HK1005485A1 - Method of sealing electronic parts with molded resin and mold employed therefor - Google Patents
Method of sealing electronic parts with molded resin and mold employed therefor Download PDFInfo
- Publication number
- HK1005485A1 HK1005485A1 HK98104545A HK98104545A HK1005485A1 HK 1005485 A1 HK1005485 A1 HK 1005485A1 HK 98104545 A HK98104545 A HK 98104545A HK 98104545 A HK98104545 A HK 98104545A HK 1005485 A1 HK1005485 A1 HK 1005485A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- mold section
- internal space
- space portion
- sealing member
- hollow sealing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06067664 | 1994-03-11 | ||
| JP06766494A JP3423766B2 (ja) | 1994-03-11 | 1994-03-11 | 電子部品の樹脂封止成形方法及び金型装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| HK1005485A1 true HK1005485A1 (en) | 1999-01-08 |
| HK1005485B HK1005485B (en) | 1999-01-08 |
Family
ID=
Also Published As
| Publication number | Publication date |
|---|---|
| US5753538A (en) | 1998-05-19 |
| JPH07249647A (ja) | 1995-09-26 |
| NL195034C (nl) | 2003-12-02 |
| GB9503407D0 (en) | 1995-04-12 |
| MY112442A (en) | 2001-06-30 |
| GB2287672A (en) | 1995-09-27 |
| NL195034B (nl) | 2003-08-01 |
| KR100196575B1 (ko) | 1999-06-15 |
| GB2287672B (en) | 1997-11-26 |
| SG47992A1 (en) | 1998-04-17 |
| JP3423766B2 (ja) | 2003-07-07 |
| TW265315B (enExample) | 1995-12-11 |
| NL9500483A (nl) | 1995-10-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PF | Patent in force | ||
| PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20050221 |