HK1125741A1 - Device and method for holding a substrate - Google Patents

Device and method for holding a substrate

Info

Publication number
HK1125741A1
HK1125741A1 HK09104025.2A HK09104025A HK1125741A1 HK 1125741 A1 HK1125741 A1 HK 1125741A1 HK 09104025 A HK09104025 A HK 09104025A HK 1125741 A1 HK1125741 A1 HK 1125741A1
Authority
HK
Hong Kong
Prior art keywords
holding
substrate
Prior art date
Application number
HK09104025.2A
Other languages
English (en)
Inventor
Richardo I Fuentes
Original Assignee
Materials And Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Materials And Technologies Corp filed Critical Materials And Technologies Corp
Publication of HK1125741A1 publication Critical patent/HK1125741A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
HK09104025.2A 2005-11-23 2009-04-30 Device and method for holding a substrate HK1125741A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US73912805P 2005-11-23 2005-11-23
PCT/US2006/045353 WO2007062199A2 (en) 2005-11-23 2006-11-22 Device and method for holding a substrate

Publications (1)

Publication Number Publication Date
HK1125741A1 true HK1125741A1 (en) 2009-08-14

Family

ID=38067946

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09104025.2A HK1125741A1 (en) 2005-11-23 2009-04-30 Device and method for holding a substrate

Country Status (9)

Country Link
US (1) US9011064B2 (zh)
EP (1) EP1955369B1 (zh)
JP (1) JP4943448B2 (zh)
CN (1) CN101366110B (zh)
CA (1) CA2630807A1 (zh)
DK (1) DK1955369T3 (zh)
ES (1) ES2401845T3 (zh)
HK (1) HK1125741A1 (zh)
WO (1) WO2007062199A2 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8852383B2 (en) * 1999-09-29 2014-10-07 Materials And Technologies Corporation Wet processing using a fluid meniscus apparatus
EP2244987A4 (en) * 2008-02-22 2013-07-31 Materials And Technologies Corp HIGH EFFICIENCY MONOFACE WET ENGRAVING AND WET TREATMENT APPARATUS AND METHOD
CN102059225A (zh) * 2010-11-23 2011-05-18 南通富士通微电子股份有限公司 清洗机圆片保护装置
CN103600954B (zh) * 2013-10-11 2015-10-07 京东方科技集团股份有限公司 一种掩模板搬运治具
CN107492508A (zh) * 2016-06-12 2017-12-19 奇勗科技股份有限公司 一种基板处理设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09107023A (ja) * 1995-10-13 1997-04-22 Toshiba Microelectron Corp 被処理物の回転保持装置
US5669977A (en) * 1995-12-22 1997-09-23 Lam Research Corporation Shape memory alloy lift pins for semiconductor processing equipment
CN1272956A (zh) 1997-09-30 2000-11-08 塞米图尔公司 在微电子元件的制造过程中用于控制工件表面暴露于处理液的装置和方法
KR20010024368A (ko) * 1997-09-30 2001-03-26 세미툴 인코포레이티드 접촉식 세정 작업을 위한 주 반응 챔버 외측에 보조전극을 구비하는 전기도금 시스템
JP2001110771A (ja) 1999-10-08 2001-04-20 Ebara Corp 基板洗浄装置及び基板処理装置
JP3958572B2 (ja) * 2001-12-26 2007-08-15 東京エレクトロン株式会社 基板処理装置及び基板処理方法
US7078344B2 (en) * 2003-03-14 2006-07-18 Lam Research Corporation Stress free etch processing in combination with a dynamic liquid meniscus

Also Published As

Publication number Publication date
ES2401845T3 (es) 2013-04-25
WO2007062199A3 (en) 2007-12-27
CN101366110B (zh) 2011-04-13
EP1955369A2 (en) 2008-08-13
US9011064B2 (en) 2015-04-21
DK1955369T3 (da) 2013-01-28
EP1955369A4 (en) 2011-11-02
JP4943448B2 (ja) 2012-05-30
WO2007062199A2 (en) 2007-05-31
US20070116551A1 (en) 2007-05-24
EP1955369B1 (en) 2012-10-24
JP2009517866A (ja) 2009-04-30
CN101366110A (zh) 2009-02-11
CA2630807A1 (en) 2007-05-31

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20161122