HK1183149A1 - Illumination apparatus - Google Patents

Illumination apparatus

Info

Publication number
HK1183149A1
HK1183149A1 HK13110242.0A HK13110242A HK1183149A1 HK 1183149 A1 HK1183149 A1 HK 1183149A1 HK 13110242 A HK13110242 A HK 13110242A HK 1183149 A1 HK1183149 A1 HK 1183149A1
Authority
HK
Hong Kong
Prior art keywords
illumination apparatus
illumination
Prior art date
Application number
HK13110242.0A
Other languages
English (en)
Chinese (zh)
Inventor
國崎康弘
中村俊
保岡剛
Original Assignee
日亞化學工業株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日亞化學工業株式會社 filed Critical 日亞化學工業株式會社
Publication of HK1183149A1 publication Critical patent/HK1183149A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
HK13110242.0A 2006-12-19 2013-09-02 Illumination apparatus HK1183149A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006340966A JP5303834B2 (ja) 2006-12-19 2006-12-19 発光装置

Publications (1)

Publication Number Publication Date
HK1183149A1 true HK1183149A1 (en) 2013-12-13

Family

ID=39566988

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13110242.0A HK1183149A1 (en) 2006-12-19 2013-09-02 Illumination apparatus

Country Status (4)

Country Link
JP (1) JP5303834B2 (ja)
CN (2) CN102956195B (ja)
HK (1) HK1183149A1 (ja)
TW (1) TWI455084B (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9930756B2 (en) 2008-03-27 2018-03-27 Cree, Inc. Apparatus, methods and systems for providing lighting and communication
KR100992383B1 (ko) * 2010-07-19 2010-11-08 주식회사 대한전광 Ｌｅｄ 전광판 및 그 구동 방법
JP2012099728A (ja) * 2010-11-04 2012-05-24 Nikon Corp 発光素子パッケージ及び表示装置
US20130106891A1 (en) * 2011-11-01 2013-05-02 Au Optronics Corporation Method of sub-pixel rendering for a delta-triad structured display
CN102915704B (zh) * 2012-11-12 2014-10-08 利亚德光电股份有限公司 Led显示屏像素共享显示方法、装置和系统
US20150016104A1 (en) * 2013-07-11 2015-01-15 Everlight Electronics Co., Ltd. Lighting Component And Lighting Device
CN103366683B (zh) * 2013-07-12 2014-10-29 上海和辉光电有限公司 像素阵列、显示器以及将图像呈现于显示器上的方法
GB201413604D0 (en) * 2014-07-31 2014-09-17 Infiniled Ltd A colour inorganic LED display for display devices with a high number of pixel
JP6421535B2 (ja) * 2014-10-14 2018-11-14 日亜化学工業株式会社 発光装置及び表示部並びに制御回路
US10134330B2 (en) 2015-03-17 2018-11-20 Kunshan Yunyinggu Electronic Technology Co., Ltd. Subpixel arrangement for displays and driving circuit thereof
WO2016145609A1 (en) * 2015-03-17 2016-09-22 Shenzhen Yunyinggu Technology Co., Ltd. Subpixel arrangement for displays and driving circuit thereof
EP3343544B1 (en) * 2016-12-28 2022-06-15 Vestel Elektronik Sanayi ve Ticaret A.S. Method for a display device
JP2019050298A (ja) * 2017-09-11 2019-03-28 東芝ホクト電子株式会社 発光パネル
JP7045951B2 (ja) * 2018-07-20 2022-04-01 三菱電機株式会社 表示ユニット及び表示装置
CN110969956A (zh) * 2018-09-28 2020-04-07 深圳光峰科技股份有限公司 Led显示屏
TWI743750B (zh) 2020-04-20 2021-10-21 錼創顯示科技股份有限公司 微型發光元件顯示裝置
CN111477652B (zh) * 2020-04-20 2022-07-12 錼创显示科技股份有限公司 微型发光元件显示装置
CN113256872B (zh) * 2020-12-31 2024-02-02 深圳怡化电脑股份有限公司 图像传感器参数配置方法、装置、计算机设备及存储介质
CN113377077B (zh) * 2021-07-08 2022-09-09 四川恒业硅业有限公司 一种智能制造数字化工厂系统

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3292133B2 (ja) * 1997-04-14 2002-06-17 日亜化学工業株式会社 Ｌｅｄ表示器及びそれを用いた表示装置
EP2267798B1 (de) * 1997-07-29 2015-09-30 OSRAM Opto Semiconductors GmbH Optoelektronisches Bauelement
JP4006064B2 (ja) * 1997-08-22 2007-11-14 株式会社アドバンテスト 円周走査型ホログラム観測方法及び装置
JP3542504B2 (ja) * 1997-08-28 2004-07-14 キヤノン株式会社 カラー表示装置
JP2003131594A (ja) * 2001-10-29 2003-05-09 Sharp Corp 表示装置
JP3870807B2 (ja) * 2001-12-20 2007-01-24 ソニー株式会社 画像表示装置及びその製造方法
TW200409066A (en) * 2002-11-26 2004-06-01 Xian-Jie Yang LED arrangement method of color LED display
JP4255334B2 (ja) * 2003-08-20 2009-04-15 シャープ株式会社 表示装置
JP2005183531A (ja) * 2003-12-17 2005-07-07 Sharp Corp 半導体発光装置
CN1556515A (zh) * 2003-12-30 2004-12-22 哈尔滨中体显示技术有限公司 Led组合虚拟象素及其实用算法
JP2006284891A (ja) * 2005-03-31 2006-10-19 Toshiba Lighting & Technology Corp 画像表示装置
JP2006292858A (ja) * 2005-04-07 2006-10-26 Matsushita Electric Ind Co Ltd Ｌｅｄ表示装置及び表示基板
CN1858827A (zh) * 2005-12-17 2006-11-08 陈祖良 由单色发光体实现全彩色虚拟像素屏的方法及彩色显示屏

Also Published As

Publication number Publication date
TW200901116A (en) 2009-01-01
CN101206834B (zh) 2012-11-14
CN102956195A (zh) 2013-03-06
JP5303834B2 (ja) 2013-10-02
TWI455084B (zh) 2014-10-01
CN101206834A (zh) 2008-06-25
CN102956195B (zh) 2015-03-11
JP2008152080A (ja) 2008-07-03

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