HK1105713A1 - Chip resistor - Google Patents

Chip resistor

Info

Publication number
HK1105713A1
HK1105713A1 HK07110906.5A HK07110906A HK1105713A1 HK 1105713 A1 HK1105713 A1 HK 1105713A1 HK 07110906 A HK07110906 A HK 07110906A HK 1105713 A1 HK1105713 A1 HK 1105713A1
Authority
HK
Hong Kong
Prior art keywords
chip resistor
resistor
chip
Prior art date
Application number
HK07110906.5A
Inventor
Hideshi Tohyama
Toshihide Yoshida
Hirokazu Kato
Satoru Higano
Original Assignee
Mitsubishi Materials Corp
Kamaya Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp, Kamaya Electric Co Ltd filed Critical Mitsubishi Materials Corp
Publication of HK1105713A1 publication Critical patent/HK1105713A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
HK07110906.5A 2004-03-31 2007-10-09 Chip resistor HK1105713A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004104384 2004-03-31
JP2005068394A JP2005317927A (en) 2004-03-31 2005-03-11 Chip resistor
PCT/JP2005/005875 WO2005096323A1 (en) 2004-03-31 2005-03-29 Chip resistor

Publications (1)

Publication Number Publication Date
HK1105713A1 true HK1105713A1 (en) 2008-02-22

Family

ID=35064048

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07110906.5A HK1105713A1 (en) 2004-03-31 2007-10-09 Chip resistor

Country Status (6)

Country Link
JP (1) JP2005317927A (en)
KR (1) KR101016475B1 (en)
CN (1) CN1977347B (en)
HK (1) HK1105713A1 (en)
TW (1) TWI447748B (en)
WO (1) WO2005096323A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4602738B2 (en) * 2004-10-29 2010-12-22 太陽社電気株式会社 Manufacturing method of chip resistor
JP5242474B2 (en) * 2009-03-24 2013-07-24 日本特殊陶業株式会社 Multi-cavity ceramic wiring board
JP2012009767A (en) * 2009-11-27 2012-01-12 Kyocera Corp Multi-piece wiring board, method of manufacturing same, wiring board, and method of manufacturing same
CN102394164B (en) * 2011-07-11 2014-04-16 广东风华高新科技股份有限公司 Preparation method of miniature chip resistor
JP6144136B2 (en) * 2013-07-17 2017-06-07 Koa株式会社 Manufacturing method of chip resistor
KR101538416B1 (en) * 2015-02-25 2015-07-22 랄렉 일렉트로닉 코포레이션 Chip resistor device and method for fabricating the same
JP2017224677A (en) * 2016-06-14 2017-12-21 Koa株式会社 Chip resistor and manufacturing method thereof
CN106205911B (en) * 2016-08-30 2020-01-21 肇庆鼎晟电子科技有限公司 Short-circuit-proof thermosensitive chip and preparation method thereof
EP4212497A1 (en) * 2017-05-16 2023-07-19 Heraeus Deutschland GmbH & Co. KG Ceramic-metal substrate with low amorphous phase
EP3418266A1 (en) * 2017-06-22 2018-12-26 Heraeus Deutschland GmbH & Co. KG Ceramic-metal substrate with low amorphous phase

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5931983B2 (en) * 1977-06-17 1984-08-06 日本電気株式会社 Manufacturing method of semiconductor device
JPS57183092A (en) * 1981-05-06 1982-11-11 Nippon Carbide Kogyo Kk Sintered board capable of being readily separated
JPS5830118A (en) * 1981-08-14 1983-02-22 ティーディーケイ株式会社 Electronic part, and method and apparatus for producing same
JP3800795B2 (en) * 1998-02-23 2006-07-26 富士ゼロックス株式会社 Laser processing condition automatic setting method and laser processing condition automatic setting device
JP2001167914A (en) * 1999-12-08 2001-06-22 Rohm Co Ltd Dividing trench shape of insulating substrate
JP2002313613A (en) * 2001-04-18 2002-10-25 Matsushita Electric Ind Co Ltd Method of manufacturing chip electronic part
JP5042420B2 (en) * 2001-09-11 2012-10-03 三菱マテリアル株式会社 Manufacturing method of chip resistor
JP2004276386A (en) * 2003-03-14 2004-10-07 Koa Corp Splitting ceramic substrate and its manufacturing method
JP4227821B2 (en) * 2003-03-24 2009-02-18 コーア株式会社 Manufacturing method of chip resistor

Also Published As

Publication number Publication date
TW200537532A (en) 2005-11-16
CN1977347B (en) 2010-11-03
KR20070024506A (en) 2007-03-02
CN1977347A (en) 2007-06-06
KR101016475B1 (en) 2011-02-24
TWI447748B (en) 2014-08-01
JP2005317927A (en) 2005-11-10
WO2005096323A1 (en) 2005-10-13

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