HK1166227A2 - Hidden pin type high-power led support and hidden pin type high-power led packaging sructure and technology using same - Google Patents

Hidden pin type high-power led support and hidden pin type high-power led packaging sructure and technology using same

Info

Publication number
HK1166227A2
HK1166227A2 HK12106269.7A HK12106269A HK1166227A2 HK 1166227 A2 HK1166227 A2 HK 1166227A2 HK 12106269 A HK12106269 A HK 12106269A HK 1166227 A2 HK1166227 A2 HK 1166227A2
Authority
HK
Hong Kong
Prior art keywords
power led
type high
pin type
base
conductive pins
Prior art date
Application number
HK12106269.7A
Other languages
English (en)
Inventor
Zhirong Lu
Yongzhi Huang
Original Assignee
Shenzhen Glory Sky Optoelectronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Glory Sky Optoelectronic Co Ltd filed Critical Shenzhen Glory Sky Optoelectronic Co Ltd
Publication of HK1166227A2 publication Critical patent/HK1166227A2/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Packaging Frangible Articles (AREA)
HK12106269.7A 2011-10-27 2012-06-27 Hidden pin type high-power led support and hidden pin type high-power led packaging sructure and technology using same HK1166227A2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110348509 2011-10-27

Publications (1)

Publication Number Publication Date
HK1166227A2 true HK1166227A2 (en) 2012-10-19

Family

ID=46414526

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12106269.7A HK1166227A2 (en) 2011-10-27 2012-06-27 Hidden pin type high-power led support and hidden pin type high-power led packaging sructure and technology using same

Country Status (5)

Country Link
US (1) US20130107462A1 (zh)
JP (1) JP3175656U (zh)
KR (1) KR20130002732U (zh)
CN (2) CN202523753U (zh)
HK (1) HK1166227A2 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013181896A1 (zh) * 2012-06-06 2013-12-12 深圳雷曼光电科技股份有限公司 用于表面贴装的led支架及制造方法、led灯
CN102820409A (zh) * 2012-08-13 2012-12-12 深圳市灏天光电有限公司 一种大功率led支架及大功率led封装结构
CN103000091B (zh) * 2012-12-19 2015-03-18 绍兴光彩显示技术有限公司 一种点胶压盖白光数码管及其生产工艺
CN103956423A (zh) * 2014-05-28 2014-07-30 安徽红叶节能电器科技有限公司 一种功率led热电分离封装结构及方法
CN104022193B (zh) * 2014-06-18 2017-04-05 厦门多彩光电子科技有限公司 无边框led的封装方法及装置
CN105841010A (zh) * 2016-03-31 2016-08-10 苏州汉克山姆照明科技有限公司 一种相片灯泡及其制作方法
CN105762254A (zh) * 2016-04-01 2016-07-13 宁波赛福特电子有限公司 一种立式贴片红外管封装结构

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7692206B2 (en) * 2002-12-06 2010-04-06 Cree, Inc. Composite leadframe LED package and method of making the same
US7211835B2 (en) * 2003-07-09 2007-05-01 Nichia Corporation Light emitting device, method of manufacturing the same and lighting equipment
JP3838572B2 (ja) * 2003-09-03 2006-10-25 松下電器産業株式会社 固体撮像装置およびその製造方法
TWM258416U (en) * 2004-06-04 2005-03-01 Lite On Technology Corp Power LED package module
KR100904152B1 (ko) * 2006-06-30 2009-06-25 서울반도체 주식회사 히트싱크 지지부를 갖는 리드프레임, 그것을 사용한 발광다이오드 패키지 제조방법 및 그것에 의해 제조된 발광다이오드 패키지
EP2147244B1 (en) * 2007-05-07 2015-12-02 Koninklijke Philips N.V. Led-based lighting fixtures for surface illumination with improved heat dissipation and manufacturability
US20090207617A1 (en) * 2008-02-20 2009-08-20 Merchant Viren B Light emitting diode (led) connector clip
TWI401788B (zh) * 2008-12-24 2013-07-11 Ind Tech Res Inst 發光二極體照明模組與封裝方法
JP2013506251A (ja) * 2009-09-25 2013-02-21 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 半導体照明装置
JP5367668B2 (ja) * 2009-11-17 2013-12-11 スタンレー電気株式会社 発光装置およびその製造方法
CN201608177U (zh) * 2010-02-05 2010-10-13 陈永华 发光二极管引线架结构
CN102062323A (zh) * 2010-11-05 2011-05-18 深圳市聚飞光电股份有限公司 Led灯条和led灯的制造方法
CN102130274A (zh) * 2010-12-14 2011-07-20 黄金鹿 一种透明荧光陶瓷封装的白光led光源
CN201994342U (zh) * 2011-03-11 2011-09-28 广东宏磊达光电科技有限公司 一种led支架

Also Published As

Publication number Publication date
CN202523753U (zh) 2012-11-07
CN102569604A (zh) 2012-07-11
JP3175656U (ja) 2012-05-24
KR20130002732U (ko) 2013-05-07
CN102569604B (zh) 2013-11-06
US20130107462A1 (en) 2013-05-02

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Legal Events

Date Code Title Description
PF2 Short-term patent ceased to have effect under s.126(2) (not payment of maintenance fee and has 6-month grace period to pay)

Effective date: 20160627