HK1091948A1 - Adhesively bonded deformable electrodes on ceramic piezoelectric transducers - Google Patents

Adhesively bonded deformable electrodes on ceramic piezoelectric transducers

Info

Publication number
HK1091948A1
HK1091948A1 HK06113497.5A HK06113497A HK1091948A1 HK 1091948 A1 HK1091948 A1 HK 1091948A1 HK 06113497 A HK06113497 A HK 06113497A HK 1091948 A1 HK1091948 A1 HK 1091948A1
Authority
HK
Hong Kong
Prior art keywords
adhesively bonded
piezoelectric transducers
ceramic piezoelectric
deformable electrodes
deformable
Prior art date
Application number
HK06113497.5A
Other languages
English (en)
Inventor
David W Gailus
Paul A Hoisington
Original Assignee
Fujifilm Dimatix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Dimatix Inc filed Critical Fujifilm Dimatix Inc
Publication of HK1091948A1 publication Critical patent/HK1091948A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/1618—Fixing the piezoelectric elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/03—Specific materials used
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/11—Embodiments of or processes related to ink-jet heads characterised by specific geometrical characteristics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1043—Subsequent to assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Transducers For Ultrasonic Waves (AREA)
HK06113497.5A 1996-06-26 2006-12-07 Adhesively bonded deformable electrodes on ceramic piezoelectric transducers HK1091948A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/673,162 US5755909A (en) 1996-06-26 1996-06-26 Electroding of ceramic piezoelectric transducers

Publications (1)

Publication Number Publication Date
HK1091948A1 true HK1091948A1 (en) 2007-01-26

Family

ID=24701547

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06113497.5A HK1091948A1 (en) 1996-06-26 2006-12-07 Adhesively bonded deformable electrodes on ceramic piezoelectric transducers

Country Status (8)

