HK1037388A1 - Sn-cu alloy plating bath - Google Patents

Sn-cu alloy plating bath

Info

Publication number
HK1037388A1
HK1037388A1 HK01108185A HK01108185A HK1037388A1 HK 1037388 A1 HK1037388 A1 HK 1037388A1 HK 01108185 A HK01108185 A HK 01108185A HK 01108185 A HK01108185 A HK 01108185A HK 1037388 A1 HK1037388 A1 HK 1037388A1
Authority
HK
Hong Kong
Prior art keywords
plating bath
alloy plating
alloy
bath
plating
Prior art date
Application number
HK01108185A
Other languages
English (en)
Inventor
Muramatsu Yoshiaki
Yada Yoshihiko
Miyazaki Hideki
Tokio Kanae
Original Assignee
Ebara Udylite Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Udylite Kk filed Critical Ebara Udylite Kk
Publication of HK1037388A1 publication Critical patent/HK1037388A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
HK01108185A 1999-10-07 2001-11-21 Sn-cu alloy plating bath HK1037388A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28674899A JP2001107287A (ja) 1999-10-07 1999-10-07 Ｓｎ−Ｃｕ合金めっき浴

Publications (1)

Publication Number Publication Date
HK1037388A1 true HK1037388A1 (en) 2002-02-08

Family

ID=17708535

Family Applications (1)

Application Number Title Priority Date Filing Date
HK01108185A HK1037388A1 (en) 1999-10-07 2001-11-21 Sn-cu alloy plating bath

Country Status (6)

Country Link
US (1) US6458264B1 (zh)
JP (1) JP2001107287A (zh)
KR (1) KR20010039969A (zh)
CN (1) CN1223707C (zh)
HK (1) HK1037388A1 (zh)
TW (1) TW573075B (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001172791A (ja) * 1999-12-16 2001-06-26 Ishihara Chem Co Ltd スズ−銅系合金メッキ浴、並びに当該メッキ浴によりスズ−銅系合金皮膜を形成した電子部品
CN1662679B (zh) * 2002-07-25 2010-06-16 株式会社新菱 含有锡－银－铜的电镀液、电镀覆膜及电镀方法
ES2531163T3 (es) * 2002-10-11 2015-03-11 Enthone Procedimiento y electrolito para la deposición galvánica de bronces
JP4758614B2 (ja) * 2003-04-07 2011-08-31 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 電気めっき組成物および方法
US7156904B2 (en) * 2003-04-30 2007-01-02 Mec Company Ltd. Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
JP4632027B2 (ja) * 2004-11-19 2011-02-16 石原薬品株式会社 鉛フリーのスズ−銀系合金又はスズ−銅系合金電気メッキ浴
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes
CN101270492B (zh) * 2007-03-21 2010-12-29 来明工业(厦门)有限公司 锡铜合金镀层的电镀液及电镀方法
JP2015193916A (ja) * 2014-03-18 2015-11-05 上村工業株式会社 錫または錫合金の電気めっき浴、およびバンプの製造方法
AR100441A1 (es) * 2014-05-15 2016-10-05 Nippon Steel & Sumitomo Metal Corp Solución para deposición para conexión roscada para un caño o tubo y método de producción de la conexión roscada para un caño o tubo
CN105200469A (zh) * 2015-10-30 2015-12-30 无锡市嘉邦电力管道厂 一种锡-铜合金电镀液及其电镀方法
US11555252B2 (en) 2018-11-07 2023-01-17 Coventya, Inc. Satin copper bath and method of depositing a satin copper layer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4440608A (en) * 1982-08-16 1984-04-03 Mcgean-Rohco, Inc. Process and bath for the electrodeposition of tin-lead alloys
US4749626A (en) * 1985-08-05 1988-06-07 Olin Corporation Whisker resistant tin coatings and baths and methods for making such coatings
US5143544A (en) * 1990-06-04 1992-09-01 Shipley Company Inc. Tin lead plating solution
JP3816241B2 (ja) * 1998-07-14 2006-08-30 株式会社大和化成研究所 金属を還元析出させるための水溶液

Also Published As

Publication number Publication date
TW573075B (en) 2004-01-21
KR20010039969A (ko) 2001-05-15
JP2001107287A (ja) 2001-04-17
CN1300881A (zh) 2001-06-27
CN1223707C (zh) 2005-10-19
US6458264B1 (en) 2002-10-01

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20090930