HK1122403A1 - Light reflecting material, package for light emitting element accommodation, light emitting device and process for producing package for light emitting element accommodation - Google Patents

Light reflecting material, package for light emitting element accommodation, light emitting device and process for producing package for light emitting element accommodation

Info

Publication number
HK1122403A1
HK1122403A1 HK09102571.4A HK09102571A HK1122403A1 HK 1122403 A1 HK1122403 A1 HK 1122403A1 HK 09102571 A HK09102571 A HK 09102571A HK 1122403 A1 HK1122403 A1 HK 1122403A1
Authority
HK
Hong Kong
Prior art keywords
light emitting
emitting element
package
element accommodation
light
Prior art date
Application number
HK09102571.4A
Other languages
English (en)
Inventor
Keiichi Kishimoto
Makoto Ida
Yoshiaki Teraishi
Original Assignee
Nippon Carbide Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Carbide Kogyo Kk filed Critical Nippon Carbide Kogyo Kk
Publication of HK1122403A1 publication Critical patent/HK1122403A1/xx

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • C04B35/111—Fine ceramics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
    • C04B2235/3215—Barium oxides or oxide-forming salts thereof
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/54—Particle size related information
    • C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
    • C04B2235/5445—Particle size related information expressed by the size of the particles or aggregates thereof submicron sized, i.e. from 0,1 to 1 micron
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/602—Making the green bodies or pre-forms by moulding
    • C04B2235/6025—Tape casting, e.g. with a doctor blade
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/61—Mechanical properties, e.g. fracture toughness, hardness, Young's modulus or strength
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74—Physical characteristics
    • C04B2235/78—Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
    • C04B2235/785—Submicron sized grains, i.e. from 0,1 to 1 micron
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74—Physical characteristics
    • C04B2235/78—Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
    • C04B2235/786—Micrometer sized grains, i.e. from 1 to 100 micron
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C04B2235/9646—Optical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Oxide Ceramics (AREA)
HK09102571.4A 2005-11-21 2009-03-18 Light reflecting material, package for light emitting element accommodation, light emitting device and process for producing package for light emitting element accommodation HK1122403A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005335599 2005-11-21
PCT/JP2006/323233 WO2007058361A1 (ja) 2005-11-21 2006-11-21 光反射用材料、発光素子収納用パッケージ、発光装置及び発光素子収納用パッケージの製造方法

Publications (1)

Publication Number Publication Date
HK1122403A1 true HK1122403A1 (en) 2009-05-15

Family

ID=38048739

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09102571.4A HK1122403A1 (en) 2005-11-21 2009-03-18 Light reflecting material, package for light emitting element accommodation, light emitting device and process for producing package for light emitting element accommodation

Country Status (8)

Country Link
US (2) US20090152581A1 (ko)
EP (1) EP1953836B1 (ko)
JP (1) JP4729583B2 (ko)
KR (1) KR101066322B1 (ko)
CN (1) CN101313416B (ko)
HK (1) HK1122403A1 (ko)
TW (1) TWI441348B (ko)
WO (1) WO2007058361A1 (ko)

