HK1044860A1 - Surface wave device connected to a base with a conductive adhesive. - Google Patents

Surface wave device connected to a base with a conductive adhesive.

Info

Publication number
HK1044860A1
HK1044860A1 HK02106309A HK02106309A HK1044860A1 HK 1044860 A1 HK1044860 A1 HK 1044860A1 HK 02106309 A HK02106309 A HK 02106309A HK 02106309 A HK02106309 A HK 02106309A HK 1044860 A1 HK1044860 A1 HK 1044860A1
Authority
HK
Hong Kong
Prior art keywords
base
device connected
conductive adhesive
wave device
surface wave
Prior art date
Application number
HK02106309A
Other languages
English (en)
Inventor
Ngoc-Tuan Nguyen
Jean-Marc Bureau
Christian Lelong
Original Assignee
Thales Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales Sa filed Critical Thales Sa
Publication of HK1044860A1 publication Critical patent/HK1044860A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/0585—Holders; Supports for surface acoustic wave devices consisting of an adhesive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Wire Bonding (AREA)
HK02106309A 1999-02-12 2002-08-27 Surface wave device connected to a base with a conductive adhesive. HK1044860A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9901722A FR2789822B1 (fr) 1999-02-12 1999-02-12 Dispositif a ondes de surface connecte a une embase avec un adhesif conducteur
PCT/FR2000/000347 WO2000048313A1 (fr) 1999-02-12 2000-02-11 Dispositif a ondes de surface connecte a une embase avec un adhesif conducteur

Publications (1)

Publication Number Publication Date
HK1044860A1 true HK1044860A1 (en) 2002-11-01

Family

ID=9541961

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02106309A HK1044860A1 (en) 1999-02-12 2002-08-27 Surface wave device connected to a base with a conductive adhesive.

Country Status (10)

Country Link
US (1) US6556105B1 (de)
EP (1) EP1157460B1 (de)
JP (1) JP2002537669A (de)
KR (1) KR20010102024A (de)
CN (1) CN1156075C (de)
CA (1) CA2362736A1 (de)
DE (1) DE60006365T2 (de)
FR (1) FR2789822B1 (de)
HK (1) HK1044860A1 (de)
WO (1) WO2000048313A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2818170B1 (fr) * 2000-12-19 2003-03-07 Thomson Csf Procede de fabrication d'une sonde acoustique multielements utilisant un film polymere metallise et ablate comme plan de masse
DE10351429B4 (de) * 2003-11-04 2013-10-31 Epcos Ag SAW Bauelement mit Klebestelle und Verwendung dafür
JP4880478B2 (ja) * 2003-12-30 2012-02-22 スリーエム イノベイティブ プロパティズ カンパニー 弾性表面波センサアセンブリ
US20070281369A1 (en) * 2003-12-30 2007-12-06 Carter Chad J Acousto-Mechanical Detection Systems and Methods of Use
US7259499B2 (en) * 2004-12-23 2007-08-21 Askew Andy R Piezoelectric bimorph actuator and method of manufacturing thereof
JP4770643B2 (ja) * 2005-10-12 2011-09-14 エプソントヨコム株式会社 圧電デバイス及び、その製造方法
WO2008083279A1 (en) * 2006-12-29 2008-07-10 3M Innovative Properties Company Method of detection of bioanalytes by acousto-mechanical detection systems comprising the addition of liposomes
KR102024608B1 (ko) * 2017-01-11 2019-09-24 엘지전자 주식회사 센서
CN111371429B (zh) * 2018-12-26 2022-07-12 中芯集成电路（宁波）有限公司上海分公司 控制电路与声波滤波器的集成方法和集成结构
US11063571B2 (en) * 2019-07-25 2021-07-13 Zhuhai Crystal Resonance Technologies Co., Ltd. Packaged electronic components

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2605139A1 (fr) 1986-10-10 1988-04-15 Europ Composants Electron Condensateur du type a film de polymere et a stabilite en temperature elevee
FR2627008B1 (fr) 1988-02-05 1990-06-08 Europ Composants Electron Procede d'impregnation de condensateurs electrolytiques par des sels de tetracyanoquinodimethane
FR2666173A1 (fr) 1990-08-21 1992-02-28 Thomson Csf Structure hybride d'interconnexion de circuits integres et procede de fabrication.
FR2670021B1 (fr) 1990-12-04 1994-03-04 Thomson Csf Procede de realisation de microlentilles pour applications optiques.
FR2685080B1 (fr) 1991-12-17 1995-09-01 Thomson Csf Capteur mecanique comprenant un film de polymere.
FR2701602B1 (fr) 1993-02-12 1995-03-31 Thomson Csf Détecteur thermique comprenant un isolant thermique en polymère expansé.
FR2702309B1 (fr) 1993-03-05 1995-04-07 Thomson Csf Procédé de fabrication d'une sonde acoustique multiéléments, notamment d'une sonde d'échographie.
JPH07154185A (ja) * 1993-10-04 1995-06-16 Nec Corp 弾性表面波装置およびその製造方法
US5939817A (en) * 1994-09-22 1999-08-17 Nippon Electric Co Surface acoustic wave device
WO1997002596A1 (fr) * 1995-06-30 1997-01-23 Kabushiki Kaisha Toshiba Composant electronique et son procede de fabrication
FR2740933B1 (fr) 1995-11-03 1997-11-28 Thomson Csf Sonde acoustique et procede de realisation
JPH09162693A (ja) * 1995-12-14 1997-06-20 Kokusai Electric Co Ltd 弾性表面波素子
FR2745973B1 (fr) 1996-03-08 1998-04-03 Thomson Csf Memoire de masse et procede de fabrication de memoire de masse
JP3196693B2 (ja) * 1997-08-05 2001-08-06 日本電気株式会社 表面弾性波装置およびその製造方法
US6287894B1 (en) * 1999-10-04 2001-09-11 Andersen Laboratories, Inc. Acoustic device packaged at wafer level
FR2799883B1 (fr) 1999-10-15 2003-05-30 Thomson Csf Procede d'encapsulation de composants electroniques

Also Published As

Publication number Publication date
CA2362736A1 (fr) 2000-08-17
EP1157460B1 (de) 2003-11-05
WO2000048313A1 (fr) 2000-08-17
US6556105B1 (en) 2003-04-29
FR2789822A1 (fr) 2000-08-18
EP1157460A1 (de) 2001-11-28
CN1340240A (zh) 2002-03-13
DE60006365D1 (de) 2003-12-11
FR2789822B1 (fr) 2001-06-08
CN1156075C (zh) 2004-06-30
KR20010102024A (ko) 2001-11-15
JP2002537669A (ja) 2002-11-05
DE60006365T2 (de) 2004-09-16

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20090211