HK1151562A1 - Method for obtaining a metal microstructure and microstructure obtained according to said method - Google Patents

Method for obtaining a metal microstructure and microstructure obtained according to said method

Info

Publication number
HK1151562A1
HK1151562A1 HK11105663.2A HK11105663A HK1151562A1 HK 1151562 A1 HK1151562 A1 HK 1151562A1 HK 11105663 A HK11105663 A HK 11105663A HK 1151562 A1 HK1151562 A1 HK 1151562A1
Authority
HK
Hong Kong
Prior art keywords
microstructure
metal
obtaining
obtained according
layer
Prior art date
Application number
HK11105663.2A
Other languages
English (en)
Inventor
Jean-Charles Fiaccabrino
Original Assignee
Nivarox Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nivarox Sa filed Critical Nivarox Sa
Publication of HK1151562A1 publication Critical patent/HK1151562A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/006—Nanostructures, e.g. using aluminium anodic oxidation templates [AAO]
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/024—Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/005—Jewels; Clockworks; Coins
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/10—Bearings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Micromachines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
HK11105663.2A 2007-12-31 2011-06-07 Method for obtaining a metal microstructure and microstructure obtained according to said method HK1151562A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH02036/07A CH704572B1 (fr) 2007-12-31 2007-12-31 Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé.
PCT/EP2008/067969 WO2009083488A1 (fr) 2007-12-31 2008-12-19 Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé

Publications (1)

Publication Number Publication Date
HK1151562A1 true HK1151562A1 (en) 2012-02-03

Family

ID=40590002

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11105663.2A HK1151562A1 (en) 2007-12-31 2011-06-07 Method for obtaining a metal microstructure and microstructure obtained according to said method

Country Status (10)

