HK1102970A1 - Device and method for electrolytically treating flat work pieces - Google Patents

Device and method for electrolytically treating flat work pieces

Info

Publication number
HK1102970A1
HK1102970A1 HK07111354.0A HK07111354A HK1102970A1 HK 1102970 A1 HK1102970 A1 HK 1102970A1 HK 07111354 A HK07111354 A HK 07111354A HK 1102970 A1 HK1102970 A1 HK 1102970A1
Authority
HK
Hong Kong
Prior art keywords
work pieces
conveying
contacting
electrolytically treating
conveyed
Prior art date
Application number
HK07111354.0A
Other languages
English (en)
Inventor
Klaus Hechler
Franz Kohnle
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of HK1102970A1 publication Critical patent/HK1102970A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0642—Anodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
HK07111354.0A 2004-06-17 2007-10-22 Device and method for electrolytically treating flat work pieces HK1102970A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004029894A DE102004029894B3 (de) 2004-06-17 2004-06-17 Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von flachem Behandlungsgut
PCT/EP2005/006553 WO2005123990A1 (en) 2004-06-17 2005-06-15 Device and method for electrolytically treating flat work pieces

Publications (1)

Publication Number Publication Date
HK1102970A1 true HK1102970A1 (en) 2007-12-07

Family

ID=34970026

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07111354.0A HK1102970A1 (en) 2004-06-17 2007-10-22 Device and method for electrolytically treating flat work pieces

Country Status (12)

Country Link
US (1) US7955487B2 (de)
EP (1) EP1756336B1 (de)
JP (1) JP4783785B2 (de)
KR (1) KR101214418B1 (de)
CN (1) CN1969065B (de)
AT (1) ATE396291T1 (de)
BR (1) BRPI0512138B1 (de)
DE (2) DE102004029894B3 (de)
HK (1) HK1102970A1 (de)
PL (1) PL1756336T3 (de)
TW (1) TWI359215B (de)
WO (1) WO2005123990A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI341554B (en) * 2007-08-02 2011-05-01 Enthone Copper metallization of through silicon via
JP5412198B2 (ja) * 2009-07-15 2014-02-12 三友セミコンエンジニアリング株式会社 連続部分めっき装置及びそれを用いた連続部分めっき方法
CN101887043B (zh) * 2010-07-19 2012-11-07 中南大学 一种用于电化学分析的可更新固体工作电极
WO2013117269A1 (en) * 2012-02-06 2013-08-15 Nv Bekaert Sa Multi-wire plating line at various levels
KR102023816B1 (ko) * 2017-09-21 2019-09-20 이윤재 축전지용 극판 제조용 도금장치
CN110592640A (zh) * 2019-10-14 2019-12-20 安徽豪鼎金属制品有限公司 一种不锈钢表面耐腐蚀处理系统及采用其进行处理的方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2653787B1 (fr) * 1989-10-27 1992-02-14 Lorraine Laminage Installation et procede de revetement electrolytique d'une bande metallique.
DE4413149A1 (de) * 1994-04-15 1995-10-19 Schmid Gmbh & Co Geb Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten
DE4425854C1 (de) * 1994-07-07 1995-11-09 Mannesmann Ag Elektrolytisches Oberflächenbehandlungsverfahren und Anlage zur Durchführung des Verfahrens
DE10015349A1 (de) * 2000-03-23 2001-10-25 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Behandeln von durchgehende Löcher und/oder Vertiefungen aufweisenden Schaltungsträgern sowie Anwendung des Verfahrens und Verwendung der Vorrichtung
DE10065643C2 (de) * 2000-12-29 2003-03-20 Egon Huebel Vorrichtung und Verfahren zum elektrochemischen Behandeln von bandförmigem und plattenförmigem Gut
DE10141056C2 (de) * 2001-08-22 2003-12-24 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Schichten in Durchlaufanlagen
WO2003038158A2 (de) * 2001-10-25 2003-05-08 Infineon Technologies Ag Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen

Also Published As

Publication number Publication date
WO2005123990A1 (en) 2005-12-29
KR20070024734A (ko) 2007-03-02
DE602005007022D1 (de) 2008-07-03
EP1756336B1 (de) 2008-05-21
CN1969065B (zh) 2010-04-14
US7955487B2 (en) 2011-06-07
JP4783785B2 (ja) 2011-09-28
DE102004029894B3 (de) 2005-12-22
ATE396291T1 (de) 2008-06-15
BRPI0512138B1 (pt) 2015-08-11
TW200610842A (en) 2006-04-01
CN1969065A (zh) 2007-05-23
EP1756336A1 (de) 2007-02-28
US20080257752A1 (en) 2008-10-23
PL1756336T3 (pl) 2008-10-31
TWI359215B (en) 2012-03-01
KR101214418B1 (ko) 2012-12-21
BRPI0512138A (pt) 2008-02-12
JP2008502797A (ja) 2008-01-31

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20150615