HK1048342A1 - Method for vacuum treatment of workpieces and vacuum treatment facility - Google Patents

Method for vacuum treatment of workpieces and vacuum treatment facility

Info

Publication number
HK1048342A1
HK1048342A1 HK02106553A HK02106553A HK1048342A1 HK 1048342 A1 HK1048342 A1 HK 1048342A1 HK 02106553 A HK02106553 A HK 02106553A HK 02106553 A HK02106553 A HK 02106553A HK 1048342 A1 HK1048342 A1 HK 1048342A1
Authority
HK
Hong Kong
Prior art keywords
vacuum treatment
pump
workpieces
lock
vacuum
Prior art date
Application number
HK02106553A
Other languages
English (en)
Inventor
Franz Josef Schaefer
Helfried Weinzerl
Original Assignee
Unaxis Balzers Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=4193163&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1048342(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Unaxis Balzers Ag filed Critical Unaxis Balzers Ag
Publication of HK1048342A1 publication Critical patent/HK1048342A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Non-Positive Displacement Air Blowers (AREA)
  • Drying Of Semiconductors (AREA)
HK02106553A 1999-04-16 2002-09-05 Method for vacuum treatment of workpieces and vacuum treatment facility HK1048342A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH70199 1999-04-16
PCT/CH2000/000181 WO2000063460A1 (de) 1999-04-16 2000-03-29 Verfahren zum vakuumbehandeln von werkstücken und vakuumbehandlungsanlage

Publications (1)

Publication Number Publication Date
HK1048342A1 true HK1048342A1 (en) 2003-03-28

Family

ID=4193163

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02106553A HK1048342A1 (en) 1999-04-16 2002-09-05 Method for vacuum treatment of workpieces and vacuum treatment facility

Country Status (8)

Country Link
US (2) US6669987B1 (xx)
EP (1) EP1183405B1 (xx)
JP (1) JP2002542396A (xx)
AT (1) ATE247723T1 (xx)
DE (1) DE50003375D1 (xx)
HK (1) HK1048342A1 (xx)
TW (1) TW513321B (xx)
WO (1) WO2000063460A1 (xx)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE247723T1 (de) * 1999-04-16 2003-09-15 Unaxis Balzers Ag Verfahren zum vakuumbehandeln von werkstücken und vakuumbehandlungsanlage
JP2002090978A (ja) * 2000-09-12 2002-03-27 Hoya Corp 位相シフトマスクブランクの製造方法、及び位相シフトマスクブランクの製造装置
GB0229353D0 (en) * 2002-12-17 2003-01-22 Boc Group Plc Vacuum pumping system and method of operating a vacuum pumping arrangement
KR101046520B1 (ko) 2007-09-07 2011-07-04 어플라이드 머티어리얼스, 인코포레이티드 내부 챔버 상의 부산물 막 증착을 제어하기 위한 ｐｅｃｖｄ 시스템에서의 소스 가스 흐름 경로 제어
US8445874B2 (en) * 2010-04-11 2013-05-21 Gatan Inc. Ion beam sample preparation apparatus and methods
KR101308111B1 (ko) * 2011-11-17 2013-09-26 주식회사 유진테크 복수의 배기포트를 포함하는 기판 처리 장치 및 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3649339A (en) * 1969-09-05 1972-03-14 Eugene C Smith Apparatus and method for securing a high vacuum for particle coating process
JPS58123872A (ja) * 1982-01-19 1983-07-23 Matsushita Electric Ind Co Ltd スパツタリング装置
DE4232959C2 (de) * 1992-10-01 2001-05-10 Leybold Ag Vorrichtung zum Ein- und Ausschleusen scheibenförmiger Substrate
JPH07208964A (ja) * 1994-01-13 1995-08-11 Fujitsu Ltd 回路パターン検査装置及び方法並びにこの方法に適した回路パターン配置
US5922179A (en) * 1996-12-20 1999-07-13 Gatan, Inc. Apparatus for etching and coating sample specimens for microscopic analysis
KR100252213B1 (ko) * 1997-04-22 2000-05-01 윤종용 반도체소자제조장치및그제조방법
US6083566A (en) * 1998-05-26 2000-07-04 Whitesell; Andrew B. Substrate handling and processing system and method
ATE247723T1 (de) * 1999-04-16 2003-09-15 Unaxis Balzers Ag Verfahren zum vakuumbehandeln von werkstücken und vakuumbehandlungsanlage
DE19929519A1 (de) * 1999-06-28 2001-01-04 Pfeiffer Vacuum Gmbh Verfahren zum Betrieb einer Mehrkammer-Vakuumanlage

Also Published As

Publication number Publication date
US6669987B1 (en) 2003-12-30
ATE247723T1 (de) 2003-09-15
US20040096583A1 (en) 2004-05-20
EP1183405A1 (de) 2002-03-06
JP2002542396A (ja) 2002-12-10
TW513321B (en) 2002-12-11
DE50003375D1 (de) 2003-09-25
EP1183405B1 (de) 2003-08-20
WO2000063460A1 (de) 2000-10-26

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20090329