HK1133420A1 - Potassium monopersulfate solutions - Google Patents
Potassium monopersulfate solutionsInfo
- Publication number
- HK1133420A1 HK1133420A1 HK09111434.2A HK09111434A HK1133420A1 HK 1133420 A1 HK1133420 A1 HK 1133420A1 HK 09111434 A HK09111434 A HK 09111434A HK 1133420 A1 HK1133420 A1 HK 1133420A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- potassium monopersulfate
- monopersulfate solutions
- solutions
- potassium
- monopersulfate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
- C01B15/055—Peroxyhydrates; Peroxyacids or salts thereof
- C01B15/06—Peroxyhydrates; Peroxyacids or salts thereof containing sulfur
- C01B15/08—Peroxysulfates
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
- C01B15/055—Peroxyhydrates; Peroxyacids or salts thereof
- C01B15/06—Peroxyhydrates; Peroxyacids or salts thereof containing sulfur
- C01B15/08—Peroxysulfates
- C01B15/085—Stabilisation of the solid compounds, subsequent to the preparation or to the crystallisation, by additives or by coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Detergent Compositions (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Agricultural Chemicals And Associated Chemicals (AREA)
- Treatment Of Water By Oxidation Or Reduction (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/445,610 US7442323B2 (en) | 2006-06-02 | 2006-06-02 | Potassium monopersulfate solutions |
PCT/US2007/012995 WO2007143127A1 (en) | 2006-06-02 | 2007-06-01 | Potassium monopersulfate solutions |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1133420A1 true HK1133420A1 (en) | 2010-03-26 |
Family
ID=38566311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK09111434.2A HK1133420A1 (en) | 2006-06-02 | 2009-12-07 | Potassium monopersulfate solutions |
Country Status (11)
Country | Link |
---|---|
US (2) | US7442323B2 (xx) |
EP (1) | EP2024281B1 (xx) |
JP (1) | JP5292285B2 (xx) |
KR (1) | KR101397363B1 (xx) |
CN (1) | CN101460397B (xx) |
CA (1) | CA2652151C (xx) |
DE (1) | DE602007008400D1 (xx) |
HK (1) | HK1133420A1 (xx) |
MY (2) | MY156749A (xx) |
TW (1) | TWI349648B (xx) |
WO (1) | WO2007143127A1 (xx) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100239678A1 (en) * | 2006-07-18 | 2010-09-23 | Ali Razavi | Ionically functionalized nanodiamonds |
TW200927918A (en) * | 2007-08-20 | 2009-07-01 | Advanced Tech Materials | Composition and method for removing ion-implanted photoresist |
JP2011520142A (ja) * | 2008-05-01 | 2011-07-14 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 高密度注入レジストの除去のための低pH混合物 |
TWI480360B (zh) | 2009-04-03 | 2015-04-11 | Du Pont | 蝕刻劑組成物及方法 |
JP5340071B2 (ja) * | 2009-08-03 | 2013-11-13 | 株式会社Adeka | 安定剤を含むペルオキシ一硫酸水溶液の製造方法 |
US10383894B2 (en) * | 2010-03-17 | 2019-08-20 | Lutran Industries, Inc. | Human medicinal treatment using salt of peroxymonosulfuric acid |
US20120074014A1 (en) * | 2010-09-27 | 2012-03-29 | Lutran Industries, Inc. | Product typically based on salt of peroxymonosulfuric acid and suitable for medicinal usage, and associated product fabrication |
WO2011116180A1 (en) * | 2010-03-18 | 2011-09-22 | Dow Global Technologies Llc | Process for preparing divinylarene dioxides |
CN102296293B (zh) * | 2011-06-24 | 2015-01-07 | 李沛泓 | 印刷线路板微蚀刻剂 |
JP5885971B2 (ja) * | 2011-09-08 | 2016-03-16 | 関東化學株式会社 | 銅および銅合金のエッチング液 |
US20150104938A1 (en) * | 2013-10-16 | 2015-04-16 | United Microelectronics Corporation | Method for forming damascene opening and applications thereof |
JP2016104474A (ja) * | 2014-08-22 | 2016-06-09 | 有限会社情報科学研究所 | 共鳴発泡と真空キャビテーションによるウルトラファインバブル製造方法及びウルトラファインバブル水製造装置。 |
WO2016074750A1 (en) | 2014-11-13 | 2016-05-19 | Gerresheimer Glas Gmbh | Glass forming machine particle filter, a plunger unit, a blow head, a blow head support and a glass forming machine adapted to or comprising said filter |
CN108950558A (zh) * | 2018-08-27 | 2018-12-07 | 深圳市星扬高新科技有限公司 | 一种铜制件表面粗化剂 |
CN110172349B (zh) * | 2019-05-08 | 2020-11-20 | 厦门大学 | 一种氮化镓半导体光电化学刻蚀液及加工方法 |
FR3102008B1 (fr) * | 2019-10-10 | 2021-09-24 | Commissariat Energie Atomique | Procede de recyclage des batteries li-ion |
