HK1001818A1 - Dry-developable positive resist - Google Patents
Dry-developable positive resistInfo
- Publication number
- HK1001818A1 HK1001818A1 HK98100141A HK98100141A HK1001818A1 HK 1001818 A1 HK1001818 A1 HK 1001818A1 HK 98100141 A HK98100141 A HK 98100141A HK 98100141 A HK98100141 A HK 98100141A HK 1001818 A1 HK1001818 A1 HK 1001818A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- pct
- dry
- date nov
- sec
- positive resist
- Prior art date
Links
- 239000002253 acid Substances 0.000 abstract 1
- 239000000654 additive Substances 0.000 abstract 1
- 230000000996 additive effect Effects 0.000 abstract 1
- 229920005601 base polymer Polymers 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 abstract 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 abstract 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 125000003011 styrenyl group Chemical class [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 abstract 1
- 229920001897 terpolymer Polymers 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/115—Cationic or anionic
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4418205 | 1994-05-25 | ||
PCT/DE1995/000626 WO1995032455A1 (de) | 1994-05-25 | 1995-05-11 | Trockenentwickelbarer positivresist |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1001818A1 true HK1001818A1 (en) | 1998-07-10 |
Family
ID=6518912
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK98100141A HK1001818A1 (en) | 1994-05-25 | 1998-01-08 | Dry-developable positive resist |
Country Status (7)
Country | Link |
---|---|
US (1) | US5733706A (xx) |
EP (1) | EP0760971B1 (xx) |
KR (1) | KR100382253B1 (xx) |
CN (1) | CN1149341A (xx) |
DE (1) | DE59506534D1 (xx) |
HK (1) | HK1001818A1 (xx) |
WO (1) | WO1995032455A1 (xx) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU3964199A (en) * | 1998-04-07 | 1999-10-25 | Euv Limited Liability Corporation | Thin layer imaging process for microlithography using radiation at strongly attenuated wavelengths |
KR20010031071A (ko) | 1998-08-11 | 2001-04-16 | 레빈 제임스 피. | 공중합체 레지스트용 단일 성분 현상제 |
US6426177B2 (en) | 1998-08-11 | 2002-07-30 | International Business Machines Corporation | Single component developer for use with ghost exposure |
US6436605B1 (en) | 1999-07-12 | 2002-08-20 | International Business Machines Corporation | Plasma resistant composition and use thereof |
US6348407B1 (en) * | 2001-03-15 | 2002-02-19 | Chartered Semiconductor Manufacturing Inc. | Method to improve adhesion of organic dielectrics in dual damascene interconnects |
JP3999030B2 (ja) * | 2001-12-13 | 2007-10-31 | セントラル硝子株式会社 | 含フッ素重合性単量体およびそれを用いた高分子化合物、反射防止膜材料 |
TWI335218B (en) * | 2003-02-19 | 2011-01-01 | Panion & Bf Biotech Inc | Ferric organic compounds, uses thereof and methods of making same |
CN103035512B (zh) * | 2012-11-02 | 2015-08-19 | 上海华虹宏力半导体制造有限公司 | 一种非感光性聚酰亚胺钝化层的制作方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4491628A (en) * | 1982-08-23 | 1985-01-01 | International Business Machines Corporation | Positive- and negative-working resist compositions with acid generating photoinitiator and polymer with acid labile groups pendant from polymer backbone |
CA1248402A (en) * | 1983-09-16 | 1989-01-10 | Larry E. Stillwagon | Method of making articles using gas functionalized plasma developed layer |
US4552833A (en) * | 1984-05-14 | 1985-11-12 | International Business Machines Corporation | Radiation sensitive and oxygen plasma developable resist |
US4551418A (en) * | 1985-02-19 | 1985-11-05 | International Business Machines Corporation | Process for preparing negative relief images with cationic photopolymerization |
US4613398A (en) * | 1985-06-06 | 1986-09-23 | International Business Machines Corporation | Formation of etch-resistant resists through preferential permeation |
US4657845A (en) * | 1986-01-14 | 1987-04-14 | International Business Machines Corporation | Positive tone oxygen plasma developable photoresist |
GB8611229D0 (en) * | 1986-05-08 | 1986-06-18 | Ucb Sa | Forming positive pattern |
NL8700421A (nl) * | 1987-02-20 | 1988-09-16 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting. |
EP0307752B1 (en) * | 1987-09-16 | 1995-02-22 | Hoechst Aktiengesellschaft | Poly(3-mono- and 3,5-disubstituted-4-acetoxystyrenes and 4-hydroxy-styrenes)and their use |
US4921778A (en) * | 1988-07-29 | 1990-05-01 | Shipley Company Inc. | Photoresist pattern fabrication employing chemically amplified metalized material |
US5023164A (en) * | 1989-10-23 | 1991-06-11 | International Business Machines Corporation | Highly sensitive dry developable deep UV photoresist |
EP0451311B1 (de) * | 1990-04-12 | 1999-03-10 | Siemens Aktiengesellschaft | Verfahren zur Erzeugung einer Resiststruktur |
DE59010396D1 (de) * | 1990-04-27 | 1996-08-01 | Siemens Ag | Verfahren zur Erzeugung einer Resiststruktur |
EP0492256B1 (de) * | 1990-12-20 | 1996-08-14 | Siemens Aktiengesellschaft | Photolithographische Strukturerzeugung |
US5296332A (en) * | 1991-11-22 | 1994-03-22 | International Business Machines Corporation | Crosslinkable aqueous developable photoresist compositions and method for use thereof |
US5399604A (en) * | 1992-07-24 | 1995-03-21 | Japan Synthetic Rubber Co., Ltd. | Epoxy group-containing resin compositions |
JPH06250390A (ja) * | 1993-02-26 | 1994-09-09 | Nippon Oil & Fats Co Ltd | 光硬化性樹脂組成物 |
-
1995
- 1995-05-11 KR KR1019960706662A patent/KR100382253B1/ko not_active IP Right Cessation
- 1995-05-11 EP EP95918519A patent/EP0760971B1/de not_active Expired - Lifetime
- 1995-05-11 US US08/737,989 patent/US5733706A/en not_active Expired - Lifetime
- 1995-05-11 WO PCT/DE1995/000626 patent/WO1995032455A1/de active IP Right Grant
- 1995-05-11 CN CN95193140A patent/CN1149341A/zh active Pending
- 1995-05-11 DE DE59506534T patent/DE59506534D1/de not_active Expired - Fee Related
-
1998
- 1998-01-08 HK HK98100141A patent/HK1001818A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE59506534D1 (de) | 1999-09-09 |
EP0760971B1 (de) | 1999-08-04 |
EP0760971A1 (de) | 1997-03-12 |
WO1995032455A1 (de) | 1995-11-30 |
KR970703551A (ko) | 1997-07-03 |
KR100382253B1 (ko) | 2003-08-21 |
US5733706A (en) | 1998-03-31 |
CN1149341A (zh) | 1997-05-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |