HK1046776A1 - Decoupling capacitors for thin gate oxides. - Google Patents

Decoupling capacitors for thin gate oxides.

Info

Publication number
HK1046776A1
HK1046776A1 HK02108392A HK02108392A HK1046776A1 HK 1046776 A1 HK1046776 A1 HK 1046776A1 HK 02108392 A HK02108392 A HK 02108392A HK 02108392 A HK02108392 A HK 02108392A HK 1046776 A1 HK1046776 A1 HK 1046776A1
Authority
HK
Hong Kong
Prior art keywords
thin gate
decoupling capacitors
gate oxides
oxides
decoupling
Prior art date
Application number
HK02108392A
Other versions
HK1046776B (en
Inventor
Ali Keshavarzi
De K Vevek
Tanay Karnik
Rajendran Nair
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of HK1046776A1 publication Critical patent/HK1046776A1/en
Publication of HK1046776B publication Critical patent/HK1046776B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/0805—Capacitors only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/92—Capacitors having potential barriers
    • H01L29/94—Metal-insulator-semiconductors, e.g. MOS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
HK02108392.5A 1999-12-22 2002-11-20 Decoupling capacitors for thin gate oxides HK1046776B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/469,406 US6828638B2 (en) 1999-12-22 1999-12-22 Decoupling capacitors for thin gate oxides
PCT/US2000/031352 WO2001046989A2 (en) 1999-12-22 2000-11-13 Decoupling capacitors for thin gate oxides

Publications (2)

Publication Number Publication Date
HK1046776A1 true HK1046776A1 (en) 2003-01-24
HK1046776B HK1046776B (en) 2004-12-03

Family

ID=23863664

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02108392.5A HK1046776B (en) 1999-12-22 2002-11-20 Decoupling capacitors for thin gate oxides

Country Status (8)

Country Link
US (1) US6828638B2 (en)
JP (1) JP4954413B2 (en)
KR (1) KR100532208B1 (en)
AU (1) AU3072601A (en)
DE (1) DE10085347B4 (en)
GB (1) GB2374462B (en)
HK (1) HK1046776B (en)
WO (1) WO2001046989A2 (en)

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US6917544B2 (en) 2002-07-10 2005-07-12 Saifun Semiconductors Ltd. Multiple use memory chip
US6809386B2 (en) * 2002-08-29 2004-10-26 Micron Technology, Inc. Cascode I/O driver with improved ESD operation
US7136304B2 (en) 2002-10-29 2006-11-14 Saifun Semiconductor Ltd Method, system and circuit for programming a non-volatile memory array
US7178004B2 (en) 2003-01-31 2007-02-13 Yan Polansky Memory array programming circuit and a method for using the circuit
JP4046634B2 (en) * 2003-04-08 2008-02-13 Ｎｅｃエレクトロニクス株式会社 Voltage-controlled capacitance element and semiconductor integrated circuit
KR100954021B1 (en) * 2003-08-05 2010-04-20 엡슨 토요콤 가부시키가이샤 Piezoelectric oscillator
JP2005175003A (en) * 2003-12-08 2005-06-30 Matsushita Electric Ind Co Ltd Decoupling capacitor and semiconductor integrated circuit
DE102004006484A1 (en) * 2004-02-10 2005-08-25 Infineon Technologies Ag Integrated circuit with electrostatic discharge (ESD) resistant capacitor located in N-trough, with certain polarity of capacitor permitting formation depletion zone in trough and high ESD strength of capacitor
US7256438B2 (en) * 2004-06-08 2007-08-14 Saifun Semiconductors Ltd MOS capacitor with reduced parasitic capacitance
US7619273B2 (en) * 2004-10-06 2009-11-17 Freescale Semiconductor, Inc. Varactor
US7638850B2 (en) 2004-10-14 2009-12-29 Saifun Semiconductors Ltd. Non-volatile memory structure and method of fabrication
US8053812B2 (en) 2005-03-17 2011-11-08 Spansion Israel Ltd Contact in planar NROM technology
US7804126B2 (en) 2005-07-18 2010-09-28 Saifun Semiconductors Ltd. Dense non-volatile memory array and method of fabrication
US7668017B2 (en) 2005-08-17 2010-02-23 Saifun Semiconductors Ltd. Method of erasing non-volatile memory cells
US8116142B2 (en) * 2005-09-06 2012-02-14 Infineon Technologies Ag Method and circuit for erasing a non-volatile memory cell
US7808818B2 (en) 2006-01-12 2010-10-05 Saifun Semiconductors Ltd. Secondary injection for NROM
US7477541B2 (en) * 2006-02-14 2009-01-13 International Business Machines Corporation Memory elements and methods of using the same
US7358823B2 (en) * 2006-02-14 2008-04-15 International Business Machines Corporation Programmable capacitors and methods of using the same
US8253452B2 (en) 2006-02-21 2012-08-28 Spansion Israel Ltd Circuit and method for powering up an integrated circuit and an integrated circuit utilizing same
US7692961B2 (en) 2006-02-21 2010-04-06 Saifun Semiconductors Ltd. Method, circuit and device for disturb-control of programming nonvolatile memory cells by hot-hole injection (HHI) and by channel hot-electron (CHE) injection
US7760554B2 (en) 2006-02-21 2010-07-20 Saifun Semiconductors Ltd. NROM non-volatile memory and mode of operation
US7701779B2 (en) 2006-04-27 2010-04-20 Sajfun Semiconductors Ltd. Method for programming a reference cell
EP2100333A4 (en) * 2007-01-01 2012-05-09 Sandisk Technologies Inc Integrated circuits and methods with two types of decoupling capacitors
KR100907020B1 (en) * 2008-02-25 2009-07-08 주식회사 하이닉스반도체 Apparatus for supplying power in semiconductor integrated circuit and input impedance control method of the same
FR2982707A1 (en) * 2011-11-10 2013-05-17 St Microelectronics Sa Capacitor for use in silicon on insulator type integrated circuit, has metal oxide semiconductor transistor whose source and drain are connected to node and gate, and semiconductor substrate connected to another node
KR102143520B1 (en) * 2014-09-17 2020-08-11 삼성전자 주식회사 Pumping capacitor
US9837555B2 (en) * 2015-04-15 2017-12-05 Futurewei Technologies, Inc. Apparatus and method for a low loss coupling capacitor
US10510906B2 (en) * 2016-07-01 2019-12-17 Taiwan Semiconductor Manufacturing Company Ltd. MOS capacitor, semiconductor fabrication method and MOS capacitor circuit
JP7027176B2 (en) * 2018-01-22 2022-03-01 ラピスセミコンダクタ株式会社 Semiconductor device

