HK1088366A1 - Thin film forming method and forming device therefor - Google Patents
Thin film forming method and forming device thereforInfo
- Publication number
- HK1088366A1 HK1088366A1 HK06108543.9A HK06108543A HK1088366A1 HK 1088366 A1 HK1088366 A1 HK 1088366A1 HK 06108543 A HK06108543 A HK 06108543A HK 1088366 A1 HK1088366 A1 HK 1088366A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- thin film
- device therefor
- film forming
- forming method
- forming device
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5846—Reactive treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
- C23C14/0073—Reactive sputtering by exposing the substrates to reactive gases intermittently
- C23C14/0078—Reactive sputtering by exposing the substrates to reactive gases intermittently by moving the substrates between spatially separate sputtering and reaction stations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Surface Treatment Of Optical Elements (AREA)
- Manufacturing Optical Record Carriers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003158253 | 2003-06-03 | ||
PCT/JP2004/007609 WO2004108981A1 (ja) | 2003-06-03 | 2004-06-02 | 薄膜の形成方法及びその形成装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1088366A1 true HK1088366A1 (en) | 2006-11-03 |
Family
ID=33508423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK06108543.9A HK1088366A1 (en) | 2003-06-03 | 2006-08-01 | Thin film forming method and forming device therefor |
Country Status (7)
Country | Link |
---|---|
US (1) | US20060189046A1 (ja) |
EP (1) | EP1630248B1 (ja) |
JP (1) | JP3779317B2 (ja) |
KR (1) | KR100729031B1 (ja) |
CN (1) | CN100489149C (ja) |
HK (1) | HK1088366A1 (ja) |
WO (1) | WO2004108981A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4524354B2 (ja) * | 2008-02-28 | 2010-08-18 | 国立大学法人東北大学 | マイクロ波プラズマ処理装置、それに用いる誘電体窓部材および誘電体窓部材の製造方法 |
JPWO2010018639A1 (ja) * | 2008-08-15 | 2012-01-26 | 株式会社シンクロン | 蒸着装置及び薄膜デバイスの製造方法 |
JP5036827B2 (ja) * | 2008-09-05 | 2012-09-26 | 株式会社シンクロン | 成膜方法及び撥油性基材 |
KR101332274B1 (ko) * | 2008-09-30 | 2013-11-22 | 캐논 아네르바 가부시키가이샤 | 스퍼터링 장치 및 스퍼터링 방법 |
JP5099101B2 (ja) * | 2009-01-23 | 2012-12-12 | 東京エレクトロン株式会社 | プラズマ処理装置 |
CN103038387B (zh) * | 2011-08-02 | 2015-05-27 | 新柯隆株式会社 | 碳化硅薄膜的成膜方法 |
TWI595258B (zh) * | 2011-09-28 | 2017-08-11 | 萊寶光電有限公司 | 用於製造基板上之反射抑制層之方法與裝置 |
JP2017201651A (ja) * | 2016-05-02 | 2017-11-09 | 株式会社神戸製鋼所 | 酸化物半導体の製造方法 |
JP7131916B2 (ja) * | 2017-03-31 | 2022-09-06 | 芝浦メカトロニクス株式会社 | プラズマ処理装置 |
CN108690965B (zh) * | 2017-03-31 | 2020-06-30 | 芝浦机械电子装置株式会社 | 等离子体处理装置 |
CN110499508B (zh) * | 2018-05-18 | 2021-11-12 | 比亚迪股份有限公司 | 金属制品及其制备方法和应用 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4420385A (en) * | 1983-04-15 | 1983-12-13 | Gryphon Products | Apparatus and process for sputter deposition of reacted thin films |
US4986214A (en) * | 1986-12-16 | 1991-01-22 | Mitsubishi Denki Kabushiki Kaisha | Thin film forming apparatus |
US5798027A (en) * | 1988-02-08 | 1998-08-25 | Optical Coating Laboratory, Inc. | Process for depositing optical thin films on both planar and non-planar substrates |
