 1209551 A1 HK1209551 A1 HK 1209551A1 HK 15110262 A HK15110262 A HK 15110262A HK 1209551 A1 HK1209551 A1 HK 1209551A1
Authority
HK
Hong Kong
Prior art keywords
lens array
array module
compact spacer
spacer
compact
Prior art date
Application number
HK15110262.3A
Other languages
English (en)
Inventor
萬宗瑋
陳偉平
邱瑞毅
Original Assignee
Omnivision Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omnivision Tech Inc filed Critical Omnivision Tech Inc
Publication of HK1209551A1 publication Critical patent/HK1209551A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)
  • Image Input (AREA)
HK15110262.3A 2013-10-28 2015-10-19 多透鏡陣列模塊中的緊湊間隔件 HK1209551A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/064,813 US9386203B2 (en) 2013-10-28 2013-10-28 Compact spacer in multi-lens array module

Publications (1)

Publication Number Publication Date
HK1209551A1 true HK1209551A1 (zh) 2016-04-01

Family

ID=52994986

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15110262.3A HK1209551A1 (zh) 2013-10-28 2015-10-19 多透鏡陣列模塊中的緊湊間隔件

Country Status (4)

Country Link
US (1) US9386203B2 (zh)
CN (1) CN104580950B (zh)
HK (1) HK1209551A1 (zh)
TW (1) TWI560860B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9584722B2 (en) * 2013-02-18 2017-02-28 Sony Corporation Electronic device, method for generating an image and filter arrangement with multi-lens array and color filter array for reconstructing image from perspective of one group of pixel sensors
CN103557459B (zh) * 2013-11-06 2016-03-02 郑州中原显示技术有限公司 发光面不相同的三基色led灯
US9467606B2 (en) * 2014-06-10 2016-10-11 Omnivision Technologies, Inc. Wafer level stepped sensor holder
DE102016200285A1 (de) * 2016-01-13 2017-07-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Multiaperturabbildungsvorrichtung, Abbildungssystem und Verfahren zum Erfassen eines Objektbereichs
CN107135380B (zh) * 2016-02-29 2019-05-28 华为技术有限公司 一种彩色成像装置以及获取彩色图像的方法
US20200371330A1 (en) * 2017-11-21 2020-11-26 Fondazione Istituto Italiano Di Tecnologia Lens system intended for microscopic observation and operationally associable with an image acquisition device and a light source
KR20220093988A (ko) 2020-12-28 2022-07-05 삼성전자주식회사 반도체 장치 및 이를 포함하는 전자 시스템

