HK1183149A1 - Illumination apparatus - Google Patents

Illumination apparatus

Info

Publication number
HK1183149A1
HK1183149A1 HK13110242.0A HK13110242A HK1183149A1 HK 1183149 A1 HK1183149 A1 HK 1183149A1 HK 13110242 A HK13110242 A HK 13110242A HK 1183149 A1 HK1183149 A1 HK 1183149A1
Authority
HK
Hong Kong
Prior art keywords
illumination apparatus
illumination
Prior art date
Application number
HK13110242.0A
Other languages
Chinese (zh)
Inventor
國崎康弘
中村俊
保岡剛
Original Assignee
日亞化學工業株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日亞化學工業株式會社 filed Critical 日亞化學工業株式會社
Publication of HK1183149A1 publication Critical patent/HK1183149A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
HK13110242.0A 2006-12-19 2013-09-02 Illumination apparatus HK1183149A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006340966A JP5303834B2 (en) 2006-12-19 2006-12-19 Light emitting device

Publications (1)

Publication Number Publication Date
HK1183149A1 true HK1183149A1 (en) 2013-12-13

Family

ID=39566988

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13110242.0A HK1183149A1 (en) 2006-12-19 2013-09-02 Illumination apparatus

Country Status (4)

Country Link
JP (1) JP5303834B2 (en)
CN (2) CN102956195B (en)
HK (1) HK1183149A1 (en)
TW (1) TWI455084B (en)

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US9930756B2 (en) 2008-03-27 2018-03-27 Cree, Inc. Apparatus, methods and systems for providing lighting and communication
KR100992383B1 (en) * 2010-07-19 2010-11-08 주식회사 대한전광 Led electric lighting board and its driving method
JP2012099728A (en) * 2010-11-04 2012-05-24 Nikon Corp Light-emitting element package and display device
US20130106891A1 (en) * 2011-11-01 2013-05-02 Au Optronics Corporation Method of sub-pixel rendering for a delta-triad structured display
CN102915704B (en) * 2012-11-12 2014-10-08 利亚德光电股份有限公司 LED (Light Emitting Diode) display screen pixel sharing display method, device and system
US20150016104A1 (en) * 2013-07-11 2015-01-15 Everlight Electronics Co., Ltd. Lighting Component And Lighting Device
CN103366683B (en) 2013-07-12 2014-10-29 上海和辉光电有限公司 Pixel array, display and method for displaying image on display
GB201413604D0 (en) * 2014-07-31 2014-09-17 Infiniled Ltd A colour inorganic LED display for display devices with a high number of pixel
JP6421535B2 (en) * 2014-10-14 2018-11-14 日亜化学工業株式会社 Light emitting device, display unit, and control circuit
US10134330B2 (en) 2015-03-17 2018-11-20 Kunshan Yunyinggu Electronic Technology Co., Ltd. Subpixel arrangement for displays and driving circuit thereof
ES2795400T3 (en) * 2015-03-17 2020-11-23 Kunshan Yunyinggu Electronic Tech Co Ltd Sub-pixel arrangement for displays and display driver circuit
EP3343544B1 (en) * 2016-12-28 2022-06-15 Vestel Elektronik Sanayi ve Ticaret A.S. Method for a display device
JP2019050298A (en) * 2017-09-11 2019-03-28 東芝ホクト電子株式会社 Light-emitting panel
JP7045951B2 (en) * 2018-07-20 2022-04-01 三菱電機株式会社 Display unit and display device
CN110969956A (en) * 2018-09-28 2020-04-07 深圳光峰科技股份有限公司 LED display screen
CN111477652B (en) * 2020-04-20 2022-07-12 錼创显示科技股份有限公司 Micro light emitting device display device
TWI743750B (en) 2020-04-20 2021-10-21 錼創顯示科技股份有限公司 Micro light-emitting device display apparatus
CN113256872B (en) * 2020-12-31 2024-02-02 深圳怡化电脑股份有限公司 Image sensor parameter configuration method, device, computer equipment and storage medium
CN113377077B (en) * 2021-07-08 2022-09-09 四川恒业硅业有限公司 Intelligent manufacturing digital factory system

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3292133B2 (en) * 1997-04-14 2002-06-17 日亜化学工業株式会社 LED display and display device using the same
EP2267797A1 (en) * 1997-07-29 2010-12-29 OSRAM Opto Semiconductors GmbH Optoelectronic device
JP4006064B2 (en) * 1997-08-22 2007-11-14 株式会社アドバンテスト Circumferential scanning hologram observation method and apparatus
JP3542504B2 (en) * 1997-08-28 2004-07-14 キヤノン株式会社 Color display
JP2003131594A (en) * 2001-10-29 2003-05-09 Sharp Corp Display device
JP3870807B2 (en) * 2001-12-20 2007-01-24 ソニー株式会社 Image display device and manufacturing method thereof
TW200409066A (en) * 2002-11-26 2004-06-01 Xian-Jie Yang LED arrangement method of color LED display
JP4255334B2 (en) * 2003-08-20 2009-04-15 シャープ株式会社 Display device
JP2005183531A (en) * 2003-12-17 2005-07-07 Sharp Corp Semiconductor light emitting device
CN1556515A (en) * 2003-12-30 2004-12-22 哈尔滨中体显示技术有限公司 LED composite virtual picture element and its practical calculating method
JP2006284891A (en) * 2005-03-31 2006-10-19 Toshiba Lighting & Technology Corp Image display apparatus
JP2006292858A (en) * 2005-04-07 2006-10-26 Matsushita Electric Ind Co Ltd Led display device and display substrate
CN1858827A (en) * 2005-12-17 2006-11-08 陈祖良 Method for realizing full color virtual piexel screen from monochromatic light emitter and color display screen

Also Published As

Publication number Publication date
TW200901116A (en) 2009-01-01
JP2008152080A (en) 2008-07-03
CN102956195B (en) 2015-03-11
CN102956195A (en) 2013-03-06
JP5303834B2 (en) 2013-10-02
TWI455084B (en) 2014-10-01
CN101206834B (en) 2012-11-14
CN101206834A (en) 2008-06-25

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