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JPS59154077A (en) * 1983-02-23 1984-09-03 Clarion Co Ltd Variable capacitance element
US5032892A (en) * 1988-05-31 1991-07-16 Micron Technology, Inc. Depletion mode chip decoupling capacitor
JPH0513680A (en) * 1990-10-26 1993-01-22 Seiko Epson Corp Semiconductor device
US5173835A (en) 1991-10-15 1992-12-22 Motorola, Inc. Voltage variable capacitor
US5341009A (en) * 1993-07-09 1994-08-23 Harris Corporation Fast charging MOS capacitor structure for high magnitude voltage of either positive or negative polarity
US5405790A (en) 1993-11-23 1995-04-11 Motorola, Inc. Method of forming a semiconductor structure having MOS, bipolar, and varactor devices
US5615096A (en) 1994-06-06 1997-03-25 Motorola, Inc. Direct current power supply conditioning circuit
JPH0883887A (en) * 1994-09-14 1996-03-26 Nissan Motor Co Ltd Semiconductor protector
US5563779A (en) 1994-12-05 1996-10-08 Motorola, Inc. Method and apparatus for a regulated supply on an integrated circuit
US5883423A (en) * 1996-02-23 1999-03-16 National Semiconductor Corporation Decoupling capacitor for integrated circuit signal driver
JP2795259B2 (en) * 1996-04-17 1998-09-10 日本電気株式会社 Semiconductor device and manufacturing method thereof
US5962887A (en) 1996-06-18 1999-10-05 Micron Technology, Inc. Metal-oxide-semiconductor capacitor
JPH10107235A (en) * 1996-09-27 1998-04-24 Hitachi Ltd Method for constituting gate array lsi and circuit device using the same
JPH10163421A (en) * 1996-11-29 1998-06-19 Sanyo Electric Co Ltd Semiconductor integrated circuit
JPH10256489A (en) * 1997-03-14 1998-09-25 Mitsubishi Electric Corp Semiconductor device
US5965912A (en) 1997-09-03 1999-10-12 Motorola, Inc. Variable capacitor and method for fabricating the same

Also Published As

Publication number Publication date
DE10085347B4 (en) 2009-04-09
KR100532208B1 (en) 2005-11-29
WO2001046989A3 (en) 2002-05-10
GB2374462B (en) 2004-05-26
GB2374462A (en) 2002-10-16
HK1046776B (en) 2004-12-03
DE10085347T1 (en) 2003-01-30
KR20020089311A (en) 2002-11-29
AU3072601A (en) 2001-07-03
US6828638B2 (en) 2004-12-07
WO2001046989A2 (en) 2001-06-28
JP2004501501A (en) 2004-01-15
JP4954413B2 (en) 2012-06-13
US20020140109A1 (en) 2002-10-03
GB0215177D0 (en) 2002-08-07

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