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JP5143497B2 (ja) * 2007-08-20 2013-02-13 日本カーバイド工業株式会社 電子部品収納用セラミックパッケージ及びその製造方法
EP2292569B1 (en) * 2008-06-30 2014-04-16 Nippon Carbide Kogyo Kabushiki Kaisha Alumina ceramic
KR100969146B1 (ko) * 2009-02-18 2010-07-08 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
KR100933920B1 (ko) * 2009-06-05 2009-12-28 주식회사 케이아이자이맥스 발광유니트 및 그 제조방법
CN102471171B (zh) * 2009-07-31 2014-02-12 京瓷株式会社 装载发光元件用陶瓷基体
TW201143152A (en) * 2010-03-31 2011-12-01 Asahi Glass Co Ltd Substrate for light-emitting element and light-emitting device employing it
JP4977770B2 (ja) * 2010-04-07 2012-07-18 共立エレックス株式会社 反射板の製造方法
JP2013211282A (ja) * 2010-07-23 2013-10-10 Nippon Carbide Ind Co Inc アルミナセラミック、及び、これを用いた発光素子搭載用基板
CN102347433A (zh) * 2010-07-29 2012-02-08 展晶科技(深圳)有限公司 发光二极管
US8981630B2 (en) * 2010-09-29 2015-03-17 Kyocera Corporation Ceramics substrate for mounting light-emitting element and light-emitting device
CN102544303A (zh) * 2010-12-21 2012-07-04 展晶科技(深圳)有限公司 发光二极管封装结构
JP2012244058A (ja) * 2011-05-23 2012-12-10 Du Pont Mitsui Fluorochem Co Ltd 発光ダイオード用リフレクター及びハウジング
TWM428490U (en) * 2011-09-27 2012-05-01 Lingsen Precision Ind Ltd Optical module packaging unit
US8913218B2 (en) 2012-04-13 2014-12-16 Shenzhen China Star Optoelectronics Technology Co., Ltd. Method for forming reflector and reflective liquid crystal display manufactured with same
CN102608683A (zh) * 2012-04-13 2012-07-25 深圳市华星光电技术有限公司 反射器的形成方法及使用该方法制备的反射式液晶显示器
JP2013228603A (ja) * 2012-04-26 2013-11-07 Kyocera Corp 反射材およびこの反射材上に発光素子を搭載してなる発光素子モジュール
CN102709442B (zh) * 2012-05-25 2015-06-03 瑞声声学科技(深圳)有限公司 Led封装挡墙的制造方法
KR101681360B1 (ko) * 2013-11-25 2016-11-30 삼성전기주식회사 전자부품 패키지의 제조방법
JP5877932B1 (ja) * 2014-02-26 2016-03-08 日本碍子株式会社 貫通孔を有する絶縁基板
TWI553793B (zh) * 2014-07-24 2016-10-11 光頡科技股份有限公司 陶瓷基板、封裝基板、半導體晶片封裝件及其製造方法
JP6401994B2 (ja) * 2014-10-08 2018-10-10 エルジー ディスプレイ カンパニー リミテッド 液晶表示装置
JP6726486B2 (ja) * 2015-03-10 2020-07-22 シチズン時計株式会社 反射基板の製造方法及び反射基板
JP6033361B2 (ja) * 2015-05-07 2016-11-30 三井・デュポンフロロケミカル株式会社 成形品
JP6509066B2 (ja) * 2015-08-07 2019-05-08 共立エレックス株式会社 セラミックス反射板製造方法

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JP2002012470A (ja) 2000-06-23 2002-01-15 Ngk Spark Plug Co Ltd 高純度アルミナ焼結体、高純度アルミナボール、半導体用治具、絶縁碍子、ボールベアリング、チェックバルブ及び高純度アルミナ焼結体の製造方法
JP2002338336A (ja) * 2001-05-16 2002-11-27 Kobe Steel Ltd 摺動部用アルミナセラミックス製品およびその製造方法
US20060183625A1 (en) * 2002-07-09 2006-08-17 Kenichiro Miyahara Substrate for forming thin film, thin film substrate, optical wave guide, luminescent element and substrate for carrying luminescent element
JP2004119735A (ja) 2002-09-26 2004-04-15 Kyocera Corp 連結基板及びその製造方法並びにセラミックパッケージ
JP2004224641A (ja) * 2003-01-23 2004-08-12 Toyo Kohan Co Ltd 環境浄化タイルおよびその製造方法
JP4307090B2 (ja) 2003-01-27 2009-08-05 京セラ株式会社 発光素子収納用パッケージおよび発光装置
JP4166611B2 (ja) * 2003-04-01 2008-10-15 シャープ株式会社 発光装置用パッケージ、発光装置
CN101740560B (zh) * 2003-04-01 2012-11-21 夏普株式会社 发光装置、背侧光照射装置、显示装置
JP2005294796A (ja) * 2003-12-19 2005-10-20 Kyocera Corp 発光素子収納用パッケージおよび発光装置ならびに照明装置
JP4387160B2 (ja) * 2003-10-29 2009-12-16 株式会社住友金属エレクトロデバイス 発光素子収納用パッケージの製造方法
JP4654577B2 (ja) * 2003-12-22 2011-03-23 パナソニック電工株式会社 光電変換素子実装用セラミックス基板
JP4417757B2 (ja) * 2004-03-26 2010-02-17 京セラ株式会社 発光装置およびその製造方法ならびに照明装置

Also Published As

Publication number Publication date
US8450761B2 (en) 2013-05-28
WO2007058361A1 (ja) 2007-05-24
TWI441348B (zh) 2014-06-11
US20090152581A1 (en) 2009-06-18
US20120025255A1 (en) 2012-02-02
EP1953836A1 (en) 2008-08-06
KR101066322B1 (ko) 2011-09-20
JPWO2007058361A1 (ja) 2009-05-07
TW200832751A (en) 2008-08-01
CN101313416A (zh) 2008-11-26
KR20080073304A (ko) 2008-08-08
EP1953836B1 (en) 2016-01-13
EP1953836A4 (en) 2013-10-23
CN101313416B (zh) 2010-05-19
JP4729583B2 (ja) 2011-07-20

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Legal Events

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PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20151121