HK1086930A1 - A method to protect a gmr head from electrostatic damage during the manufacturing process - Google Patents

A method to protect a gmr head from electrostatic damage during the manufacturing process

Info

Publication number
HK1086930A1
HK1086930A1 HK06106802A HK06106802A HK1086930A1 HK 1086930 A1 HK1086930 A1 HK 1086930A1 HK 06106802 A HK06106802 A HK 06106802A HK 06106802 A HK06106802 A HK 06106802A HK 1086930 A1 HK1086930 A1 HK 1086930A1
Authority
HK
Hong Kong
Prior art keywords
protect
manufacturing process
damage during
gmr head
electrostatic damage
Prior art date
Application number
HK06106802A
Other languages
English (en)
Inventor
Niraj Mahadev
Kazumasa Yasuda
Rudy Ayala
Original Assignee
Sae Magnetics Hk Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sae Magnetics Hk Ltd filed Critical Sae Magnetics Hk Ltd
Publication of HK1086930A1 publication Critical patent/HK1086930A1/xx

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/10—Structure or manufacture of housings or shields for heads
    • G11B5/11—Shielding of head against electric or magnetic fields
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
    • G11B5/3106—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing where the integrated or assembled structure comprises means for conditioning against physical detrimental influence, e.g. wear, contamination
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/40—Protective measures on heads, e.g. against excessive temperature 
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4853—Constructional details of the electrical connection between head and arm
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49025—Making disc drive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49027—Mounting preformed head/core onto other structure
    • Y10T29/4903—Mounting preformed head/core onto other structure with bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032—Fabricating head structure or component thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032—Fabricating head structure or component thereof
    • Y10T29/49036—Fabricating head structure or component thereof including measuring or testing
    • Y10T29/49041—Fabricating head structure or component thereof including measuring or testing with significant slider/housing shaping or treating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032—Fabricating head structure or component thereof
    • Y10T29/49048—Machining magnetic material [e.g., grinding, etching, polishing]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Magnetic Heads (AREA)
  • Hall/Mr Elements (AREA)
HK06106802A 2004-05-25 2006-06-14 A method to protect a gmr head from electrostatic damage during the manufacturing process HK1086930A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/853,461 US7296336B2 (en) 2004-05-25 2004-05-25 Method to protect a GMR head from electrostatic damage during the manufacturing process

Publications (1)

Publication Number Publication Date
HK1086930A1 true HK1086930A1 (en) 2006-09-29

Family

ID=35424881

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06106802A HK1086930A1 (en) 2004-05-25 2006-06-14 A method to protect a gmr head from electrostatic damage during the manufacturing process

Country Status (4)

Country Link
US (2) US7296336B2 (ja)
JP (1) JP2005339782A (ja)
CN (1) CN100511426C (ja)
HK (1) HK1086930A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7461447B2 (en) * 2006-05-05 2008-12-09 Hitachi Global Storage Technologies Netherlands B.V. Method of fabrication of magnetic head having annealed embedded read sensor
US8767351B1 (en) * 2013-01-31 2014-07-01 Seagate Technology Llc Ambient temperature ball bond
US9437251B1 (en) 2014-12-22 2016-09-06 Western Digital (Fremont), Llc Apparatus and method having TDMR reader to reader shunts

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58133616A (ja) * 1982-02-02 1983-08-09 Canon Electronics Inc 磁気ヘツドの製造方法
US5021907A (en) 1989-12-11 1991-06-04 Seagate Technology, Inc. Gimbal spring for supporting a magnetic transducer and making electrical contact therewith
JPH05196952A (ja) * 1991-10-02 1993-08-06 Canon Inc 電気的接続構造及び電気的接続方法
JPH06203338A (ja) * 1993-01-08 1994-07-22 Sanyo Electric Co Ltd 磁気抵抗効果型ヘッド
US5465186A (en) 1994-01-26 1995-11-07 International Business Machines Corporation Shorted magnetoresistive head leads for electrical overstress and electrostatic discharge protection during manufacture of a magnetic storage system
US5491605A (en) 1994-12-23 1996-02-13 International Business Machines Corporation Shorted magnetoresistive head elements for electrical overstress and electrostatic discharge protection
JPH0991623A (ja) * 1995-09-19 1997-04-04 Hitachi Ltd 磁気抵抗効果型磁気ヘッド及びその製造方法
JPH09180130A (ja) * 1995-12-26 1997-07-11 Hitachi Ltd 薄膜磁気ヘッドの製造方法
US5699212A (en) 1996-05-01 1997-12-16 International Business Machines Corporation Method of electrostatic discharge protection of magnetic heads in a magnetic storage system
JPH1145423A (ja) * 1997-07-28 1999-02-16 Fujitsu Ltd 磁気ヘッドスライダ及び磁気ヘッドアセンブリ
US6034851A (en) 1998-04-07 2000-03-07 Read-Rite Corporation Shorting bar and test clip for protecting magnetic heads from damage caused by electrostatic discharge during manufacture
JPH11316915A (ja) * 1998-05-07 1999-11-16 Yamaha Corp 薄膜磁気ヘッドの製造方法
JP3544480B2 (ja) * 1998-10-30 2004-07-21 日立金属株式会社 薄膜磁気ヘッドの製造方法
US6631052B1 (en) 1999-01-13 2003-10-07 Applied Kinetics, Inc. Head interconnect with support material carbonized shunt
JP4028130B2 (ja) * 1999-04-30 2007-12-26 アルプス電気株式会社 分離容易な静電破壊防止用短絡部を有する薄膜磁気ヘッド装置及びその製造方法
US6351352B1 (en) * 1999-06-01 2002-02-26 Magnecomp Corp. Separably bondable shunt for wireless suspensions
US6643106B2 (en) 2000-07-13 2003-11-04 Seagate Technology Llc Method of shunting and deshunting a magnetic read element during assembly
US6757135B2 (en) * 2000-07-28 2004-06-29 Seagate Technology Llc Leading edge bond pads
US6704173B1 (en) 2000-08-16 2004-03-09 Western Digital (Fremont), Inc. Method and system for providing ESD protection using diodes and a grounding strip in a head gimbal assembly
JP2002151532A (ja) * 2000-11-08 2002-05-24 Sharp Corp 電子部品、半導体装置の実装方法および半導体装置の実装構造
JP2003036508A (ja) * 2001-07-09 2003-02-07 Shinka Jitsugyo Kk バーブロックの加工方法及び薄膜磁気ヘッドの製造方法

Also Published As

Publication number Publication date
US7296336B2 (en) 2007-11-20
US20050264905A1 (en) 2005-12-01
CN100511426C (zh) 2009-07-08
JP2005339782A (ja) 2005-12-08
US7836579B2 (en) 2010-11-23
CN1722232A (zh) 2006-01-18
US20080066294A1 (en) 2008-03-20

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20140525