HK1208710A1 - Non-cyanide gold plating bath and method for preparing non-cyanide gold plating bath - Google Patents

Non-cyanide gold plating bath and method for preparing non-cyanide gold plating bath

Info

Publication number
HK1208710A1
HK1208710A1 HK15109291.0A HK15109291A HK1208710A1 HK 1208710 A1 HK1208710 A1 HK 1208710A1 HK 15109291 A HK15109291 A HK 15109291A HK 1208710 A1 HK1208710 A1 HK 1208710A1
Authority
HK
Hong Kong
Prior art keywords
plating bath
gold plating
cyanide gold
preparing
cyanide
Prior art date
Application number
HK15109291.0A
Other languages
English (en)
Chinese (zh)
Inventor
Christopher Cordonier
Hideo Honma
Original Assignee
Kanto Gakuin School Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanto Gakuin School Corp filed Critical Kanto Gakuin School Corp
Publication of HK1208710A1 publication Critical patent/HK1208710A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
HK15109291.0A 2012-07-13 2015-09-22 Non-cyanide gold plating bath and method for preparing non-cyanide gold plating bath HK1208710A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012157450 2012-07-13
PCT/JP2013/063433 WO2014010301A1 (ja) 2012-07-13 2013-05-14 ノーシアン金めっき浴、及び、ノーシアン金めっき浴の製造方法

Publications (1)

Publication Number Publication Date
HK1208710A1 true HK1208710A1 (en) 2016-03-11

Family

ID=49915776

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15109291.0A HK1208710A1 (en) 2012-07-13 2015-09-22 Non-cyanide gold plating bath and method for preparing non-cyanide gold plating bath

Country Status (7)

Country Link
US (1) US9719183B2 (ja)
JP (1) JP6144258B2 (ja)
KR (1) KR20150034166A (ja)
CN (1) CN104736739B (ja)
HK (1) HK1208710A1 (ja)
TW (1) TWI600794B (ja)
WO (1) WO2014010301A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104233385A (zh) * 2014-10-22 2014-12-24 华文蔚 一种噻唑无氰镀金的电镀液及其电镀方法
TW201631222A (zh) * 2014-12-17 2016-09-01 Jcu Corp 無氰電解鍍金溶液及鍍金方法
JP6594077B2 (ja) * 2015-07-28 2019-10-23 上村工業株式会社 ノンシアン無電解金めっき浴および無電解金めっき方法
CN105349972A (zh) * 2015-11-25 2016-02-24 广东致卓精密金属科技有限公司 还原型复合配位非氰化学镀金液及方法
JP6569026B1 (ja) * 2018-02-20 2019-08-28 上村工業株式会社 無電解パラジウムめっき液、およびパラジウム皮膜
US11674235B2 (en) 2018-04-11 2023-06-13 Hutchinson Technology Incorporated Plating method to reduce or eliminate voids in solder applied without flux
CN108441901A (zh) * 2018-04-18 2018-08-24 中国工程物理研究院激光聚变研究中心 一种无氰有机溶剂的电镀金溶液
CN114108040A (zh) * 2020-08-25 2022-03-01 周大福珠宝文化产业园(武汉)有限公司 无氰镀金液及以无氰电镀工艺制成的黄金电铸件

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5281635A (en) * 1991-05-17 1994-01-25 Johnson Matthey Public Limited Company Precious metal composition
US20050067297A1 (en) * 2003-09-26 2005-03-31 Innovative Technology Licensing, Llc Copper bath for electroplating fine circuitry on semiconductor chips
WO2006085669A1 (en) 2005-02-08 2006-08-17 Fujifilm Corporation Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and tft wiring board using the same
JP4873196B2 (ja) * 2009-04-21 2012-02-08 上村工業株式会社 無電解金めっき浴
JP4831710B1 (ja) * 2010-07-20 2011-12-07 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解金めっき液及び無電解金めっき方法

Also Published As

Publication number Publication date
CN104736739A (zh) 2015-06-24
JPWO2014010301A1 (ja) 2016-06-20
US9719183B2 (en) 2017-08-01
US20150167191A1 (en) 2015-06-18
KR20150034166A (ko) 2015-04-02
JP6144258B2 (ja) 2017-06-07
TW201418519A (zh) 2014-05-16
TWI600794B (zh) 2017-10-01
CN104736739B (zh) 2018-04-06
WO2014010301A1 (ja) 2014-01-16

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20230511