TW200901116A - Illumination apparatus - Google Patents
Illumination apparatusInfo
- Publication number
- TW200901116A TW200901116A TW096148087A TW96148087A TW200901116A TW 200901116 A TW200901116 A TW 200901116A TW 096148087 A TW096148087 A TW 096148087A TW 96148087 A TW96148087 A TW 96148087A TW 200901116 A TW200901116 A TW 200901116A
- Authority
- TW
- Taiwan
- Prior art keywords
- light emitting
- emitting elements
- illumination apparatus
- display
- degradation
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
To suppress the degradation or the like in sharpness and the debasement of display quality, while reducing the number of light emitting elements to be used. An illumination apparatus includes a plurality of the light emitting elements having different light emission colors, display elements arranged in a matrix, and a driving circuit for driving lighting of the light emitting elements. In the illumination apparatus, the light emitting elements are arranged on each line in a longitudinal or transverse direction so as to include all of three primary colors of light. As a result, the number of the light emitting elements to be used is reduced, and the driving circuit is simplified. In addition, the clear display of the high sharpness suppressed in the degradation of the display quality is made possible.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006340966A JP5303834B2 (en) | 2006-12-19 | 2006-12-19 | Light emitting device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200901116A true TW200901116A (en) | 2009-01-01 |
TWI455084B TWI455084B (en) | 2014-10-01 |
Family
ID=39566988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096148087A TWI455084B (en) | 2006-12-19 | 2007-12-14 | Light emitting device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5303834B2 (en) |
CN (2) | CN101206834B (en) |
HK (1) | HK1183149A1 (en) |
TW (1) | TWI455084B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113377077A (en) * | 2021-07-08 | 2021-09-10 | 刘志程 | Intelligent manufacturing digital factory system |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9930756B2 (en) * | 2008-03-27 | 2018-03-27 | Cree, Inc. | Apparatus, methods and systems for providing lighting and communication |
KR100992383B1 (en) * | 2010-07-19 | 2010-11-08 | 주식회사 대한전광 | Led electric lighting board and its driving method |
JP2012099728A (en) * | 2010-11-04 | 2012-05-24 | Nikon Corp | Light-emitting element package and display device |
US20130106891A1 (en) * | 2011-11-01 | 2013-05-02 | Au Optronics Corporation | Method of sub-pixel rendering for a delta-triad structured display |
CN102915704B (en) * | 2012-11-12 | 2014-10-08 | 利亚德光电股份有限公司 | LED (Light Emitting Diode) display screen pixel sharing display method, device and system |
US20150016104A1 (en) * | 2013-07-11 | 2015-01-15 | Everlight Electronics Co., Ltd. | Lighting Component And Lighting Device |
CN103366683B (en) | 2013-07-12 | 2014-10-29 | 上海和辉光电有限公司 | Pixel array, display and method for displaying image on display |
GB201413604D0 (en) * | 2014-07-31 | 2014-09-17 | Infiniled Ltd | A colour inorganic LED display for display devices with a high number of pixel |
JP6421535B2 (en) * | 2014-10-14 | 2018-11-14 | 日亜化学工業株式会社 | Light emitting device, display unit, and control circuit |
CN107742501B (en) * | 2015-03-17 | 2019-09-13 | 深圳云英谷科技有限公司 | Display pixel arrangement and its driving circuit |
US10134330B2 (en) | 2015-03-17 | 2018-11-20 | Kunshan Yunyinggu Electronic Technology Co., Ltd. | Subpixel arrangement for displays and driving circuit thereof |
EP3343544B1 (en) * | 2016-12-28 | 2022-06-15 | Vestel Elektronik Sanayi ve Ticaret A.S. | Method for a display device |
JP2019050298A (en) * | 2017-09-11 | 2019-03-28 | 東芝ホクト電子株式会社 | Light-emitting panel |
JP7045951B2 (en) * | 2018-07-20 | 2022-04-01 | 三菱電機株式会社 | Display unit and display device |
CN110969956A (en) * | 2018-09-28 | 2020-04-07 | 深圳光峰科技股份有限公司 | LED display screen |
CN111477652B (en) * | 2020-04-20 | 2022-07-12 | 錼创显示科技股份有限公司 | Micro light emitting device display device |
TWI743750B (en) | 2020-04-20 | 2021-10-21 | 錼創顯示科技股份有限公司 | Micro light-emitting device display apparatus |
CN113256872B (en) * | 2020-12-31 | 2024-02-02 | 深圳怡化电脑股份有限公司 | Image sensor parameter configuration method, device, computer equipment and storage medium |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3292133B2 (en) * | 1997-04-14 | 2002-06-17 | 日亜化学工業株式会社 | LED display and display device using the same |
JP2001518692A (en) * | 1997-07-29 | 2001-10-16 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー オッフェネ ハンデルスゲゼルシャフト | Photoelectric element |
JP4006064B2 (en) * | 1997-08-22 | 2007-11-14 | 株式会社アドバンテスト | Circumferential scanning hologram observation method and apparatus |
JP3542504B2 (en) * | 1997-08-28 | 2004-07-14 | キヤノン株式会社 | Color display |
JP2003131594A (en) * | 2001-10-29 | 2003-05-09 | Sharp Corp | Display device |
JP3870807B2 (en) * | 2001-12-20 | 2007-01-24 | ソニー株式会社 | Image display device and manufacturing method thereof |
TW200409066A (en) * | 2002-11-26 | 2004-06-01 | Xian-Jie Yang | LED arrangement method of color LED display |
JP4255334B2 (en) * | 2003-08-20 | 2009-04-15 | シャープ株式会社 | Display device |
JP2005183531A (en) * | 2003-12-17 | 2005-07-07 | Sharp Corp | Semiconductor light emitting device |
CN1556515A (en) * | 2003-12-30 | 2004-12-22 | 哈尔滨中体显示技术有限公司 | LED composite virtual picture element and its practical calculating method |
JP2006284891A (en) * | 2005-03-31 | 2006-10-19 | Toshiba Lighting & Technology Corp | Image display apparatus |
JP2006292858A (en) * | 2005-04-07 | 2006-10-26 | Matsushita Electric Ind Co Ltd | Led display device and display substrate |
CN1858827A (en) * | 2005-12-17 | 2006-11-08 | 陈祖良 | Method for realizing full color virtual piexel screen from monochromatic light emitter and color display screen |
-
2006
- 2006-12-19 JP JP2006340966A patent/JP5303834B2/en active Active
-
2007
- 2007-12-14 TW TW096148087A patent/TWI455084B/en active
- 2007-12-18 CN CN200710199178.3A patent/CN101206834B/en active Active
- 2007-12-18 CN CN201210378901.5A patent/CN102956195B/en active Active
-
2013
- 2013-09-02 HK HK13110242.0A patent/HK1183149A1/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113377077A (en) * | 2021-07-08 | 2021-09-10 | 刘志程 | Intelligent manufacturing digital factory system |
Also Published As
Publication number | Publication date |
---|---|
CN101206834B (en) | 2012-11-14 |
JP5303834B2 (en) | 2013-10-02 |
JP2008152080A (en) | 2008-07-03 |
CN102956195B (en) | 2015-03-11 |
CN102956195A (en) | 2013-03-06 |
TWI455084B (en) | 2014-10-01 |
HK1183149A1 (en) | 2013-12-13 |
CN101206834A (en) | 2008-06-25 |
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