HK1155821A1 - Exposure apparatus, exposure method, and device manufacturing method - Google Patents
Exposure apparatus, exposure method, and device manufacturing methodInfo
- Publication number
- HK1155821A1 HK1155821A1 HK11110125.4A HK11110125A HK1155821A1 HK 1155821 A1 HK1155821 A1 HK 1155821A1 HK 11110125 A HK11110125 A HK 11110125A HK 1155821 A1 HK1155821 A1 HK 1155821A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- exposure
- device manufacturing
- exposure apparatus
- exposure method
- manufacturing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US7169608P | 2008-05-13 | 2008-05-13 | |
US12/463,730 US8786829B2 (en) | 2008-05-13 | 2009-05-11 | Exposure apparatus, exposure method, and device manufacturing method |
PCT/JP2009/059235 WO2009139494A1 (en) | 2008-05-13 | 2009-05-13 | Exposure apparatus, exposure method, and device manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1155821A1 true HK1155821A1 (en) | 2012-05-25 |
Family
ID=41315837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK11110125.4A HK1155821A1 (en) | 2008-05-13 | 2011-09-26 | Exposure apparatus, exposure method, and device manufacturing method |
Country Status (7)
Country | Link |
---|---|
US (1) | US8786829B2 (xx) |
JP (1) | JP2009278097A (xx) |
KR (1) | KR20110020813A (xx) |
CN (1) | CN102067038B (xx) |
HK (1) | HK1155821A1 (xx) |
TW (1) | TW200951644A (xx) |
WO (1) | WO2009139494A1 (xx) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8599359B2 (en) | 2008-12-19 | 2013-12-03 | Nikon Corporation | Exposure apparatus, exposure method, device manufacturing method, and carrier method |
US8902402B2 (en) | 2008-12-19 | 2014-12-02 | Nikon Corporation | Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method |
US8773635B2 (en) * | 2008-12-19 | 2014-07-08 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
US8760629B2 (en) | 2008-12-19 | 2014-06-24 | Nikon Corporation | Exposure apparatus including positional measurement system of movable body, exposure method of exposing object including measuring positional information of movable body, and device manufacturing method that includes exposure method of exposing object, including measuring positional information of movable body |
US8488109B2 (en) | 2009-08-25 | 2013-07-16 | Nikon Corporation | Exposure method, exposure apparatus, and device manufacturing method |
US8493547B2 (en) | 2009-08-25 | 2013-07-23 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
US20110096306A1 (en) * | 2009-09-28 | 2011-04-28 | Nikon Corporation | Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method |
US20110102761A1 (en) * | 2009-09-28 | 2011-05-05 | Nikon Corporation | Stage apparatus, exposure apparatus, and device fabricating method |
US20110096312A1 (en) * | 2009-09-28 | 2011-04-28 | Nikon Corporation | Exposure apparatus and device fabricating method |
US20110096318A1 (en) * | 2009-09-28 | 2011-04-28 | Nikon Corporation | Exposure apparatus and device fabricating method |
US20110128523A1 (en) * | 2009-11-19 | 2011-06-02 | Nikon Corporation | Stage apparatus, exposure apparatus, driving method, exposing method, and device fabricating method |
US20110123913A1 (en) * | 2009-11-19 | 2011-05-26 | Nikon Corporation | Exposure apparatus, exposing method, and device fabricating method |
US8488106B2 (en) * | 2009-12-28 | 2013-07-16 | Nikon Corporation | Movable body drive method, movable body apparatus, exposure method, exposure apparatus, and device manufacturing method |
WO2013073538A1 (ja) | 2011-11-17 | 2013-05-23 | 株式会社ニコン | エンコーダ装置、移動量計測方法、光学装置、並びに露光方法及び装置 |
US9207549B2 (en) | 2011-12-29 | 2015-12-08 | Nikon Corporation | Exposure apparatus and exposure method, and device manufacturing method with encoder of higher reliability for position measurement |
