HK1071105A1 - Lapping carrier for use in fabricating sliders - Google Patents

Lapping carrier for use in fabricating sliders

Info

Publication number
HK1071105A1
HK1071105A1 HK05101132.2A HK05101132A HK1071105A1 HK 1071105 A1 HK1071105 A1 HK 1071105A1 HK 05101132 A HK05101132 A HK 05101132A HK 1071105 A1 HK1071105 A1 HK 1071105A1
Authority
HK
Hong Kong
Prior art keywords
lapping carrier
lapping
magneto
row
carrier
Prior art date
Application number
HK05101132.2A
Other languages
English (en)
Inventor
Leo E Kennedy
Oh-Hun Kwon
Matthew A Simpson
Stanley C Smith
Original Assignee
Saint Gobain Ceramics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Ceramics filed Critical Saint Gobain Ceramics
Publication of HK1071105A1 publication Critical patent/HK1071105A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/048—Lapping machines or devices; Accessories designed for working plane surfaces of sliders and magnetic heads of hard disc drives or the like
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
    • C04B35/486—Fine ceramics
    • C04B35/488—Composites

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
HK05101132.2A 2002-04-18 2005-02-12 Lapping carrier for use in fabricating sliders HK1071105A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US37345002P 2002-04-18 2002-04-18
PCT/US2003/011942 WO2003089192A1 (en) 2002-04-18 2003-04-16 Lapping carrier for use in fabricating sliders

Publications (1)

Publication Number Publication Date
HK1071105A1 true HK1071105A1 (en) 2005-07-08

Family

ID=29251029

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05101132.2A HK1071105A1 (en) 2002-04-18 2005-02-12 Lapping carrier for use in fabricating sliders

Country Status (11)

Country Link
US (1) US6736704B2 (zh)
EP (1) EP1494835B1 (zh)
JP (1) JP4339703B2 (zh)
KR (1) KR100675504B1 (zh)
CN (1) CN100482417C (zh)
AT (1) ATE471790T1 (zh)
AU (1) AU2003228572A1 (zh)
DE (1) DE60333085D1 (zh)
HK (1) HK1071105A1 (zh)
TW (1) TWI272156B (zh)
WO (1) WO2003089192A1 (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6669871B2 (en) * 2000-11-21 2003-12-30 Saint-Gobain Ceramics & Plastics, Inc. ESD dissipative ceramics
CN101061079A (zh) * 2002-11-22 2007-10-24 圣戈本陶瓷及塑料股份有限公司 氧化锆韧化的氧化铝esd安全陶瓷组合物、元件、及其制造方法
CN100337980C (zh) * 2003-05-29 2007-09-19 日本特殊陶业株式会社 压电陶瓷组合物以及含该组合物的压电元件
US6994608B1 (en) 2004-11-12 2006-02-07 Hitachi Global Storage Technologies Netherlands, B.V. Methods of manufacturing sliders
US7115020B1 (en) 2005-04-07 2006-10-03 International Business Machines Corporation Lapping system with mutually stabilized lapping carriers
US7871306B1 (en) * 2007-01-22 2011-01-18 Veeco Instruments Inc. Minimal force air bearing for lapping tool
US8175679B2 (en) 2007-12-26 2012-05-08 St. Jude Medical, Atrial Fibrillation Division, Inc. Catheter electrode that can simultaneously emit electrical energy and facilitate visualization by magnetic resonance imaging
US9675410B2 (en) * 2007-12-28 2017-06-13 St. Jude Medical, Atrial Fibrillation Division, Inc. Flexible polymer electrode for MRI-guided positioning and radio frequency ablation
US8169754B2 (en) * 2007-12-31 2012-05-01 Hitachi Global Storage Technologies, Netherlands, B.V. Dedicated noncorrosive smear detector
WO2011084252A2 (en) * 2009-12-21 2011-07-14 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic dissipative articles and method of making
US9366614B2 (en) * 2011-08-05 2016-06-14 Osaka University Porosity measuring device and porosity measuring method
US9017139B2 (en) 2013-03-12 2015-04-28 Seagate Technology Llc Lapping carrier having hard and soft properties, and methods
US9352442B2 (en) 2013-07-02 2016-05-31 Seagate Technology Llc Lapping carrier
US9776299B2 (en) * 2013-10-03 2017-10-03 Seagate Technology Llc Slider level lapping carrier
US9849567B2 (en) 2013-11-05 2017-12-26 Seagate Technology Llc Lapping assembly or process utilizing a bar stack extender
US9421665B2 (en) 2014-02-05 2016-08-23 Veeco Instruments, Inc. Pressure-adjusting lapping element
US10843305B2 (en) * 2014-03-17 2020-11-24 Seagate Technology Llc Lapping device or carrier with adaptive bending control
RU2742967C2 (ru) * 2016-11-15 2021-02-12 Конинклейке Филипс Н.В. Формирование контакта ультразвукового устройства
JP7422989B2 (ja) * 2019-01-24 2024-01-29 日本特殊陶業株式会社 多孔質ジルコニア粒子及びタンパク質固定用凝集体
JP6839314B2 (ja) * 2019-03-19 2021-03-03 日本碍子株式会社 ウエハ載置装置及びその製法
WO2020191487A1 (en) 2019-03-23 2020-10-01 Coulson Ice Blast Ltd. Rotary crusher and feeder for ice blasting system

