HK1090245A1 - Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor - Google Patents

Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor

Info

Publication number
HK1090245A1
HK1090245A1 HK06110400.7A HK06110400A HK1090245A1 HK 1090245 A1 HK1090245 A1 HK 1090245A1 HK 06110400 A HK06110400 A HK 06110400A HK 1090245 A1 HK1090245 A1 HK 1090245A1
Authority
HK
Hong Kong
Prior art keywords
circuit board
printed circuit
electrical device
frequency tuning
suitable therefor
Prior art date
Application number
HK06110400.7A
Other languages
English (en)
Inventor
Peter Bresche
Ulrich Hetzer
Original Assignee
Adc Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adc Gmbh filed Critical Adc Gmbh
Publication of HK1090245A1 publication Critical patent/HK1090245A1/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461Means for preventing cross-talk
    • H01R13/6464Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473Impedance matching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09236Parallel layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/171Tuning, e.g. by trimming of printed components or high frequency circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/175Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00Electrical connectors
    • Y10S439/941Crosstalk suppression
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128Assembling formed circuit to base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49135Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147Assembling terminal to base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49156Manufacturing circuit on or in base with selective destruction of conductive paths
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49174Assembling terminal to elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Tests Of Electronic Circuits (AREA)
HK06110400.7A 2003-03-11 2006-09-19 Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor HK1090245A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10310434A DE10310434A1 (de) 2003-03-11 2003-03-11 Verfahren zum HF-Abstimmen einer elektrischen Anordnung sowie eine hierzu geeignete Leiterplatte
PCT/EP2004/001952 WO2004082343A1 (de) 2003-03-11 2004-02-27 Verfahren zum hf-abstimmen einer elektrischen anordnung sowie eine hierzu geeignete leiterplatte

Publications (1)

Publication Number Publication Date
HK1090245A1 true HK1090245A1 (en) 2006-12-15

Family

ID=32920703

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06110400.7A HK1090245A1 (en) 2003-03-11 2006-09-19 Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor

Country Status (26)

Country Link
US (3) US7401402B2 (hr)
EP (1) EP1602263B1 (hr)
JP (1) JP4685759B2 (hr)
KR (1) KR100806090B1 (hr)
CN (1) CN100534258C (hr)
AR (1) AR043526A1 (hr)
AU (1) AU2004219120B9 (hr)
BR (1) BRPI0408208A (hr)
CA (1) CA2516977C (hr)
CL (1) CL2004000485A1 (hr)
DE (1) DE10310434A1 (hr)
HK (1) HK1090245A1 (hr)
HR (1) HRP20050785B1 (hr)
IL (1) IL170756A (hr)
ME (1) MEP29608A (hr)
MX (1) MXPA05009326A (hr)
MY (1) MY138688A (hr)
NO (1) NO20054626L (hr)
NZ (1) NZ542327A (hr)
PL (1) PL205021B1 (hr)
RS (1) RS50882B (hr)
RU (1) RU2309546C2 (hr)
TW (1) TWI244246B (hr)
UA (1) UA89612C2 (hr)
WO (1) WO2004082343A1 (hr)
ZA (1) ZA200507268B (hr)

