HK1158823A1 - Semiconductor die singulation method - Google Patents
Semiconductor die singulation methodInfo
- Publication number
- HK1158823A1 HK1158823A1 HK11113159.7A HK11113159A HK1158823A1 HK 1158823 A1 HK1158823 A1 HK 1158823A1 HK 11113159 A HK11113159 A HK 11113159A HK 1158823 A1 HK1158823 A1 HK 1158823A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- semiconductor die
- die singulation
- singulation method
- semiconductor
- singulation
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/689,098 US7989319B2 (en) | 2007-08-07 | 2010-01-18 | Semiconductor die singulation method |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1158823A1 true HK1158823A1 (en) | 2012-07-20 |
Family
ID=44268067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK11113159.7A HK1158823A1 (en) | 2010-01-18 | 2011-12-06 | Semiconductor die singulation method |
Country Status (4)
Country | Link |
---|---|
KR (4) | KR101751709B1 (en) |
CN (1) | CN102130047B (en) |
HK (1) | HK1158823A1 (en) |
TW (2) | TWI512897B (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8664089B1 (en) * | 2012-08-20 | 2014-03-04 | Semiconductor Components Industries, Llc | Semiconductor die singulation method |
US9136173B2 (en) * | 2012-11-07 | 2015-09-15 | Semiconductor Components Industries, Llc | Singulation method for semiconductor die having a layer of material along one major surface |
US9214423B2 (en) * | 2013-03-15 | 2015-12-15 | Semiconductor Components Industries, Llc | Method of forming a HEMT semiconductor device and structure therefor |
TWI671813B (en) * | 2013-11-13 | 2019-09-11 | 東芝股份有限公司 | Semiconductor wafer manufacturing method |
JP6441025B2 (en) | 2013-11-13 | 2018-12-19 | 株式会社東芝 | Manufacturing method of semiconductor chip |
US20150255349A1 (en) * | 2014-03-07 | 2015-09-10 | JAMES Matthew HOLDEN | Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processes |
JP6738591B2 (en) * | 2015-03-13 | 2020-08-12 | 古河電気工業株式会社 | Semiconductor wafer processing method, semiconductor chip, and surface protection tape |
JP6637831B2 (en) * | 2016-04-28 | 2020-01-29 | 株式会社ディスコ | Device manufacturing method and grinding device |
US11322464B2 (en) * | 2019-10-01 | 2022-05-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Film structure for bond pad |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5300461A (en) * | 1993-01-25 | 1994-04-05 | Intel Corporation | Process for fabricating sealed semiconductor chip using silicon nitride passivation film |
US5851928A (en) * | 1995-11-27 | 1998-12-22 | Motorola, Inc. | Method of etching a semiconductor substrate |
US7553700B2 (en) * | 2004-05-11 | 2009-06-30 | Gem Services, Inc. | Chemical-enhanced package singulation process |
DE102005039479B3 (en) * | 2005-08-18 | 2007-03-29 | Infineon Technologies Ag | Semiconductor device with thinned semiconductor chip and method for producing the thinned semiconductor device |
JP2007294612A (en) * | 2006-04-24 | 2007-11-08 | Oki Data Corp | Semiconductor device, manufacturing method thereof, semiconductor manufacturing apparatus, led head, and image forming apparatus |
US7482251B1 (en) * | 2006-08-10 | 2009-01-27 | Impinj, Inc. | Etch before grind for semiconductor die singulation |
TWI330868B (en) * | 2007-04-13 | 2010-09-21 | Siliconware Precision Industries Co Ltd | Semiconductor device and manufacturing method thereof |
US7585750B2 (en) * | 2007-05-04 | 2009-09-08 | Stats Chippac, Ltd. | Semiconductor package having through-hole via on saw streets formed with partial saw |
US7989319B2 (en) | 2007-08-07 | 2011-08-02 | Semiconductor Components Industries, Llc | Semiconductor die singulation method |
US7781310B2 (en) * | 2007-08-07 | 2010-08-24 | Semiconductor Components Industries, Llc | Semiconductor die singulation method |
-
2010
- 2010-11-24 TW TW099140643A patent/TWI512897B/en active
- 2010-11-24 TW TW104133305A patent/TWI601242B/en active
- 2010-11-25 CN CN201010559690.6A patent/CN102130047B/en not_active Expired - Fee Related
-
2011
- 2011-01-13 KR KR1020110003406A patent/KR101751709B1/en active IP Right Grant
- 2011-12-06 HK HK11113159.7A patent/HK1158823A1/en not_active IP Right Cessation
-
2017
- 2017-06-21 KR KR1020170078569A patent/KR20170075702A/en active Search and Examination
-
2019
- 2019-03-15 KR KR1020190029712A patent/KR20190032319A/en not_active Application Discontinuation
-
2020
- 2020-01-22 KR KR1020200008235A patent/KR20200011519A/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR20190032319A (en) | 2019-03-27 |
KR20170075702A (en) | 2017-07-03 |
KR20200011519A (en) | 2020-02-03 |
TW201603194A (en) | 2016-01-16 |
CN102130047B (en) | 2014-12-17 |
KR101751709B1 (en) | 2017-06-28 |
CN102130047A (en) | 2011-07-20 |
KR20110084828A (en) | 2011-07-26 |
TWI601242B (en) | 2017-10-01 |
TW201126648A (en) | 2011-08-01 |
TWI512897B (en) | 2015-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20211123 |