HK1207419A1 - 外觀檢查裝置 - Google Patents

外觀檢查裝置

Info

Publication number
HK1207419A1
HK1207419A1 HK15107992.6A HK15107992A HK1207419A1 HK 1207419 A1 HK1207419 A1 HK 1207419A1 HK 15107992 A HK15107992 A HK 15107992A HK 1207419 A1 HK1207419 A1 HK 1207419A1
Authority
HK
Hong Kong
Prior art keywords
inspection apparatus
visual inspection
visual
inspection
Prior art date
Application number
HK15107992.6A
Other languages
English (en)
Inventor
白石成
Original Assignee
上野精機株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上野精機株式會社 filed Critical 上野精機株式會社
Publication of HK1207419A1 publication Critical patent/HK1207419A1/zh

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95684Patterns showing highly reflecting parts, e.g. metallic elements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8841Illumination and detection on two sides of object

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
HK15107992.6A 2013-09-02 2015-08-18 外觀檢查裝置 HK1207419A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013181288A JP5555839B1 (ja) 2013-09-02 2013-09-02 外観検査装置

Publications (1)

Publication Number Publication Date
HK1207419A1 true HK1207419A1 (zh) 2016-01-29

Family

ID=51416903

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15107992.6A HK1207419A1 (zh) 2013-09-02 2015-08-18 外觀檢查裝置

Country Status (8)

Country Link
US (1) US9261463B2 (zh)
JP (1) JP5555839B1 (zh)
KR (1) KR101454823B1 (zh)
CN (1) CN104422699B (zh)
HK (1) HK1207419A1 (zh)
MY (1) MY168515A (zh)
SG (1) SG10201404636PA (zh)
TW (1) TWI495866B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5828180B1 (ja) * 2014-11-05 2015-12-02 アキム株式会社 外観検査付搬送装置、外観検査付搬送方法
JP5803034B1 (ja) * 2014-11-05 2015-11-04 アキム株式会社 搬送装置、搬送方法
JP5835758B1 (ja) * 2014-11-21 2015-12-24 上野精機株式会社 外観検査装置
KR20210099172A (ko) * 2015-06-05 2021-08-11 케이엘에이 코포레이션 반도체 디바이스들의 적어도 측면들의 검사를 위한 장치, 방법 및 컴퓨터 프로그램 제품
TWI611179B (zh) * 2016-04-06 2018-01-11 旺矽科技股份有限公司 外觀檢測裝置
JP6832650B2 (ja) * 2016-08-18 2021-02-24 株式会社Screenホールディングス 検査装置および検査方法
DE102019125127A1 (de) * 2019-09-18 2021-03-18 Mühlbauer Gmbh & Co. Kg Bauteilhandhabung, Bauteilinspektion
DE102019125134A1 (de) 2019-09-18 2021-03-18 Mühlbauer Gmbh & Co. Kg Bauteilhandhabung, Bauteilinspektion
CN114518727B (zh) * 2020-11-18 2023-09-12 台达电子工业股份有限公司 出料控制系统及其出料控制方法
TWI755935B (zh) * 2020-11-18 2022-02-21 台達電子工業股份有限公司 出料控制系統及其出料控制方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06103170B2 (ja) * 1987-07-30 1994-12-14 株式会社マキ製作所 物品の外観検査方法と装置
JPH0533765Y2 (zh) * 1987-08-27 1993-08-27
JP3600010B2 (ja) * 1998-05-06 2004-12-08 エヌ・ティ・ティ・ファネット・システムズ株式会社 検査対象物の外観検査方法とその装置
JP3726532B2 (ja) * 1999-02-12 2005-12-14 松下電器産業株式会社 外観検査装置
JP4251307B2 (ja) 1999-05-31 2009-04-08 オカノ電機株式会社 外観検査装置
JP2002277502A (ja) * 2001-01-12 2002-09-25 Nidec-Read Corp 基板検査装置及び基板検査方法
JP3629244B2 (ja) * 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
JP2003254726A (ja) 2002-02-28 2003-09-10 Shibuya Kogyo Co Ltd 半導体素子の外観検査装置
JP4214137B2 (ja) * 2005-07-20 2009-01-28 日本山村硝子株式会社 容器の外形検査装置
JP4466669B2 (ja) * 2007-03-26 2010-05-26 Tdk株式会社 外観検査装置
KR20110067775A (ko) * 2009-12-15 2011-06-22 세크론 주식회사 전자 부품 검사 장치 및 방법
CN102116745A (zh) * 2009-12-30 2011-07-06 上海允科自动化有限公司 一种ic元件检测系统
JP5252516B2 (ja) * 2010-11-30 2013-07-31 上野精機株式会社 電子部品保持装置、及びこれを備える電子部品検査装置、電子部品分類装置
CN102359758B (zh) * 2011-07-21 2013-03-20 华中科技大学 一种半导体芯片的外观检测装置

Also Published As

Publication number Publication date
SG10201404636PA (en) 2015-04-29
JP2015049153A (ja) 2015-03-16
CN104422699A (zh) 2015-03-18
JP5555839B1 (ja) 2014-07-23
US9261463B2 (en) 2016-02-16
TW201508265A (zh) 2015-03-01
CN104422699B (zh) 2016-04-06
KR101454823B1 (ko) 2014-10-28
MY168515A (en) 2018-11-12
US20150062329A1 (en) 2015-03-05
TWI495866B (zh) 2015-08-11

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20200622