US4851095A (en) * | 1988-02-08 | 1989-07-25 | Optical Coating Laboratory, Inc. | Magnetron sputtering apparatus and process |
US5225057A (en) * | 1988-02-08 | 1993-07-06 | Optical Coating Laboratory, Inc. | Process for depositing optical films on both planar and non-planar substrates |
US5124013A (en) * | 1988-02-08 | 1992-06-23 | Optical Coating Laboratory, Inc. | High ratio planetary drive system and method for vacuum chamber |
US5618388A (en) * | 1988-02-08 | 1997-04-08 | Optical Coating Laboratory, Inc. | Geometries and configurations for magnetron sputtering apparatus |
EP0409451A1 (en) * | 1989-07-18 | 1991-01-23 | Optical Coating Laboratory, Inc. | Process for depositing optical thin films on both planar and non-planar substrates |
US5789071A (en) * | 1992-11-09 | 1998-08-04 | Northwestern University | Multilayer oxide coatings |
EP0600303B1 (en) * | 1992-12-01 | 2002-02-06 | Matsushita Electric Industrial Co., Ltd. | Method for fabrication of dielectric thin film |
JP3293912B2 (ja) * | 1992-12-10 | 2002-06-17 | 松下電器産業株式会社 | 酸化物薄膜の形成方法 |
JPH08176821A (ja) * | 1994-12-26 | 1996-07-09 | Shincron:Kk | 薄膜形成方法および装置 |
JP3555797B2 (ja) * | 1996-03-11 | 2004-08-18 | 富士写真フイルム株式会社 | 成膜装置および成膜方法 |
US6103320A (en) * | 1998-03-05 | 2000-08-15 | Shincron Co., Ltd. | Method for forming a thin film of a metal compound by vacuum deposition |
JP3735461B2 (ja) * | 1998-03-27 | 2006-01-18 | 株式会社シンクロン | 複合金属の化合物薄膜形成方法及びその薄膜形成装置 |
DE19824364A1 (de) * | 1998-05-30 | 1999-12-02 | Bosch Gmbh Robert | Verfahren zum Aufbringen eines Verschleißschutz-Schichtsystems mit optischen Eigenschaften auf Oberflächen |
JP2000017457A (ja) * | 1998-07-03 | 2000-01-18 | Shincron:Kk | 薄膜形成装置および薄膜形成方法 |
JP2000119846A (ja) * | 1998-10-13 | 2000-04-25 | Nikon Corp | 薄膜の製造方法 |
JP3738154B2 (ja) * | 1999-06-30 | 2006-01-25 | 株式会社シンクロン | 複合金属化合物の薄膜形成方法及びその薄膜形成装置 |
US7931787B2 (en) * | 2002-02-26 | 2011-04-26 | Donald Bennett Hilliard | Electron-assisted deposition process and apparatus |
-
2004
- 2004-06-02 WO PCT/JP2004/007609 patent/WO2004108981A1/ja active Application Filing
- 2004-06-02 US US10/550,506 patent/US20060189046A1/en not_active Abandoned
- 2004-06-02 JP JP2005506761A patent/JP3779317B2/ja not_active Expired - Lifetime
- 2004-06-02 CN CNB200480014269XA patent/CN100489149C/zh not_active Expired - Lifetime
- 2004-06-02 EP EP04745508A patent/EP1630248B1/en not_active Expired - Lifetime
- 2004-06-02 KR KR1020057023032A patent/KR100729031B1/ko active IP Right Grant
-
2006
- 2006-08-01 HK HK06108543.9A patent/HK1088366A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20060012659A (ko) | 2006-02-08 |
US20060189046A1 (en) | 2006-08-24 |
EP1630248A1 (en) | 2006-03-01 |
EP1630248A4 (en) | 2008-11-12 |
JPWO2004108981A1 (ja) | 2006-07-20 |
EP1630248B1 (en) | 2012-05-02 |
CN1795286A (zh) | 2006-06-28 |
JP3779317B2 (ja) | 2006-05-24 |
KR100729031B1 (ko) | 2007-06-14 |
CN100489149C (zh) | 2009-05-20 |
WO2004108981A1 (ja) | 2004-12-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20180602 |