HK1137894A1 - Led with integral thermal via - Google Patents

Led with integral thermal via

Info

Publication number
HK1137894A1
HK1137894A1 HK10102560.4A HK10102560A HK1137894A1 HK 1137894 A1 HK1137894 A1 HK 1137894A1 HK 10102560 A HK10102560 A HK 10102560A HK 1137894 A1 HK1137894 A1 HK 1137894A1
Authority
HK
Hong Kong
Prior art keywords
led
thermal via
integral thermal
integral
thermal
Prior art date
Application number
HK10102560.4A
Other languages
English (en)
Inventor
Bradley E Reis
James R Cartiglia
Original Assignee
Graftech Int Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Graftech Int Holdings Inc filed Critical Graftech Int Holdings Inc
Publication of HK1137894A1 publication Critical patent/HK1137894A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Details Of Measuring Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Radiation-Therapy Devices (AREA)
  • Pinball Game Machines (AREA)
HK10102560.4A 2006-03-10 2010-03-11 Led with integral thermal via HK1137894A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/377,662 US7505275B2 (en) 2005-11-04 2006-03-10 LED with integral via
PCT/US2007/062642 WO2007106653A2 (en) 2006-03-10 2007-02-23 Led with integral thermal via

Publications (1)

Publication Number Publication Date
HK1137894A1 true HK1137894A1 (en) 2010-08-06

Family

ID=38510141

Family Applications (1)

Application Number Title Priority Date Filing Date
HK10102560.4A HK1137894A1 (en) 2006-03-10 2010-03-11 Led with integral thermal via

Country Status (8)

Country Link
US (1) US7505275B2 (xx)
EP (1) EP1994813A4 (xx)
JP (1) JP2010511289A (xx)
KR (1) KR101219566B1 (xx)
CN (1) CN101536623B (xx)
HK (1) HK1137894A1 (xx)
TW (1) TW200742133A (xx)
WO (1) WO2007106653A2 (xx)

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TWI566673B (zh) * 2012-08-20 2017-01-11 鴻準精密工業股份有限公司 散熱器組合
CN102809130A (zh) * 2012-09-18 2012-12-05 梁首强 一种高效散热led灯具的制备方法及灯具
WO2015066069A1 (en) 2013-10-28 2015-05-07 Next Lighting Corp. Linear lamp replacement
US9883580B1 (en) 2014-04-11 2018-01-30 Adura Led Solutions, Llc Printed circuit board that provides a direct thermal path between components and a thermal layer and method for assembly
EP3316292B1 (en) * 2015-06-26 2021-04-28 Kaneka Corporation Heat transfer structure and manufacturing method therefor
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Also Published As

Publication number Publication date
WO2007106653A2 (en) 2007-09-20
US20070139895A1 (en) 2007-06-21
TW200742133A (en) 2007-11-01
KR101219566B1 (ko) 2013-01-18
CN101536623A (zh) 2009-09-16
KR20080102300A (ko) 2008-11-24
EP1994813A4 (en) 2010-04-14
CN101536623B (zh) 2013-01-02
EP1994813A2 (en) 2008-11-26
US7505275B2 (en) 2009-03-17
JP2010511289A (ja) 2010-04-08
WO2007106653A3 (en) 2009-04-02

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190218