HK1025874A2 - Platinum electroforming/electrodeposition bath and method - Google Patents
Platinum electroforming/electrodeposition bath and methodInfo
- Publication number
- HK1025874A2 HK1025874A2 HK00103252A HK00103252A HK1025874A2 HK 1025874 A2 HK1025874 A2 HK 1025874A2 HK 00103252 A HK00103252 A HK 00103252A HK 00103252 A HK00103252 A HK 00103252A HK 1025874 A2 HK1025874 A2 HK 1025874A2
- Authority
- HK
- Hong Kong
- Prior art keywords
- electrodeposition bath
- platinum electroforming
- electroforming
- platinum
- electrodeposition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
-
- A—HUMAN NECESSITIES
- A44—HABERDASHERY; JEWELLERY
- A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
- A44C27/00—Making jewellery or other personal adornments
- A44C27/001—Materials for manufacturing jewellery
- A44C27/005—Coating layers for jewellery
- A44C27/006—Metallic coatings
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9913920A GB2351089B (en) | 1999-06-15 | 1999-06-15 | Platinum electroforming/electroplating bath and method |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1025874A2 true HK1025874A2 (en) | 2000-10-20 |
Family
ID=10855396
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK00103252A HK1025874A2 (en) | 1999-06-15 | 2000-05-31 | Platinum electroforming/electrodeposition bath and method |
HK01100349A HK1029815A1 (en) | 1999-06-15 | 2001-01-12 | Platinum electroforming/electroplating bath and method |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK01100349A HK1029815A1 (en) | 1999-06-15 | 2001-01-12 | Platinum electroforming/electroplating bath and method |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN1283711A (zh) |
GB (1) | GB2351089B (zh) |
HK (2) | HK1025874A2 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2989694B1 (fr) * | 2012-04-19 | 2015-02-27 | Snecma | Procede de fabrication d'un bain electrolytique pour la realisation d'une sous-couche metallique a base de platine sur un substrat metallique |
CN103774187A (zh) * | 2012-10-26 | 2014-05-07 | 北京师范大学 | 一种电沉积制备铂多孔纳米管的方法 |
CN105132963A (zh) * | 2015-09-21 | 2015-12-09 | 无锡清杨机械制造有限公司 | 一种电镀铂的碱性p盐镀液及其电镀方法 |
CN105386093A (zh) * | 2015-09-21 | 2016-03-09 | 无锡清杨机械制造有限公司 | 一种Pt的碱性P盐电镀液及其电镀方法 |
CN105386095A (zh) * | 2015-09-21 | 2016-03-09 | 无锡清杨机械制造有限公司 | 一种碱性镀铂的p盐电镀液及其电镀方法 |
US10612149B1 (en) | 2019-09-05 | 2020-04-07 | Chow Sang Sang Jewellery Company Limited | Platinum electrodeposition bath and uses thereof |
TWI784601B (zh) * | 2021-01-08 | 2022-11-21 | 日商Eeja股份有限公司 | 鉑電鍍浴及鍍鉑製品 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL297569A (zh) * | 1962-09-06 | |||
FR1368236A (fr) * | 1963-06-18 | 1964-07-31 | Electrochimie Soc | Procédé de platinage |
GB1237077A (en) * | 1967-11-10 | 1971-06-30 | Ici Ltd | Electrodeposition of a platinum metal on titanium or titanium alloy to make an electrode |
US3907650A (en) * | 1973-02-12 | 1975-09-23 | Xerox Corp | Photosensitive binder layer for xerography |
IT1128813B (it) * | 1980-06-19 | 1986-06-04 | Sorin Biomedica Spa | Elettrodo per stimolatori cardiaci e procedimento per la sua fabbricazione |
GB8323390D0 (en) * | 1983-08-31 | 1983-10-05 | Ici Plc | Production of cathode |
US4750977A (en) * | 1986-12-17 | 1988-06-14 | Bacharach, Inc. | Electrochemical plating of platinum black utilizing ultrasonic agitation |
JP3452442B2 (ja) * | 1996-03-21 | 2003-09-29 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 白金めっき品の製造方法 |
-
1999
- 1999-06-15 GB GB9913920A patent/GB2351089B/en not_active Expired - Fee Related
-
2000
- 2000-05-31 HK HK00103252A patent/HK1025874A2/xx not_active IP Right Cessation
- 2000-06-13 CN CN 00109162 patent/CN1283711A/zh active Pending
-
2001
- 2001-01-12 HK HK01100349A patent/HK1029815A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
GB2351089A (en) | 2000-12-20 |
HK1029815A1 (en) | 2001-04-12 |
GB9913920D0 (en) | 1999-08-18 |
CN1283711A (zh) | 2001-02-14 |
GB2351089B (en) | 2001-04-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PEU | Short-term patents expired |
Effective date: 20080530 |