Country Link
US (3) US5755909A (de)
EP (2) EP0851812B1 (de)
JP (1) JP3202757B2 (de)
KR (2) KR100349213B1 (de)
CA (1) CA2228741C (de)
DE (1) DE69735416T2 (de)
HK (1) HK1091948A1 (de)
WO (1) WO1997049556A1 (de)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10100448A (ja) * 1996-06-25 1998-04-21 Seiko Epson Corp インクカートリッヂ、インクカートリッヂ装着装置並びにインクエンド等の検出板
US5755909A (en) * 1996-06-26 1998-05-26 Spectra, Inc. Electroding of ceramic piezoelectric transducers
US6543110B1 (en) * 1997-02-07 2003-04-08 Sri International Electroactive polymer fabrication
JPH1110861A (ja) * 1997-06-19 1999-01-19 Brother Ind Ltd インクジェットプリンタヘッド
JP3236542B2 (ja) * 1997-11-17 2001-12-10 セイコーエプソン株式会社 インクジェットプリントヘッド用アクチュエータの熱処理方法およびインクジェットプリントヘッドの製造方法
US6755511B1 (en) 1999-10-05 2004-06-29 Spectra, Inc. Piezoelectric ink jet module with seal
US10388626B2 (en) 2000-03-10 2019-08-20 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming flipchip interconnect structure
EP1278612B1 (de) * 2000-03-10 2010-02-24 Chippac, Inc. Flipchip-Verbindungsstruktur und dessen Herstellungsverfahren
US6467138B1 (en) * 2000-05-24 2002-10-22 Vermon Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same
GB2367532B (en) * 2000-07-27 2004-03-10 Kyocera Corp Layered unit provided with piezoelectric ceramics,method of producing the same and ink jet printing head employing the same
US6848773B1 (en) 2000-09-15 2005-02-01 Spectra, Inc. Piezoelectric ink jet printing module
US8181338B2 (en) * 2000-11-02 2012-05-22 Danfoss A/S Method of making a multilayer composite
US7518284B2 (en) * 2000-11-02 2009-04-14 Danfoss A/S Dielectric composite and a method of manufacturing a dielectric composite
US7548015B2 (en) * 2000-11-02 2009-06-16 Danfoss A/S Multilayer composite and a method of making such
WO2003056287A1 (en) * 2001-12-21 2003-07-10 Danfoss A/S Dielectric actuator or sensor structure and method of making it
DE10054247C2 (de) * 2000-11-02 2002-10-24 Danfoss As Betätigungselement und Verfahren zu seiner Herstellung
US6437487B1 (en) * 2001-02-28 2002-08-20 Acuson Corporation Transducer array using multi-layered elements and a method of manufacture thereof
US6664717B1 (en) * 2001-02-28 2003-12-16 Acuson Corporation Multi-dimensional transducer array and method with air separation
US6429574B1 (en) * 2001-02-28 2002-08-06 Acuson Corporation Transducer array using multi-layered elements having an even number of elements and a method of manufacture thereof
US6707236B2 (en) 2002-01-29 2004-03-16 Sri International Non-contact electroactive polymer electrodes
US7926916B2 (en) * 2002-01-31 2011-04-19 Hewlett-Packard Development Company, L.P. Adhesive joint with an ink trap and method
GB2388741B (en) * 2002-05-17 2004-06-30 Morgan Crucible Co Transducer assembly
EP1540807B1 (de) 2002-09-20 2013-01-09 Danfoss A/S Elastomeraktor und verfahren zu dessen herstellung
DE60328913D1 (de) * 2002-12-12 2009-10-01 Danfoss As Berührungssensorelement und sensorgruppe
ATE398988T1 (de) * 2003-02-24 2008-07-15 Danfoss As Elektroaktive elastische kompressionsbandage
JP3979360B2 (ja) * 2003-08-04 2007-09-19 ブラザー工業株式会社 液体移送装置
JP3952048B2 (ja) * 2003-09-29 2007-08-01 ブラザー工業株式会社 液体移送装置及び液体移送装置の製造方法
US6955419B2 (en) * 2003-11-05 2005-10-18 Xerox Corporation Ink jet apparatus
US7048361B2 (en) * 2003-11-05 2006-05-23 Xerox Corporation Ink jet apparatus
TWI220416B (en) * 2003-11-07 2004-08-21 Ind Tech Res Inst Ink jet head fluid passage constructed with multi-layers
US7082655B2 (en) * 2003-12-18 2006-08-01 Ge Inspection Technologies, Lp Process for plating a piezoelectric composite
US7281778B2 (en) 2004-03-15 2007-10-16 Fujifilm Dimatix, Inc. High frequency droplet ejection device and method
US8491076B2 (en) 2004-03-15 2013-07-23 Fujifilm Dimatix, Inc. Fluid droplet ejection devices and methods
JP4419754B2 (ja) * 2004-08-27 2010-02-24 ブラザー工業株式会社 インクジェットヘッド
EP1836056B1 (de) 2004-12-30 2018-11-07 Fujifilm Dimatix, Inc. Tintenstrahldruck
US7880371B2 (en) * 2006-11-03 2011-02-01 Danfoss A/S Dielectric composite and a method of manufacturing a dielectric composite
US7732999B2 (en) 2006-11-03 2010-06-08 Danfoss A/S Direct acting capacitive transducer
US7988247B2 (en) 2007-01-11 2011-08-02 Fujifilm Dimatix, Inc. Ejection of drops having variable drop size from an ink jet printer
WO2009006318A1 (en) 2007-06-29 2009-01-08 Artificial Muscle, Inc. Electroactive polymer transducers for sensory feedback applications
DE102007037502B4 (de) * 2007-08-08 2014-04-03 Epcos Ag Bauelement mit reduziertem Temperaturgang
ES2331224B1 (es) * 2008-04-18 2010-10-13 Prointec S.A. Celula piezoelectrica para disociacion de vapor de agua.
WO2009132651A1 (en) * 2008-04-30 2009-11-05 Danfoss A/S A pump powered by a polymer transducer
WO2009132650A2 (en) * 2008-04-30 2009-11-05 Danfoss A/S A power actuated valve
US8313174B2 (en) 2008-08-06 2012-11-20 Xerox Corporation Method for reducing mechanical cross-talk between array structures on a substrate mounted to another substrate by an adhesive
EP2239793A1 (de) 2009-04-11 2010-10-13 Bayer MaterialScience AG Elektrisch schaltbarer Polymerfilmaufbau und dessen Verwendung
WO2011105837A2 (ko) 2010-02-24 2011-09-01 (주) 씨아이제이 연성 전극소재 및 그 제조방법
JP5621447B2 (ja) * 2010-09-16 2014-11-12 ブラザー工業株式会社 アクチュエータの配線構造
KR20140008416A (ko) 2011-03-01 2014-01-21 바이엘 인텔렉쳐 프로퍼티 게엠베하 변형가능한 중합체 장치 및 필름을 제조하기 위한 자동화 제조 방법
CN103703404A (zh) 2011-03-22 2014-04-02 拜耳知识产权有限责任公司 电活化聚合物致动器双凸透镜系统
US8692442B2 (en) 2012-02-14 2014-04-08 Danfoss Polypower A/S Polymer transducer and a connector for a transducer
US8891222B2 (en) 2012-02-14 2014-11-18 Danfoss A/S Capacitive transducer and a method for manufacturing a transducer
JP5905292B2 (ja) * 2012-02-21 2016-04-20 日本碍子株式会社 圧電素子及び圧電素子の製造方法
EP2828901B1 (de) 2012-03-21 2017-01-04 Parker Hannifin Corporation Rolle-an-rolle-herstellungsverfahren zur herstellung selbstheilender elektroaktiver polymervorrichtungen
KR20150031285A (ko) 2012-06-18 2015-03-23 바이엘 인텔렉쳐 프로퍼티 게엠베하 연신 공정을 위한 연신 프레임
WO2014066576A1 (en) 2012-10-24 2014-05-01 Bayer Intellectual Property Gmbh Polymer diode
WO2014121799A1 (en) * 2013-02-07 2014-08-14 Danfoss Polypower A/S All compliant electrode
DE102013211596A1 (de) * 2013-06-20 2014-12-24 Robert Bosch Gmbh Verfahren zum elektrischen Kontaktieren einer Piezokeramik
KR101465366B1 (ko) * 2013-10-21 2014-11-25 성균관대학교산학협력단 신축성을 갖는 에너지 발전 소자 및 이의 제작 방법
KR101683727B1 (ko) * 2015-08-19 2016-12-08 한국세라믹기술원 Pzt-pvdf 나노섬유 복합 필름 제조 방법
KR101989027B1 (ko) * 2018-08-31 2019-06-14 주식회사 아이씨에이치 고유전성 점착 필름

