HK1198293A1 - 蠟模射出成型機用夾具裝置 - Google Patents

蠟模射出成型機用夾具裝置

Info

Publication number
HK1198293A1
HK1198293A1 HK14111827.0A HK14111827A HK1198293A1 HK 1198293 A1 HK1198293 A1 HK 1198293A1 HK 14111827 A HK14111827 A HK 14111827A HK 1198293 A1 HK1198293 A1 HK 1198293A1
Authority
HK
Hong Kong
Prior art keywords
injection molding
clamping device
molding machine
wax model
model injection
Prior art date
Application number
HK14111827.0A
Other languages
English (en)
Inventor
安井深作
Original Assignee
安井貿易株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 安井貿易株式會社 filed Critical 安井貿易株式會社
Publication of HK1198293A1 publication Critical patent/HK1198293A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22C—FOUNDRY MOULDING
    • B22C7/00—Patterns; Manufacture thereof so far as not provided for in other classes
    • B22C7/02—Lost patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
    • B29C67/241—Moulding wax

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molds, Cores, And Manufacturing Methods Thereof (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
HK14111827.0A 2011-09-14 2014-11-21 蠟模射出成型機用夾具裝置 HK1198293A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/005193 WO2013038448A1 (ja) 2011-09-14 2011-09-14 ワックスモデル射出成型機用クランプ装置

Publications (1)

Publication Number Publication Date
HK1198293A1 true HK1198293A1 (zh) 2015-03-27

Family

ID=47882722

Family Applications (1)

Application Number Title Priority Date Filing Date
HK14111827.0A HK1198293A1 (zh) 2011-09-14 2014-11-21 蠟模射出成型機用夾具裝置

Country Status (6)

Country Link
EP (1) EP2756895B1 (zh)
JP (1) JP5824058B2 (zh)
CN (1) CN103826777B (zh)
HK (1) HK1198293A1 (zh)
IN (1) IN2014CN02689A (zh)
WO (1) WO2013038448A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017002247A1 (ja) * 2015-07-01 2017-01-05 株式会社エイシン技研 ワックス型射出成型用クランプユニット
WO2017013724A1 (ja) * 2015-07-17 2017-01-26 株式会社エイシン技研 ワックス型射出成型用のクランプ装置
EP3342507B1 (en) * 2015-08-17 2019-12-11 Eishin Technology Co., Ltd Clamping device for wax model injection molding and method for manufacturing wax model
JP6244602B2 (ja) * 2015-10-02 2017-12-13 株式会社エイシン技研 ワックス型射出成型用のクランプ装置及びワックス型の製造方法
WO2017081763A1 (ja) 2015-11-11 2017-05-18 株式会社エイシン技研 ワックス型射出成型装置及びワックス型射出成型装置を用いた物品の鋳造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002254137A (ja) * 2001-03-02 2002-09-10 M Yasui & Co Ltd インベストメント鋳造用射出成型装置および型
JP3792663B2 (ja) * 2003-03-12 2006-07-05 ファナック株式会社 成形機の型締機構
JP2004299269A (ja) * 2003-03-31 2004-10-28 Aoki Technical Laboratory Inc 型締装置
JP2007237186A (ja) * 2006-03-03 2007-09-20 Seiko Epson Corp ロストワックス鋳造法におけるワックス注入用ゴム型およびワックス注入用ゴム型給排装置
JP5131439B2 (ja) * 2006-09-29 2013-01-30 豊田合成株式会社 型締め機構及び射出成形機
CN101104300B (zh) * 2007-03-15 2010-06-23 金孝禹 卧式圆盘塑料注射成型机

Also Published As

Publication number Publication date
JP5824058B2 (ja) 2015-11-25
CN103826777A (zh) 2014-05-28
WO2013038448A1 (ja) 2013-03-21
JPWO2013038448A1 (ja) 2015-03-23
EP2756895A1 (en) 2014-07-23
IN2014CN02689A (zh) 2015-07-31
EP2756895A4 (en) 2015-06-24
EP2756895B1 (en) 2016-11-09
CN103826777B (zh) 2016-09-07

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20200913