HK1040823A1 - 形成電子射綫的裝置、製造裝置的方法和應用 - Google Patents

形成電子射綫的裝置、製造裝置的方法和應用

Info

Publication number
HK1040823A1
HK1040823A1 HK02102222.4A HK02102222A HK1040823A1 HK 1040823 A1 HK1040823 A1 HK 1040823A1 HK 02102222 A HK02102222 A HK 02102222A HK 1040823 A1 HK1040823 A1 HK 1040823A1
Authority
HK
Hong Kong
Prior art keywords
electron beam
shaping
assistance
producing
ceramic body
Prior art date
Application number
HK02102222.4A
Other languages
English (en)
Inventor
Burkhardt Klaus
Eckhardt Wolfgang
Gohlke Silvia
Manner Ruth
Wersing Wolfram
Original Assignee
西門子公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 西門子公司 filed Critical 西門子公司
Publication of HK1040823A1 publication Critical patent/HK1040823A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/18—Assembling together the component parts of electrode systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
    • H01J37/10—Lenses
    • H01J37/12—Lenses electrostatic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/06—Sources
    • H01J2237/063—Electron sources
    • H01J2237/06375—Arrangement of electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/10—Lenses
    • H01J2237/12—Lenses electrostatic
    • H01J2237/1205—Microlenses

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Recrystallisation Techniques (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
HK02102222.4A 1998-06-03 2002-03-22 形成電子射綫的裝置、製造裝置的方法和應用 HK1040823A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19824783A DE19824783A1 (de) 1998-06-03 1998-06-03 Vorrichtung zur Formung eines Elektronenstrahls, Verfahren zur Herstellung der Vorrichtung und Anwendung
PCT/DE1999/001610 WO1999063566A2 (de) 1998-06-03 1999-06-01 Vorrichtung zur formung eines elektronenstrahls, verfahren zur herstellung der vorrichtung und anwendung

Publications (1)

Publication Number Publication Date
HK1040823A1 true HK1040823A1 (zh) 2002-06-21

Family

ID=7869769

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02102222.4A HK1040823A1 (zh) 1998-06-03 2002-03-22 形成電子射綫的裝置、製造裝置的方法和應用

Country Status (9)

Country Link
US (1) US6570320B1 (zh)
EP (1) EP1088319B1 (zh)
JP (1) JP2002517881A (zh)
CN (1) CN1315051A (zh)
AT (1) ATE256338T1 (zh)
DE (2) DE19824783A1 (zh)
ES (1) ES2212593T3 (zh)
HK (1) HK1040823A1 (zh)
WO (1) WO1999063566A2 (zh)

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DE29823118U1 (de) 1998-12-28 1999-02-25 Siemens AG, 80333 München Röhrenhals für eine Kathodenstrahlröhre
DE10041338A1 (de) * 2000-08-23 2002-03-14 Epcos Ag Verfahren zum Herstellen eines keramischen Vielschichtbauelements sowie Grünkörper für ein keramisches Vielschichtbauelement
CN1258204C (zh) * 2002-05-16 2006-05-31 中山大学 一种冷阴极电子枪
US6703784B2 (en) * 2002-06-18 2004-03-09 Motorola, Inc. Electrode design for stable micro-scale plasma discharges
US7394071B2 (en) * 2004-12-20 2008-07-01 Electronics And Telecommunications Research Institute Micro column electron beam apparatus formed in low temperature co-fired ceramic substrate
DE102006052027B4 (de) * 2006-11-03 2009-06-25 Metoxit Ag Verfahren zum Bestimmen des Sinterschwunds eines vorgesinterten Körpers und Bearbeitungsmaschine zur Bearbeitung von Weißlingen
US7668296B2 (en) * 2007-06-14 2010-02-23 General Electric Co. X ray tube assembly and method of manufacturing and using the X ray tube assembly
US7801277B2 (en) * 2008-03-26 2010-09-21 General Electric Company Field emitter based electron source with minimized beam emittance growth
US8588372B2 (en) * 2009-12-16 2013-11-19 General Electric Company Apparatus for modifying electron beam aspect ratio for X-ray generation
US9448327B2 (en) * 2013-12-16 2016-09-20 Schlumberger Technology Corporation X-ray generator having multiple extractors with independently selectable potentials