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6762796B1 (en) * 1998-08-10 2004-07-13 Olympus Optical Co., Ltd. Image pickup module having integrated lens and semiconductor chip
US6611289B1 (en) * 1999-01-15 2003-08-26 Yanbin Yu Digital cameras using multiple sensors with multiple lenses
US6384397B1 (en) * 2000-05-10 2002-05-07 National Semiconductor Corporation Low cost die sized module for imaging application having a lens housing assembly
JP2002076313A (ja) * 2000-08-28 2002-03-15 Canon Inc 固体撮像装置
US6952228B2 (en) * 2000-10-13 2005-10-04 Canon Kabushiki Kaisha Image pickup apparatus
US6556349B2 (en) * 2000-12-27 2003-04-29 Honeywell International Inc. Variable focal length micro lens array field curvature corrector
US7092174B2 (en) * 2001-05-18 2006-08-15 Konica Corporation Image pickup lens, image pickup apparatus and method for forming image pickup lens
US7286168B2 (en) * 2001-10-12 2007-10-23 Canon Kabushiki Kaisha Image processing apparatus and method for adding blur to an image
WO2005041562A1 (ja) * 2003-10-22 2005-05-06 Matsushita Electric Industrial Co., Ltd. 撮像装置とその製造方法、携帯機器、及び撮像素子とその製造方法
JP2006032886A (ja) * 2004-06-15 2006-02-02 Fuji Photo Film Co Ltd 固体撮像装置及びその製造方法及びカメラモジュール
JPWO2006068129A1 (ja) * 2004-12-22 2008-06-12 松下電器産業株式会社 撮像装置およびその製造方法
US7736939B2 (en) * 2005-07-07 2010-06-15 United Microelectronics Corp. Method for forming microlenses of different curvatures and fabricating process of solid-state image sensor
JP2007188909A (ja) * 2005-12-14 2007-07-26 Fujifilm Corp 固体撮像装置及びその製造方法
KR100809277B1 (ko) * 2006-07-05 2008-03-03 삼성전기주식회사 어레이 렌즈를 갖는 카메라 모듈
KR20080049186A (ko) * 2006-11-30 2008-06-04 동부일렉트로닉스 주식회사 이미지 센서 및 그 제조방법
US20090034083A1 (en) * 2007-07-30 2009-02-05 Micron Technology, Inc. Method of forming a microlens array and imaging device and system containing such a microlens array
JP2009088255A (ja) * 2007-09-28 2009-04-23 Sharp Corp カラー固体撮像装置および電子情報機器
JP2009130220A (ja) * 2007-11-26 2009-06-11 Sharp Corp 固体撮像装置およびその製造方法
US9118825B2 (en) * 2008-02-22 2015-08-25 Nan Chang O-Film Optoelectronics Technology Ltd. Attachment of wafer level optics
KR101009199B1 (ko) * 2008-10-28 2011-01-19 삼성전기주식회사 이중배럴을 구비한 카메라 모듈
JP5498684B2 (ja) * 2008-11-07 2014-05-21 ラピスセミコンダクタ株式会社 半導体モジュール及びその製造方法
US20100284089A1 (en) * 2009-05-07 2010-11-11 San-Woei Shyu Stacked optical glass lens array, stacked lens module and manufacturing method thereof
US8314469B2 (en) * 2009-09-04 2012-11-20 United Microelectronics Corp. Image sensor structure with different pitches or shapes of microlenses
JP5352392B2 (ja) * 2009-09-14 2013-11-27 富士フイルム株式会社 ウェハレベルレンズアレイの製造方法、ウェハレベルレンズアレイ、レンズモジュール及び撮像ユニット
JP2011128355A (ja) * 2009-12-17 2011-06-30 Sony Corp 撮像レンズ及び撮像レンズを用いたカメラモジュール並びに撮像レンズの製造方法及びカメラモジュールの製造方法
TWI449162B (zh) * 2010-05-17 2014-08-11 Kingpak Tech Inc 具有特定焦距之晶圓級影像感測器模組之製造方法
JP5585208B2 (ja) * 2010-05-20 2014-09-10 ソニー株式会社 固体撮像装置及び電子機器
TWI414060B (zh) * 2010-09-17 2013-11-01 Kingpak Tech Inc 模造成型之免調焦距影像感測器構裝結構及其製造方法
KR101708807B1 (ko) * 2010-09-30 2017-02-21 삼성전자 주식회사 이미지 센서
JP5372102B2 (ja) * 2011-02-09 2013-12-18 キヤノン株式会社 光電変換装置および撮像システム
WO2012117986A1 (ja) * 2011-03-01 2012-09-07 富士フイルム株式会社 レンズモジュールの製造方法、及びレンズモジュール
TWI540344B (zh) 2011-12-01 2016-07-01 鴻海精密工業股份有限公司 濾光片及使用該濾光片之鏡頭模組
JP6176118B2 (ja) * 2012-02-07 2017-08-09 株式会社ニコン 撮像ユニットおよび撮像装置
US20130341747A1 (en) * 2012-06-20 2013-12-26 Xintec Inc. Chip package and method for forming the same

Also Published As

Publication number Publication date
CN104580950A (zh) 2015-04-29
TWI560860B (en) 2016-12-01
TW201517257A (zh) 2015-05-01
CN104580950B (zh) 2018-09-18
US20150116562A1 (en) 2015-04-30
US9386203B2 (en) 2016-07-05

Similar Documents

Publication Publication Date Title
TWI561846B (en) Lens module
EP3080863B8 (de) Batteriemodul
DE112014004775T8 (de) Zellenmodul-Anordnungen
EP3012884A4 (en) BATTERY MODULE
EP2958167A4 (en) BATTERY MODULE
EP3008754A4 (en) Three dimensional memory array with select device
PT2949038T (pt) Módulo solar
EP2953182A4 (en) BATTERY MODULE
EP2980913A4 (en) BATTERY MODULE
SG11201602470VA (en) Brewing module
EP3032607A4 (en) Battery module
EP3038495C0 (en) FURNITURE MODULE
EP2819580A4 (en) COMPACT SENSOR MODULE
SG2013096870A (en) Module
AU354770S (en) Seating module
HK1209551A1 (zh) 多透鏡陣列模塊中的緊湊間隔件
EP2943802A4 (en) APPARATUS AND ASSOCIATED METHODS
EP3089356A4 (en) SOLAR CELL MODULE
EP3043401A4 (en) Battery module
EP2958168A4 (en) BATTERY MODULE
EP2950382A4 (en) BATTERY MODULE
ZA201508669B (en) Battery module
EP3048648A4 (en) SOLAR CELL AND SOLAR CELL MODULE
EP3001492A4 (en) FUEL CELL MODULE AND FUEL CELL ELEMENT
HK1217621A1 (zh) 沖泡模塊