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5023991A (en) 1988-08-31 1991-06-18 Digital Equipment Corporation Electrical guide for tight tolerance machining
US5117589A (en) * 1990-03-19 1992-06-02 Read-Rite Corporation Adjustable transfer tool for lapping magnetic head sliders
US5463805A (en) 1994-02-07 1995-11-07 Seagate Technology, Inc. Method of lapping MR. sensors
US6017264A (en) 1996-08-09 2000-01-25 Seagate Technology, Inc. Deflection lapping apparatus and method for hydrodynamic bearing slider
USRE38340E1 (en) * 1996-11-04 2003-12-02 Seagate Technology Llc Multi-point bending of bars during fabrication of magnetic recording heads
US5951371A (en) * 1996-11-04 1999-09-14 Seagate Technology, Inc. Multi-point bending of bars during fabrication of magnetic recording heads
US6475064B2 (en) 1996-12-13 2002-11-05 Seagate Technology Llc Multipoint bending apparatus for lapping heads of a data storage device
US5991698A (en) 1997-01-29 1999-11-23 Seagate Technology, Inc. Electrical lap guide data acquisition unit and measurement scheme
US5738566A (en) 1997-03-31 1998-04-14 Seagate Technology, Inc. Lapping guide system, method and article of manufacture
US6274524B1 (en) * 1997-04-25 2001-08-14 Kyocera Corporation Semiconductive zirconia sintering body and electrostatic removing member constructed by semiconductive zirconia sintering body
US6360428B1 (en) 1998-04-16 2002-03-26 Seagate Technology Llc Glide heads and methods for making glide heads
US6093083A (en) 1998-05-06 2000-07-25 Advanced Imaging, Inc. Row carrier for precision lapping of disk drive heads and for handling of heads during the slider fab operation
DE60006179T2 (de) 1999-03-26 2004-07-15 Ibiden Co. Ltd., Ogaki Halteplatte für Scheiben bei Schleifmaschinen und Verfahren zur Herstellung dieser Platte
US6347983B1 (en) 1999-06-09 2002-02-19 Seagate Technology Llc ELG for both MRE sensor height and resistance monitoring
US6669871B2 (en) 2000-11-21 2003-12-30 Saint-Gobain Ceramics & Plastics, Inc. ESD dissipative ceramics

Also Published As

Publication number Publication date
EP1494835B1 (en) 2010-06-23
KR100675504B1 (ko) 2007-02-02
CN100482417C (zh) 2009-04-29
WO2003089192A1 (en) 2003-10-30
JP2005532916A (ja) 2005-11-04
US6736704B2 (en) 2004-05-18
TW200305479A (en) 2003-11-01
AU2003228572A1 (en) 2003-11-03
CN1655907A (zh) 2005-08-17
US20030199228A1 (en) 2003-10-23
ATE471790T1 (de) 2010-07-15
JP4339703B2 (ja) 2009-10-07
KR20050011752A (ko) 2005-01-29
DE60333085D1 (de) 2010-08-05
EP1494835A1 (en) 2005-01-12
TWI272156B (en) 2007-02-01

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20140416