HK1038383A1 - 鈀電鍍浴及電鍍方法 - Google Patents

鈀電鍍浴及電鍍方法

Info

Publication number
HK1038383A1
HK1038383A1 HK02100097.0A HK02100097A HK1038383A1 HK 1038383 A1 HK1038383 A1 HK 1038383A1 HK 02100097 A HK02100097 A HK 02100097A HK 1038383 A1 HK1038383 A1 HK 1038383A1
Authority
HK
Hong Kong
Prior art keywords
electroplating
palladium
bath
electroplating bath
palladium electroplating
Prior art date
Application number
HK02100097.0A
Other languages
English (en)
Inventor
Anthony Dullaghan Conor
Anthony Abys Joseph
Epstein Peter
John Maisano Joseph
Original Assignee
Lucent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucent Technologies Inc filed Critical Lucent Technologies Inc
Publication of HK1038383A1 publication Critical patent/HK1038383A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
HK02100097.0A 2000-06-08 2002-01-07 鈀電鍍浴及電鍍方法 HK1038383A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59023400A 2000-06-08 2000-06-08

Publications (1)

Publication Number Publication Date
HK1038383A1 true HK1038383A1 (zh) 2002-03-15

Family

ID=24361404

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02100097.0A HK1038383A1 (zh) 2000-06-08 2002-01-07 鈀電鍍浴及電鍍方法

Country Status (4)

Country Link
EP (1) EP1162289A1 (zh)
JP (1) JP2002060989A (zh)
KR (1) KR20010112499A (zh)
HK (1) HK1038383A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3417097B1 (en) * 2016-02-16 2021-04-07 LumiShield Technologies Incorporated Electrochemical deposition of elements in aqueous media

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4098656A (en) * 1976-03-11 1978-07-04 Oxy Metal Industries Corporation Bright palladium electroplating baths
FR2403399A1 (fr) * 1977-09-19 1979-04-13 Oxy Metal Industries Corp Bains de revetement electrolytique de palladium brillant
IT1107840B (it) * 1978-07-25 1985-12-02 Alfachimici Spa Soluzione catalitica per la deposizione anelettrica di metalli
US4465563A (en) * 1982-12-22 1984-08-14 Learonal, Inc. Electrodeposition of palladium-silver alloys
US4478692A (en) * 1982-12-22 1984-10-23 Learonal, Inc. Electrodeposition of palladium-silver alloys
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
JP3365866B2 (ja) * 1994-08-01 2003-01-14 荏原ユージライト株式会社 非シアン性貴金属めっき浴
DE19629658C2 (de) * 1996-07-23 1999-01-14 Degussa Cyanidfreies galvanisches Bad zur Abscheidung von Gold und Goldlegierungen
US6251249B1 (en) * 1996-09-20 2001-06-26 Atofina Chemicals, Inc. Precious metal deposition composition and process
JPH10204676A (ja) * 1996-11-25 1998-08-04 C Uyemura & Co Ltd 錫−銀合金電気めっき浴及び錫−銀合金電気めっき方法
US6099713A (en) * 1996-11-25 2000-08-08 C. Uyemura & Co., Ltd. Tin-silver alloy electroplating bath and tin-silver alloy electroplating process
KR100840451B1 (ko) * 1999-03-19 2008-06-20 테크닉,인코포레이티드 수성 전기도금욕, 수성 전기도금욕의 제조 방법, 및 그 수성 전기도금욕을 이용한 도금 방법
DE19928047A1 (de) * 1999-06-19 2000-12-21 Gerhard Hoffacker Schadstoffarme bis schadstoffreie wäßrige Systeme zur galvanischen Abscheidung von Edelmetallen und Edelmetall-Legierungen

Also Published As

Publication number Publication date
EP1162289A1 (en) 2001-12-12
KR20010112499A (ko) 2001-12-20
JP2002060989A (ja) 2002-02-28

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