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CN102082367B (zh) * 2004-03-12 2013-11-20 泛达公司 减小电连接器中串扰的方法及装置
DE102006056001B4 (de) * 2006-11-24 2008-12-04 Phoenix Contact Gmbh & Co. Kg Konfektionierbarer Rundsteckverbinder für Ethernet
US8267714B2 (en) 2007-03-29 2012-09-18 The Siemon Company Modular connector with reduced termination variability and improved performance
US7621772B1 (en) * 2008-06-20 2009-11-24 Tyco Electronics Corporation Electrical connector with a compliant cable strain relief element
US7874865B2 (en) * 2008-06-20 2011-01-25 Tyco Electronics Corporation Electrical connector with a compliant cable strain relief element
US8202128B2 (en) * 2008-11-25 2012-06-19 Adc Gmbh Telecommunications jack with adjustable crosstalk compensation
AU2009202284B2 (en) * 2008-12-19 2015-02-12 Tyco Electronics Services Gmbh Plug
US7896692B2 (en) * 2009-05-15 2011-03-01 Leviton Manufacturing Co., Inc. Method of improving isolation between circuits on a printed circuit board
US7892018B1 (en) 2009-09-29 2011-02-22 Tyco Electronics Corporation Electrical connector assembly with two cable loading stop elements
JP5201153B2 (ja) * 2010-01-13 2013-06-05 第一精工株式会社 電気コネクタ及び電気コネクタ組立体
CH704988A1 (de) 2011-06-21 2012-12-31 Reichle & De Massari Fa Stecker und Verfahren zu dessen Herstellung.
US8900015B2 (en) * 2011-10-03 2014-12-02 Panduit Corp. Communication connector with reduced crosstalk
US20140027155A1 (en) * 2012-07-25 2014-01-30 Ametek, Inc. Differential mode signal connector and cable assembly
US9246274B2 (en) * 2013-03-15 2016-01-26 Panduit Corp. Communication connectors having crosstalk compensation networks
DE102016122222A1 (de) 2016-11-18 2018-05-24 Telegärtner Karl Gärtner GmbH Elektrische Steckbuchse

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DE3301673A1 (de) * 1983-01-20 1984-07-26 Brown, Boveri & Cie Ag, 6800 Mannheim Elektrisches bzw. elektronisches mehrschichtbauelement
US4604513A (en) * 1985-05-07 1986-08-05 Lim Basilio Y Combination of a laser and a controller for trimming a metallized dielectric film capacitor
US4792779A (en) * 1986-09-19 1988-12-20 Hughes Aircraft Company Trimming passive components buried in multilayer structures
JPH01184942A (ja) * 1988-01-20 1989-07-24 Toshiba Corp トリミング素子とその電気短絡方法
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US5420515A (en) * 1992-08-28 1995-05-30 Hewlett-Packard Company Active circuit trimming with AC and DC response trims relative to a known response
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JP2754461B2 (ja) * 1994-07-08 1998-05-20 双葉電子工業株式会社 容器の封着方法および封着装置
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Also Published As

Publication number Publication date
JP2006520070A (ja) 2006-08-31
AU2004219120B9 (en) 2009-03-19
US8413323B2 (en) 2013-04-09
TWI244246B (en) 2005-11-21
CN1774961A (zh) 2006-05-17
DE10310434A1 (de) 2004-09-30
PL205021B1 (pl) 2010-03-31
US20080166919A1 (en) 2008-07-10
US7401402B2 (en) 2008-07-22
WO2004082343A1 (de) 2004-09-23
CA2516977C (en) 2012-02-21
NO20054626D0 (no) 2005-10-07
MEP29608A (en) 2011-02-10
CN100534258C (zh) 2009-08-26
HRP20050785A2 (en) 2006-11-30
CL2004000485A1 (es) 2005-05-27
TW200501520A (en) 2005-01-01
MY138688A (en) 2009-07-31
CA2516977A1 (en) 2004-09-23
EP1602263A1 (de) 2005-12-07
UA89612C2 (ru) 2010-02-25
PL377996A1 (pl) 2006-02-20
BRPI0408208A (pt) 2006-02-14
KR100806090B1 (ko) 2008-02-21
US20060264106A1 (en) 2006-11-23
ZA200507268B (en) 2006-06-28
NZ542327A (en) 2007-12-21
AU2004219120A1 (en) 2004-09-23
RS20050693A (en) 2006-12-15
EP1602263B1 (de) 2015-12-09
JP4685759B2 (ja) 2011-05-18
MXPA05009326A (es) 2006-01-17
NO20054626L (no) 2005-11-29
RU2309546C2 (ru) 2007-10-27
HRP20050785B1 (hr) 2011-12-31
AR043526A1 (es) 2005-08-03
US20110287670A1 (en) 2011-11-24
RU2005131432A (ru) 2006-03-27
KR20050109980A (ko) 2005-11-22
IL170756A (en) 2012-05-31
US7856709B2 (en) 2010-12-28
AU2004219120B2 (en) 2009-02-12
RS50882B (sr) 2010-08-31

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20140227