HK1012833A1 - Process for wave soldering components on a printed circuit board in a temperature controlled non-oxidizing atmosphere - Google Patents

Process for wave soldering components on a printed circuit board in a temperature controlled non-oxidizing atmosphere

Info

Publication number
HK1012833A1
HK1012833A1 HK98113997A HK98113997A HK1012833A1 HK 1012833 A1 HK1012833 A1 HK 1012833A1 HK 98113997 A HK98113997 A HK 98113997A HK 98113997 A HK98113997 A HK 98113997A HK 1012833 A1 HK1012833 A1 HK 1012833A1
Authority
HK
Hong Kong
Prior art keywords
circuit board
printed circuit
oxidizing atmosphere
temperature controlled
wave soldering
Prior art date
Application number
HK98113997A
Other languages
English (en)
Inventor
Kevin P Mckean
Frederic Rotman
Robert W Connors
Original Assignee
Air Liquide
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Air Liquide filed Critical Air Liquide
Publication of HK1012833A1 publication Critical patent/HK1012833A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
HK98113997A 1994-04-22 1998-12-18 Process for wave soldering components on a printed circuit board in a temperature controlled non-oxidizing atmosphere HK1012833A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/231,068 US5520320A (en) 1994-04-22 1994-04-22 Process for wave soldering components on a printed circuit board in a temperature controlled non-oxidizing atmosphere

Publications (1)

Publication Number Publication Date
HK1012833A1 true HK1012833A1 (en) 1999-08-06

Family

ID=22867628

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98113997A HK1012833A1 (en) 1994-04-22 1998-12-18 Process for wave soldering components on a printed circuit board in a temperature controlled non-oxidizing atmosphere

Country Status (9)

Country Link
US (1) US5520320A (de)
EP (1) EP0681418B1 (de)
JP (1) JP4116102B2 (de)
KR (1) KR100333122B1 (de)
CN (1) CN1138461C (de)
CA (1) CA2146594A1 (de)
DE (1) DE69511613T2 (de)
HK (1) HK1012833A1 (de)
TW (1) TW319946B (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5685475A (en) * 1995-09-08 1997-11-11 Ford Motor Company Apparatus for cooling printed circuit boards in wave soldering
DE19749185A1 (de) * 1997-11-07 1999-05-12 Messer Griesheim Gmbh Mit einer Gasversorgung verbindbare Gasverteilung
DE19749187A1 (de) * 1997-11-07 1999-05-12 Messer Griesheim Gmbh Lötvorrichtung
US6305596B1 (en) * 1998-06-18 2001-10-23 Asustek Computer Inc. Apparatus and method for soldering through-hole components on circuit board
US6234380B1 (en) * 1998-10-29 2001-05-22 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Apparatus and method for inerting a wave soldering installation
GB2365117B (en) * 2000-07-28 2005-02-16 Planer Products Ltd Method of and apparatus for heating a substrate
JP2002080950A (ja) * 2000-09-07 2002-03-22 Senju Metal Ind Co Ltd ドロスから酸化物を分離する方法および噴流はんだ槽
US6805282B2 (en) * 2000-09-26 2004-10-19 Matsushita Electric Industrial Co., Ltd. Flow soldering process and apparatus
DE102005003498A1 (de) * 2005-01-25 2006-07-27 Linde Ag Dampfphasen-Löten
FR2926233B1 (fr) * 2008-01-10 2010-08-13 Air Liquide Dispositif d'alimentation en gaz d'une machine de brasage ou etamage a la vague.
CN102548244A (zh) * 2010-12-22 2012-07-04 联合汽车电子有限公司 辅助焊接结构
CN103212761B (zh) * 2012-06-26 2015-05-06 深圳市堃琦鑫华股份有限公司 一种焊接方法
US9198300B2 (en) 2014-01-23 2015-11-24 Illinois Tool Works Inc. Flux management system and method for a wave solder machine
US20150216092A1 (en) * 2014-01-28 2015-07-30 Illinois Tool Works Inc. Forced convection pre-heater for wave solder machine and related method
US9161459B2 (en) 2014-02-25 2015-10-13 Illinois Tool Works Inc. Pre-heater latch and seal mechanism for wave solder machine and related method
CN113458525B (zh) * 2021-06-24 2022-08-12 深圳市浩晟达实业有限公司 一种回流焊炉
CN114101839A (zh) * 2021-11-29 2022-03-01 苏州浪潮智能科技有限公司 波峰焊炉
CN117415402B (zh) * 2023-12-19 2024-02-23 武汉飞特电气有限公司 一种利用焊接处理室制造真空开关管组件的方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1102621A (en) * 1965-04-07 1968-02-07 Electrovert Mfg Company Ltd Method and apparatus for fluxing and soldering connections on printed circuit boards
US3605244A (en) * 1966-04-20 1971-09-20 Electrovert Mfg Co Ltd Soldering methods and apparatus
US3904102A (en) * 1974-06-05 1975-09-09 Western Electric Co Apparatus and method for soldering, fusing or brazing
FR2583064B1 (fr) * 1985-06-05 1987-08-14 Air Liquide Procede de traitement thermique, hotte pour la mise en oeuvre de ce procede et son utilisation dans les fours de traitement thermique
US5090651A (en) * 1990-01-31 1992-02-25 Electrovert Ltd. Gas curtain additives and zoned tunnel for soldering
US5230460A (en) * 1990-06-13 1993-07-27 Electrovert Ltd. High volume convection preheater for wave soldering
US5121875A (en) * 1991-02-22 1992-06-16 Union Carbide Industrial Gases Technology Corporation Wave soldering in a protective atmosphere enclosure over a solder pot
GB9121003D0 (en) * 1991-10-03 1991-11-13 Boc Group Plc Soldering
US5203489A (en) * 1991-12-06 1993-04-20 Electrovert Ltd. Gas shrouded wave soldering
US5297724A (en) * 1993-05-26 1994-03-29 The Boc Group, Inc. Wave soldering method and apparatus
US5409159A (en) * 1994-02-28 1995-04-25 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Apparatus and methods for inerting solder during wave soldering operations

Also Published As

Publication number Publication date
KR950035549A (ko) 1995-12-30
CA2146594A1 (en) 1995-10-23
CN1112352A (zh) 1995-11-22
TW319946B (de) 1997-11-11
EP0681418A3 (de) 1997-01-29
JP4116102B2 (ja) 2008-07-09
JPH0864949A (ja) 1996-03-08
EP0681418B1 (de) 1999-08-25
US5520320A (en) 1996-05-28
KR100333122B1 (ko) 2002-09-05
CN1138461C (zh) 2004-02-11
EP0681418A2 (de) 1995-11-08
DE69511613D1 (de) 1999-09-30
DE69511613T2 (de) 2000-03-16

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20100421