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2287950A (en) * 1938-09-23 1942-06-30 Raymond W Tibbetts Piezoelectric device
US4404489A (en) * 1980-11-03 1983-09-13 Hewlett-Packard Company Acoustic transducer with flexible circuit board terminals
US4618797A (en) * 1984-12-24 1986-10-21 Cline David J Environmentally sealed piezoelectric sensing assembly for electrical switch
US4680595A (en) * 1985-11-06 1987-07-14 Pitney Bowes Inc. Impulse ink jet print head and method of making same
US4769882A (en) * 1986-10-22 1988-09-13 The Singer Company Method for making piezoelectric sensing elements with gold-germanium bonding layers
US4835554A (en) * 1987-09-09 1989-05-30 Spectra, Inc. Ink jet array
US5087930A (en) * 1989-11-01 1992-02-11 Tektronix, Inc. Drop-on-demand ink jet print head
US5406318A (en) * 1989-11-01 1995-04-11 Tektronix, Inc. Ink jet print head with electropolished diaphragm
US5210455A (en) * 1990-07-26 1993-05-11 Ngk Insulators, Ltd. Piezoelectric/electrostrictive actuator having ceramic substrate having recess defining thin-walled portion
US5265315A (en) * 1990-11-20 1993-11-30 Spectra, Inc. Method of making a thin-film transducer ink jet head
CA2075786A1 (en) * 1991-08-16 1993-02-17 John R. Pies Method of manufacturing a high density ink jet printhead array
JPH05111097A (ja) * 1991-10-15 1993-04-30 Murata Mfg Co Ltd 圧電発音体
JP3232626B2 (ja) * 1992-03-06 2001-11-26 セイコーエプソン株式会社 インクジェットヘッドブロック
US5394179A (en) * 1992-03-20 1995-02-28 Scitex Digital Printing, Inc. Stimulator for continous ink print head
US5504388A (en) * 1993-03-12 1996-04-02 Ngk Insulators, Ltd. Piezoelectric/electrostrictive element having electrode film(s) with specified surface roughness
US5771052A (en) * 1994-03-21 1998-06-23 Spectra, Inc. Single pass ink jet printer with offset ink jet modules
US5659346A (en) * 1994-03-21 1997-08-19 Spectra, Inc. Simplified ink jet head
US5755909A (en) * 1996-06-26 1998-05-26 Spectra, Inc. Electroding of ceramic piezoelectric transducers
US5834882A (en) * 1996-12-11 1998-11-10 Face International Corp. Multi-layer piezoelectric transformer

Also Published As

Publication number Publication date
US6037707A (en) 2000-03-14
EP0851812A1 (de) 1998-07-08
DE69735416D1 (de) 2006-05-04
KR19990044186A (ko) 1999-06-25
CA2228741A1 (en) 1997-12-31
DE69735416T2 (de) 2006-08-10
JPH10512106A (ja) 1998-11-17
EP1667243A2 (de) 2006-06-07
US6532028B1 (en) 2003-03-11
CA2228741C (en) 2001-12-25
KR100298023B1 (ko) 2001-10-26
KR100349213B1 (ko) 2002-08-14
US5755909A (en) 1998-05-26
WO1997049556A1 (en) 1997-12-31
EP0851812A4 (de) 2004-09-01
EP1667243B1 (de) 2012-04-04
EP0851812B1 (de) 2006-03-08
EP1667243A3 (de) 2007-07-18
JP3202757B2 (ja) 2001-08-27

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Effective date: 20170420