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DE275156C (de) 1911-07-26 1914-06-11 Basf Ag Verfahren zur Ausführung chemischer Reaktionen mit Wasserstoff in heissen eisernen Gefässen
FR935241A (fr) * 1946-10-18 1948-06-14 Csf Perfectionnement aux lentilles électroniques électrostatiques à haute tension
US3935500A (en) * 1974-12-09 1976-01-27 Texas Instruments Incorporated Flat CRT system
DD275156A3 (de) * 1987-12-09 1990-01-17 Mikroelektronik Friedrich Engels Veb Glaslotsiebdruckpaste
NL8800194A (nl) * 1988-01-27 1989-08-16 Philips Nv Kathodestraalbuis.
EP0351444A1 (en) * 1988-07-22 1990-01-24 International Business Machines Corporation Method for making self-aligned apertures
DE3837300A1 (de) * 1988-11-03 1990-05-23 Messerschmitt Boelkow Blohm Verfahren zur herstellung von mikroelektronischen schaltungen und hybriden
US4870539A (en) * 1989-01-17 1989-09-26 International Business Machines Corporation Doped titanate glass-ceramic for grain boundary barrier layer capacitors
JPH02249294A (ja) * 1989-03-23 1990-10-05 Mitsubishi Mining & Cement Co Ltd Ｌｃ内蔵形セラミックス基板
US5443786A (en) * 1989-09-19 1995-08-22 Fujitsu Limited Composition for the formation of ceramic vias
FR2676862B1 (fr) 1991-05-21 1997-01-03 Commissariat Energie Atomique Structure multiplicatrice d'electrons en ceramique notamment pour photomultiplicateur et son procede de fabrication.
US5744898A (en) * 1992-05-14 1998-04-28 Duke University Ultrasound transducer array with transmitter/receiver integrated circuitry
DE9213965U1 (de) * 1992-10-16 1993-02-25 Dr. Johannes Heidenhain Gmbh, 83301 Traunreut Mikrostruktur
US5657199A (en) * 1992-10-21 1997-08-12 Devoe; Daniel F. Close physical mounting of leaded amplifier/receivers to through holes in monolithic, buried-substrate, multiple capacitors simultaneous with electrical connection to dual capacitors otherwise transpiring, particularly for hearing aid filters
US5534743A (en) 1993-03-11 1996-07-09 Fed Corporation Field emission display devices, and field emission electron beam source and isolation structure components therefor
DE4419764C1 (de) * 1994-06-06 1995-12-21 Netzsch Erich Holding Stapelvorrichtung, insbesondere für Kapseln zum Brennen keramischer Artikel
JPH0831336A (ja) * 1994-07-13 1996-02-02 Sony Corp 電子銃用の主レンズ部材及び電子銃
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DE19646369B4 (de) * 1996-11-09 2008-07-31 Robert Bosch Gmbh Keramische Mehrlagenschaltung und Verfahren zu ihrer Herstellung
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Also Published As

Publication number Publication date
WO1999063566A3 (de) 2000-08-24
WO1999063566A2 (de) 1999-12-09
EP1088319B1 (de) 2003-12-10
JP2002517881A (ja) 2002-06-18
DE19824783A1 (de) 1999-12-16
US6570320B1 (en) 2003-05-27
ATE256338T1 (de) 2003-12-15
CN1315051A (zh) 2001-09-26
DE59908030D1 (de) 2004-01-22
ES2212593T3 (es) 2004-07-16
EP1088319A2 (de) 2001-04-04

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