DE102012210309A1 (de) * | 2012-06-19 | 2013-12-19 | Dr. Johannes Heidenhain Gmbh | Positionsmesseinrichtung |
JP6381184B2 (ja) * | 2013-07-09 | 2018-08-29 | キヤノン株式会社 | 校正方法、測定装置、露光装置および物品の製造方法 |
US9529280B2 (en) * | 2013-12-06 | 2016-12-27 | Kla-Tencor Corporation | Stage apparatus for semiconductor inspection and lithography systems |
CN106415397B (zh) * | 2014-03-28 | 2018-09-21 | 株式会社尼康 | 移动体装置、曝光装置、平板显示器的制造方法、组件制造方法及移动体驱动方法 |
EP3742109A1 (en) | 2015-02-23 | 2020-11-25 | Nikon Corporation | Measurement device, lithography system and exposure apparatus, and device manufacturing method |
JP6719729B2 (ja) | 2015-02-23 | 2020-07-08 | 株式会社ニコン | 基板処理システム及び基板処理方法、並びにデバイス製造方法 |
KR20230130161A (ko) | 2015-02-23 | 2023-09-11 | 가부시키가이샤 니콘 | 계측 장치, 리소그래피 시스템 및 노광 장치, 그리고 관리 방법, 중첩 계측 방법 및 디바이스 제조 방법 |
TWI763834B (zh) * | 2017-04-26 | 2022-05-11 | 日商尼康股份有限公司 | 反射系統、微影曝光工具、在工件上形成條紋圖案的方法及微器件的製造方法 |
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US7636165B2 (en) * | 2006-03-21 | 2009-12-22 | Asml Netherlands B.V. | Displacement measurement systems lithographic apparatus and device manufacturing method |
US7483120B2 (en) * | 2006-05-09 | 2009-01-27 | Asml Netherlands B.V. | Displacement measurement system, lithographic apparatus, displacement measurement method and device manufacturing method |
TWI653511B (zh) * | 2006-08-31 | 2019-03-11 | 日商尼康股份有限公司 | Exposure apparatus, exposure method, and component manufacturing method |
TWI572995B (zh) * | 2006-08-31 | 2017-03-01 | 尼康股份有限公司 | Exposure method and exposure apparatus, and component manufacturing method |
CN103645608B (zh) * | 2006-08-31 | 2016-04-20 | 株式会社尼康 | 曝光装置及方法、组件制造方法以及决定方法 |
KR101660668B1 (ko) * | 2006-09-01 | 2016-09-27 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법 |
TWI652720B (zh) * | 2006-09-01 | 2019-03-01 | 日商尼康股份有限公司 | Exposure method and device and component manufacturing method |
US7714981B2 (en) * | 2006-10-30 | 2010-05-11 | Asml Netherlands B.V. | Lithographic apparatus and method |
US7619207B2 (en) * | 2006-11-08 | 2009-11-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7903866B2 (en) * | 2007-03-29 | 2011-03-08 | Asml Netherlands B.V. | Measurement system, lithographic apparatus and method for measuring a position dependent signal of a movable object |
US7710540B2 (en) * | 2007-04-05 | 2010-05-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US8098362B2 (en) * | 2007-05-30 | 2012-01-17 | Nikon Corporation | Detection device, movable body apparatus, pattern formation apparatus and pattern formation method, exposure apparatus and exposure method, and device manufacturing method |
US8237916B2 (en) * | 2007-12-28 | 2012-08-07 | Nikon Corporation | Movable body drive system, pattern formation apparatus, exposure apparatus and exposure method, and device manufacturing method |
US8228482B2 (en) * | 2008-05-13 | 2012-07-24 | Nikon Corporation | Exposure apparatus, exposure method, and device manufacturing method |
-
2009
- 2009-05-11 US US12/463,730 patent/US8786829B2/en active Active
- 2009-05-13 JP JP2009116049A patent/JP2009278097A/ja active Pending
- 2009-05-13 TW TW098115770A patent/TW200951644A/zh unknown
- 2009-05-13 WO PCT/JP2009/059235 patent/WO2009139494A1/en active Application Filing
- 2009-05-13 CN CN200980117083.XA patent/CN102067038B/zh active Active
- 2009-05-13 KR KR1020107028025A patent/KR20110020813A/ko not_active Application Discontinuation
-
2011
- 2011-09-26 HK HK11110125.4A patent/HK1155821A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200951644A (en) | 2009-12-16 |
WO2009139494A1 (en) | 2009-11-19 |
US20090284717A1 (en) | 2009-11-19 |
KR20110020813A (ko) | 2011-03-03 |
CN102067038B (zh) | 2013-04-24 |
CN102067038A (zh) | 2011-05-18 |
US8786829B2 (en) | 2014-07-22 |
JP2009278097A (ja) | 2009-11-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20230511 |