CN111039309A (zh) * | 2019-12-31 | 2020-04-21 | 中船重工(邯郸)派瑞特种气体有限公司 | 一种分离硫酸氢钾和硫酸钾混合物的装置及方法 |
CN111662641B (zh) * | 2020-06-30 | 2021-10-26 | 中国科学院上海微系统与信息技术研究所 | 一种高选择比的化学机械抛光液及其应用 |
KR102581261B1 (ko) * | 2021-03-04 | 2023-09-21 | 우석대학교 산학협력단 | 습윤 옥손을 이용한 비시날 트라이카보닐 화합물의 제조방법 |
CN115124204A (zh) * | 2022-06-16 | 2022-09-30 | 安徽省交通航务工程有限公司 | 一种实现疏浚泥浆快速泥水分离的处理方法 |
CN116235863A (zh) * | 2023-01-04 | 2023-06-09 | 四川省畜牧科学研究院 | 一种耐分解的消毒剂 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3555147A (en) | 1967-12-19 | 1971-01-12 | Fmc Corp | Peroxydiphosphate neutralizer for hair waving |
US3805809A (en) | 1972-10-02 | 1974-04-23 | Procter & Gamble | Hair setting process |
EP0149329B1 (en) * | 1983-12-30 | 1992-04-15 | E.I. Du Pont De Nemours And Company | Potassium monopersulfate compositions and process for preparing them |
DE4014655A1 (de) * | 1990-05-08 | 1991-11-14 | Behringwerke Ag | Peptidamide, verfahren zu deren herstellung und diese enthaltende mittel als fibrin/thrombin-gerinnungsinhibitoren |
DE4020856A1 (de) | 1990-06-29 | 1992-01-09 | Degussa | Verfahren zur herstellung von lagerstabilen waessrigen natriumperoxomonosulfatloesungen |
US5139763A (en) * | 1991-03-06 | 1992-08-18 | E. I. Du Pont De Nemours And Company | Class of stable potassium monopersulfate compositions |
DE19503900C1 (de) | 1995-02-07 | 1995-11-23 | Degussa | Verfahren zur Herstellung des Kaliumperoxomonosulfat-Tripelsalzes 2 KHSO¶5¶ . KHSO¶4¶ . K¶2¶SO¶4¶ |
JP4767401B2 (ja) * | 2000-10-30 | 2011-09-07 | ルネサスエレクトロニクス株式会社 | 半導体記憶装置及びその製造方法 |
US6974777B2 (en) * | 2002-06-07 | 2005-12-13 | Cabot Microelectronics Corporation | CMP compositions for low-k dielectric materials |
TW200417628A (en) * | 2002-09-09 | 2004-09-16 | Shipley Co Llc | Improved cleaning composition |
US6818142B2 (en) * | 2003-03-31 | 2004-11-16 | E. I. Du Pont De Nemours And Company | Potassium hydrogen peroxymonosulfate solutions |
US7090820B2 (en) * | 2003-09-23 | 2006-08-15 | Truox, Inc. | Potassium monopersulfate triple salt with increased active oxygen content and substantially no K2S2O8 |
US20050063895A1 (en) | 2003-09-23 | 2005-03-24 | Martin Perry L. | Production of potassium monopersulfate triple salt using oleum |
US20060013750A1 (en) * | 2004-07-16 | 2006-01-19 | Martin Perry L | Solvent-activated reactor |
CN1778669A (zh) * | 2004-11-22 | 2006-05-31 | 上海嘉源实业有限公司 | 一种单过硫酸氢钾的制备方法 |
-
2006
- 2006-06-02 US US11/445,610 patent/US7442323B2/en active Active
-
2007
- 2007-05-08 MY MYPI2010001723A patent/MY156749A/en unknown
- 2007-05-08 MY MYPI20070707A patent/MY142427A/en unknown
- 2007-05-14 TW TW096117073A patent/TWI349648B/zh active
- 2007-06-01 CA CA2652151A patent/CA2652151C/en active Active
- 2007-06-01 WO PCT/US2007/012995 patent/WO2007143127A1/en active Search and Examination
- 2007-06-01 KR KR1020087031909A patent/KR101397363B1/ko active IP Right Grant
- 2007-06-01 JP JP2009513306A patent/JP5292285B2/ja active Active
- 2007-06-01 EP EP07777364A patent/EP2024281B1/en active Active
- 2007-06-01 DE DE602007008400T patent/DE602007008400D1/de active Active
- 2007-06-01 CN CN200780020437XA patent/CN101460397B/zh active Active
-
2008
- 2008-09-10 US US12/207,733 patent/US8123970B2/en active Active
-
2009
- 2009-12-07 HK HK09111434.2A patent/HK1133420A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
EP2024281A1 (en) | 2009-02-18 |
US20070278182A1 (en) | 2007-12-06 |
MY156749A (en) | 2016-03-31 |
CA2652151C (en) | 2015-08-04 |
WO2007143127A1 (en) | 2007-12-13 |
EP2024281B1 (en) | 2010-08-11 |
JP2009539740A (ja) | 2009-11-19 |
DE602007008400D1 (de) | 2010-09-23 |
MY142427A (en) | 2010-11-30 |
CA2652151A1 (en) | 2007-12-13 |
US7442323B2 (en) | 2008-10-28 |
JP5292285B2 (ja) | 2013-09-18 |
TWI349648B (en) | 2011-10-01 |
TW200804174A (en) | 2008-01-16 |
KR20090016003A (ko) | 2009-02-12 |
US20090008601A1 (en) | 2009-01-08 |
KR101397363B1 (ko) | 2014-05-19 |
US8123970B2 (en) | 2012-02-28 |
CN101460397B (zh) | 2011-07-06 |
CN101460397A (zh) | 2009-06-17 |
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