HK1076829A1 - Filler reinforced polyether imide resin composition and molded article thereof - Google Patents

Filler reinforced polyether imide resin composition and molded article thereof

Info

Publication number
HK1076829A1
HK1076829A1 HK05108856A HK05108856A HK1076829A1 HK 1076829 A1 HK1076829 A1 HK 1076829A1 HK 05108856 A HK05108856 A HK 05108856A HK 05108856 A HK05108856 A HK 05108856A HK 1076829 A1 HK1076829 A1 HK 1076829A1
Authority
HK
Hong Kong
Prior art keywords
weight
polyether imide
imide resin
filler
fibrous
Prior art date
Application number
HK05108856A
Other languages
English (en)
Inventor
Kim Choate
Tatsuya Uchiyama
Tsutomu Kinoshita
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of HK1076829A1 publication Critical patent/HK1076829A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
HK05108856A 2002-04-11 2005-10-06 Filler reinforced polyether imide resin composition and molded article thereof HK1076829A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002109570A JP3947030B2 (ja) 2002-04-11 2002-04-11 充填材強化ポリエーテルイミド系樹脂組成物およびその成形品
PCT/US2003/011141 WO2003087226A1 (en) 2002-04-11 2003-04-11 Filler reinforced polyether imide resin composition and molded article thereof

Publications (1)

Publication Number Publication Date
HK1076829A1 true HK1076829A1 (en) 2006-01-27

Family

ID=29243206

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05108856A HK1076829A1 (en) 2002-04-11 2005-10-06 Filler reinforced polyether imide resin composition and molded article thereof

Country Status (9)

Country Link
EP (1) EP1497374B1 (ja)
JP (1) JP3947030B2 (ja)
KR (1) KR100997824B1 (ja)
CN (1) CN1314761C (ja)
AT (1) ATE404634T1 (ja)
AU (1) AU2003230872A1 (ja)
DE (1) DE60322873D1 (ja)
HK (1) HK1076829A1 (ja)
WO (1) WO2003087226A1 (ja)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050038145A1 (en) * 2003-08-11 2005-02-17 General Electric Company Flame retardant fiber reinforced composition with improved flow
CN101103076B (zh) 2005-01-12 2012-05-30 住友化学株式会社 含有氧碳化合物类的组合物及其用途
KR100796006B1 (ko) * 2006-08-10 2008-01-21 송홍준 유리섬유 촙을 이용한 전기기기 보호재 및 그 제조 방법
US8829100B2 (en) 2006-12-19 2014-09-09 Sabic Innovative Plastics Ip B.V. Reinforced amorphous polymer composition
WO2008091253A1 (en) * 2007-01-25 2008-07-31 Sabic Innovative Plastics Ip B.V. High heat electrical connectors
KR101348534B1 (ko) * 2010-11-26 2014-01-07 주식회사 삼양사 유리섬유 강화 폴리카보네이트 수지 조성물
EP2468809A1 (de) 2010-12-23 2012-06-27 LANXESS Deutschland GmbH Zusammensetzungen
US9328241B2 (en) * 2012-09-12 2016-05-03 Sabic Global Technologies B.V. Thermoplastic polyimide as flow promoter and flame retardant synergist for filled polyamide compositions
US20140334090A1 (en) * 2012-12-31 2014-11-13 SABIC INNOVATIVE PLASTICS IP B.V. et al High flow reinforced polyimide compositions with very low residual contamination for hard disk drive enclosure
WO2014101188A1 (en) 2012-12-31 2014-07-03 Sabic Innovative Plastics Ip B.V. Metallization and surface coating solution on glass filler high performance amorphous polymer compositions
CN103304976A (zh) * 2013-06-24 2013-09-18 苏州新区佳合塑胶有限公司 电子产品用增强增韧塑料及其制备方法
HUE046212T2 (hu) * 2014-01-31 2020-02-28 Sabic Global Technologies Bv Szál kompozit
CN103980707B (zh) * 2014-05-21 2016-06-08 中国工程物理研究院化工材料研究所 韧化聚醚酰亚胺复合材料及其制备方法
US10329421B2 (en) * 2014-06-11 2019-06-25 Sabic Global Technologies B.V. Polycarbonate compositions, method of manufacture thereof, and articles therefrom
KR101935087B1 (ko) 2014-12-31 2019-01-03 롯데첨단소재(주) 폴리카보네이트 수지 조성물 및 이를 포함하는 성형품
WO2016108539A1 (ko) * 2014-12-31 2016-07-07 삼성에스디아이 주식회사 폴리카보네이트 수지 조성물 및 이를 포함하는 성형품
JP6500572B2 (ja) 2015-04-14 2019-04-17 オムロン株式会社 回路構造体
CN105176082A (zh) * 2015-09-16 2015-12-23 东莞深圳清华大学研究院创新中心 一种复合3d打印材料及其制备方法
JP2017155172A (ja) * 2016-03-03 2017-09-07 国立大学法人信州大学 炭素繊維強化プラスチック及びその製造方法並びに炭素繊維
CN105924920A (zh) * 2016-04-22 2016-09-07 宁波高新区夏远科技有限公司 一种散热防菌插线板及其制备方法
CN107057352A (zh) * 2017-05-16 2017-08-18 扬中市中兴塑料配件厂 一种聚醚酰亚胺复合材质导向套的制备方法
CN107033593A (zh) * 2017-05-16 2017-08-11 扬中市中兴塑料配件厂 一种聚醚酰亚胺复合材质的导向套
CN107739505A (zh) * 2017-11-10 2018-02-27 南京立汉化学有限公司 一种耐热玻璃纤维增强尼龙612及其制备方法
CN108641164A (zh) * 2018-05-11 2018-10-12 江苏奥神新材料股份有限公司 一种超细旦聚酰亚胺短切纤维改性聚烯烃及其制备方法
CN112126227B (zh) * 2019-06-25 2023-03-14 财团法人纺织产业综合研究所 塑料组成物以及纤维

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1232993A (en) * 1982-09-29 1988-02-16 Markus Matzner Blends of poly(etherimides) and polyamides
DE3931649A1 (de) * 1989-09-22 1991-04-04 Basf Ag Thermoplastische formmassen aus faserverstaerkten hochtemperaturbestaendigen thermoplasten
JP4460672B2 (ja) * 1998-04-24 2010-05-12 三井化学株式会社 Ｉｃトレー

Also Published As

Publication number Publication date
CN1314761C (zh) 2007-05-09
KR100997824B1 (ko) 2010-12-01
AU2003230872A1 (en) 2003-10-27
CN1659234A (zh) 2005-08-24
WO2003087226A1 (en) 2003-10-23
JP2003301105A (ja) 2003-10-21
ATE404634T1 (de) 2008-08-15
DE60322873D1 (de) 2008-09-25
KR20040111502A (ko) 2004-12-31
JP3947030B2 (ja) 2007-07-18
EP1497374B1 (en) 2008-08-13
EP1497374A1 (en) 2005-01-19

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20110411