Country Link
US (1) US8557506B2 (xx)
EP (1) EP2229470B1 (xx)
JP (1) JP5559699B2 (xx)
KR (1) KR20100098425A (xx)
CN (1) CN101918617B (xx)
AT (1) ATE533873T1 (xx)
CH (1) CH704572B1 (xx)
HK (1) HK1151562A1 (xx)
RU (1) RU2481422C2 (xx)
WO (1) WO2009083488A1 (xx)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2405300A1 (fr) 2010-07-09 2012-01-11 Mimotec S.A. Méthode de fabrication de pièces métalliques multi niveaux par un procédé du type LIGA et pièces obtenues par la méthode
CN102478765A (zh) * 2011-05-10 2012-05-30 深圳光启高等理工研究院 一种制备微结构的方法
JP5854875B2 (ja) * 2012-02-21 2016-02-09 セイコーインスツル株式会社 電鋳部品
JP6211754B2 (ja) * 2012-09-28 2017-10-11 セイコーインスツル株式会社 機械部品の製造方法、及び機械部品
CN104756209A (zh) * 2012-10-30 2015-07-01 株式会社Ｌｅａｐ 线圈元件的制造方法
JP5294288B1 (ja) * 2012-10-30 2013-09-18 株式会社Ｌｅａｐ 樹脂基板を用い、電気鋳造によりコイル素子を製造する方法
EP3171229A1 (fr) * 2015-11-19 2017-05-24 Nivarox-FAR S.A. Composant d' horlogerie
HK1220859A2 (zh) * 2016-02-29 2017-05-12 Master Dynamic Ltd 製作工藝
CN106000489A (zh) * 2016-06-30 2016-10-12 中国科学院重庆绿色智能技术研究院 一种微通孔列阵生物芯片的热刺穿制作方法
EP3266738B1 (fr) * 2016-07-06 2019-03-06 The Swatch Group Research and Development Ltd. Procédé de fabrication d'une pièce d'horlogerie dotée d'un élément d'habillage multi-niveaux
JP6703674B2 (ja) * 2016-09-21 2020-06-03 株式会社東海理化電機製作所 Ｍｅｍｓ装置の製造方法
JP7102778B2 (ja) * 2018-02-27 2022-07-20 セイコーエプソン株式会社 時計用ムーブメントおよび時計
CH714739A2 (fr) * 2018-03-09 2019-09-13 Swatch Group Res & Dev Ltd Procédé de fabrication d’un décor métallique sur un cadran et cadran obtenu selon ce procédé.
EP3575447A1 (fr) * 2018-05-28 2019-12-04 The Swatch Group Research and Development Ltd Procede de fabrication d'un decor metallique sur un cadran et cadran obtenu selon ce procede
EP3670441A1 (fr) 2018-12-21 2020-06-24 Rolex Sa Procédé de fabrication d'un composant horloger
EP3670440A1 (fr) * 2018-12-21 2020-06-24 Rolex Sa Procédé de fabrication d'un composant horloger
EP3839626B1 (fr) * 2019-12-18 2023-10-11 Nivarox-FAR S.A. Procede de fabrication d'un composant horloger
EP3839625A1 (fr) * 2019-12-18 2021-06-23 Nivarox-FAR S.A. Procede de fabrication d'un composant horloger et composant obtenu selon ce procede
EP3839624B1 (fr) * 2019-12-18 2023-09-13 Nivarox-FAR S.A. Procede de fabrication d'un composant horloger
CN113060701A (zh) * 2021-04-30 2021-07-02 苏州华易航动力科技有限公司 一种蒸发冷却微结构的制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4058401A (en) 1974-05-02 1977-11-15 General Electric Company Photocurable compositions containing group via aromatic onium salts
JPS57171682A (en) * 1981-04-14 1982-10-22 Citizen Watch Co Ltd Manufacture of display plate for timepiece
RU2050423C1 (ru) * 1989-05-23 1995-12-20 Геннадий Ильич Шпаков Гальванопластический способ изготовления деталей, преимущественно матриц пресс-форм
US5190637A (en) * 1992-04-24 1993-03-02 Wisconsin Alumni Research Foundation Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers
DE19607277A1 (de) * 1995-03-29 1996-10-02 Bosch Gmbh Robert Lochscheibe, insbesondere für Einspritzventile
US6136513A (en) * 1997-06-13 2000-10-24 International Business Machines Corporation Method of uniformly depositing seed and a conductor and the resultant printed circuit structure
SE523309E (sv) * 2001-06-15 2010-03-02 Replisaurus Technologies Ab Metod, elektrod och apparat för att skapa mikro- och nanostrukturer i ledande material genom mönstring med masterelektrod och elektrolyt
WO2003095712A2 (en) * 2002-05-07 2003-11-20 University Of Southern California Method of and apparatus for forming three-dimensional structures integral with semiconductor based circuitry
EP1596259A1 (de) * 2004-05-10 2005-11-16 Precision Engineering AG Verfahren zum Herstellen von metallischen Körpern geringer Höhe, insbesondere von Uhrenbestandteilen
EP1835050A1 (fr) * 2006-03-15 2007-09-19 Doniar S.A. Procédé de fabrication par LIGA-UV d'une structure métallique multicouche à couches adjacentes non entièrement superposées, et structure obtenue
DE06405114T1 (de) * 2006-03-15 2008-04-24 Doniar S.A. LIGA Verfahren zur Herstellung einer einzel- oder mehrlagigen metallischen Struktur und damit hergestellte Struktur

Also Published As

Publication number Publication date
EP2229470B1 (fr) 2011-11-16
ATE533873T1 (de) 2011-12-15
JP2011521098A (ja) 2011-07-21
RU2010132147A (ru) 2012-02-10
US20110020754A1 (en) 2011-01-27
KR20100098425A (ko) 2010-09-06
EP2229470A1 (fr) 2010-09-22
CN101918617B (zh) 2012-05-02
JP5559699B2 (ja) 2014-07-23
US8557506B2 (en) 2013-10-15
RU2481422C2 (ru) 2013-05-10
WO2009083488A1 (fr) 2009-07-09
CH704572B1 (fr) 2012-09-14
CN101918617A (zh) 2010-12-15

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