HK1044220B - 磁頭裝置與帶該磁頭裝置的磁盤機 - Google Patents

磁頭裝置與帶該磁頭裝置的磁盤機

Info

Publication number
HK1044220B
HK1044220B HK02105793.6A HK02105793A HK1044220B HK 1044220 B HK1044220 B HK 1044220B HK 02105793 A HK02105793 A HK 02105793A HK 1044220 B HK1044220 B HK 1044220B
Authority
HK
Hong Kong
Prior art keywords
magnetic head
magnetic
head apparatus
magnetic disk
disk
Prior art date
Application number
HK02105793.6A
Other languages
English (en)
Other versions
HK1044220A1 (en
Inventor
白石一雅
和田健
川合滿好
本田隆
太田憲和
鬆本孝雄
廣瀨篤
Original Assignee
Tdk株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk株式會社 filed Critical Tdk株式會社
Publication of HK1044220A1 publication Critical patent/HK1044220A1/xx
Publication of HK1044220B publication Critical patent/HK1044220B/zh

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4853—Constructional details of the electrical connection between head and arm
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4826—Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
HK02105793.6A 2000-08-09 2002-08-07 磁頭裝置與帶該磁頭裝置的磁盤機 HK1044220B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000241305A JP2002056515A (ja) 2000-08-09 2000-08-09 磁気ヘッド装置及び該磁気ヘッド装置を備えた磁気ディスク装置

Publications (2)

Publication Number Publication Date
HK1044220A1 HK1044220A1 (en) 2002-10-11
HK1044220B true HK1044220B (zh) 2005-12-16

Family

ID=18732510

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02105793.6A HK1044220B (zh) 2000-08-09 2002-08-07 磁頭裝置與帶該磁頭裝置的磁盤機

Country Status (4)

Country Link
US (1) US6665148B2 (zh)
JP (1) JP2002056515A (zh)
CN (1) CN1206626C (zh)
HK (1) HK1044220B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3660640B2 (ja) * 2001-07-02 2005-06-15 アルプス電気株式会社 チップオンサスペンション型磁気ヘッド及びその製造方法
US7280810B2 (en) * 2005-08-03 2007-10-09 Kamilo Feher Multimode communication system
US20070246822A1 (en) * 2006-04-25 2007-10-25 Glover Kerry C Hard disk drive preamp heat dissipation methods
KR100723534B1 (ko) 2006-07-13 2007-05-30 삼성전자주식회사 Ｈｓａ 및 이를 구비한 하드디스크 드라이브
KR100723533B1 (ko) 2006-07-13 2007-05-30 삼성전자주식회사 Ｈｓａ 및 이를 구비한 하드디스크 드라이브

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS569576A (en) 1979-07-06 1981-01-31 Hitachi Ltd Vertical motion driver
JPS62197909A (ja) 1986-02-24 1987-09-01 Seiko Epson Corp 磁気ヘツドおよびその製造方法
JP2762639B2 (ja) 1989-12-15 1998-06-04 富士通株式会社 ヘッド支持アーム
JP3634134B2 (ja) * 1997-09-10 2005-03-30 富士通株式会社 サスペンション、ヘッドスライダ支持装置、及びディスク装置
JPH11185233A (ja) * 1997-12-24 1999-07-09 Tdk Corp 磁気ヘッド装置
US6252743B1 (en) * 1998-11-02 2001-06-26 Read-Rite Corporation Read/write positioning arm with interspaced amplifier chips

Also Published As

Publication number Publication date
JP2002056515A (ja) 2002-02-22
US20020021531A1 (en) 2002-02-21
CN1206626C (zh) 2005-06-15
CN1340807A (zh) 2002-03-20
US6665148B2 (en) 2003-12-16
HK1044220A1 (en) 2002-10-11

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20090809