TW200901116A - Illumination apparatus - Google Patents

Illumination apparatus

Info

Publication number
TW200901116A
TW200901116A TW096148087A TW96148087A TW200901116A TW 200901116 A TW200901116 A TW 200901116A TW 096148087 A TW096148087 A TW 096148087A TW 96148087 A TW96148087 A TW 96148087A TW 200901116 A TW200901116 A TW 200901116A
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting elements
illumination apparatus
display
degradation
Prior art date
Application number
TW096148087A
Other languages
Chinese (zh)
Other versions
TWI455084B (en
Inventor
Yasuhiro Kunisaki
Shun Nakamura
Tsuyoshi Yasuoka
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Publication of TW200901116A publication Critical patent/TW200901116A/en
Application granted granted Critical
Publication of TWI455084B publication Critical patent/TWI455084B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Abstract

To suppress the degradation or the like in sharpness and the debasement of display quality, while reducing the number of light emitting elements to be used. An illumination apparatus includes a plurality of the light emitting elements having different light emission colors, display elements arranged in a matrix, and a driving circuit for driving lighting of the light emitting elements. In the illumination apparatus, the light emitting elements are arranged on each line in a longitudinal or transverse direction so as to include all of three primary colors of light. As a result, the number of the light emitting elements to be used is reduced, and the driving circuit is simplified. In addition, the clear display of the high sharpness suppressed in the degradation of the display quality is made possible.
TW096148087A 2006-12-19 2007-12-14 Light emitting device TWI455084B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006340966A JP5303834B2 (en) 2006-12-19 2006-12-19 Light emitting device

Publications (2)

Publication Number Publication Date
TW200901116A true TW200901116A (en) 2009-01-01
TWI455084B TWI455084B (en) 2014-10-01

Family

ID=39566988

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096148087A TWI455084B (en) 2006-12-19 2007-12-14 Light emitting device

Country Status (4)

Country Link
JP (1) JP5303834B2 (en)
CN (2) CN101206834B (en)
HK (1) HK1183149A1 (en)
TW (1) TWI455084B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113377077A (en) * 2021-07-08 2021-09-10 刘志程 Intelligent manufacturing digital factory system

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KR100992383B1 (en) * 2010-07-19 2010-11-08 주식회사 대한전광 Led electric lighting board and its driving method
JP2012099728A (en) * 2010-11-04 2012-05-24 Nikon Corp Light-emitting element package and display device
US20130106891A1 (en) * 2011-11-01 2013-05-02 Au Optronics Corporation Method of sub-pixel rendering for a delta-triad structured display
CN102915704B (en) * 2012-11-12 2014-10-08 利亚德光电股份有限公司 LED (Light Emitting Diode) display screen pixel sharing display method, device and system
US20150016104A1 (en) * 2013-07-11 2015-01-15 Everlight Electronics Co., Ltd. Lighting Component And Lighting Device
CN103366683B (en) 2013-07-12 2014-10-29 上海和辉光电有限公司 Pixel array, display and method for displaying image on display
GB201413604D0 (en) * 2014-07-31 2014-09-17 Infiniled Ltd A colour inorganic LED display for display devices with a high number of pixel
JP6421535B2 (en) * 2014-10-14 2018-11-14 日亜化学工業株式会社 Light emitting device, display unit, and control circuit
CN107742501B (en) * 2015-03-17 2019-09-13 深圳云英谷科技有限公司 Display pixel arrangement and its driving circuit
US10134330B2 (en) 2015-03-17 2018-11-20 Kunshan Yunyinggu Electronic Technology Co., Ltd. Subpixel arrangement for displays and driving circuit thereof
EP3343544B1 (en) * 2016-12-28 2022-06-15 Vestel Elektronik Sanayi ve Ticaret A.S. Method for a display device
JP2019050298A (en) * 2017-09-11 2019-03-28 東芝ホクト電子株式会社 Light-emitting panel
JP7045951B2 (en) * 2018-07-20 2022-04-01 三菱電機株式会社 Display unit and display device
CN110969956A (en) * 2018-09-28 2020-04-07 深圳光峰科技股份有限公司 LED display screen
CN111477652B (en) * 2020-04-20 2022-07-12 錼创显示科技股份有限公司 Micro light emitting device display device
TWI743750B (en) 2020-04-20 2021-10-21 錼創顯示科技股份有限公司 Micro light-emitting device display apparatus
CN113256872B (en) * 2020-12-31 2024-02-02 深圳怡化电脑股份有限公司 Image sensor parameter configuration method, device, computer equipment and storage medium

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JP2001518692A (en) * 1997-07-29 2001-10-16 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー オッフェネ ハンデルスゲゼルシャフト Photoelectric element
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113377077A (en) * 2021-07-08 2021-09-10 刘志程 Intelligent manufacturing digital factory system

Also Published As

Publication number Publication date
CN101206834B (en) 2012-11-14
JP5303834B2 (en) 2013-10-02
JP2008152080A (en) 2008-07-03
CN102956195B (en) 2015-03-11
CN102956195A (en) 2013-03-06
TWI455084B (en) 2014-10-01
HK1183149A1 (en) 2013-12-13
CN101206834A (en) 2008-06-25

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