HK1007215A1 - Transport robot for a machining or processing line for lead frames - Google Patents
Transport robot for a machining or processing line for lead framesInfo
- Publication number
- HK1007215A1 HK1007215A1 HK98106245A HK98106245A HK1007215A1 HK 1007215 A1 HK1007215 A1 HK 1007215A1 HK 98106245 A HK98106245 A HK 98106245A HK 98106245 A HK98106245 A HK 98106245A HK 1007215 A1 HK1007215 A1 HK 1007215A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- wall
- transport robot
- magazine
- clamping device
- lead frames
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/02—Gripping heads and other end effectors servo-actuated
- B25J15/0253—Gripping heads and other end effectors servo-actuated comprising parallel grippers
- B25J15/026—Gripping heads and other end effectors servo-actuated comprising parallel grippers actuated by gears
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Warehouses Or Storage Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Multi-Process Working Machines And Systems (AREA)
- Specific Conveyance Elements (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH178592 | 1992-06-03 | ||
PCT/CH1993/000130 WO1993024953A1 (de) | 1992-06-03 | 1993-05-21 | Transportroboter für eine bearbeitungs- bzw. behandlungslinie für systemträger |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1007215A1 true HK1007215A1 (en) | 1999-04-01 |
Family
ID=4218550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK98106245A HK1007215A1 (en) | 1992-06-03 | 1998-06-24 | Transport robot for a machining or processing line for lead frames |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0597052B1 (ko) |
JP (1) | JPH07503413A (ko) |
KR (1) | KR100268599B1 (ko) |
AT (1) | ATE137062T1 (ko) |
DE (1) | DE59302257D1 (ko) |
HK (1) | HK1007215A1 (ko) |
SG (1) | SG47434A1 (ko) |
WO (1) | WO1993024953A1 (ko) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE29718994U1 (de) * | 1997-10-24 | 1998-02-19 | Siemens AG, 80333 München | Einrichtung zum Greifen von Magazinen |
SG100644A1 (en) * | 2000-04-04 | 2003-12-26 | Esec Trading Sa | Linear guide with air bearing |
EP1143489A1 (en) * | 2000-04-04 | 2001-10-10 | ESEC Trading SA | Linear guide with an air bearing |
EP1143487A1 (de) * | 2000-04-04 | 2001-10-10 | ESEC Trading S.A. | Linearführung mit einem Luftlager |
DE102007021068A1 (de) * | 2007-05-04 | 2008-11-06 | Christian Beer | Verfahren und Vorrichtung zum Abgeben und Aufnehmen von Werkstücken auf eine Arbeitsebene |
CN108340655B (zh) * | 2018-03-30 | 2023-07-14 | 青岛乾程科技股份有限公司 | 一种液晶屏撕膜装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4816732A (en) * | 1987-08-17 | 1989-03-28 | Sgs Thomson Microelectronics, Inc. | Robotic hand for transporting semiconductor wafer carriers |
IT1235835B (it) * | 1989-08-08 | 1992-11-03 | Sgs Thomson Microelectronics | Movimentazione automatica di contenitori diversi con punti di prelievo e di codificazione standarizzati |
-
1993
- 1993-05-21 WO PCT/CH1993/000130 patent/WO1993024953A1/de active IP Right Grant
- 1993-05-21 AT AT93909739T patent/ATE137062T1/de not_active IP Right Cessation
- 1993-05-21 JP JP6500056A patent/JPH07503413A/ja active Pending
- 1993-05-21 KR KR1019930703998A patent/KR100268599B1/ko not_active IP Right Cessation
- 1993-05-21 SG SG1996001350A patent/SG47434A1/en unknown
- 1993-05-21 EP EP93909739A patent/EP0597052B1/de not_active Expired - Lifetime
- 1993-05-21 DE DE59302257T patent/DE59302257D1/de not_active Expired - Fee Related
-
1998
- 1998-06-24 HK HK98106245A patent/HK1007215A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0597052B1 (de) | 1996-04-17 |
KR940701583A (ko) | 1994-05-28 |
JPH07503413A (ja) | 1995-04-13 |
KR100268599B1 (ko) | 2000-10-16 |
SG47434A1 (en) | 1998-04-17 |
EP0597052A1 (de) | 1994-05-18 |
DE59302257D1 (de) | 1996-05-23 |
ATE137062T1 (de) | 1996-05-15 |
WO1993024953A1 (de) | 1993-12-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |