GB994852A - Improvements in or relating to insulated electric circuit assemblies - Google Patents

Improvements in or relating to insulated electric circuit assemblies

Info

Publication number
GB994852A
GB994852A GB752963A GB752963A GB994852A GB 994852 A GB994852 A GB 994852A GB 752963 A GB752963 A GB 752963A GB 752963 A GB752963 A GB 752963A GB 994852 A GB994852 A GB 994852A
Authority
GB
United Kingdom
Prior art keywords
sheet
copper
copolymer
resin
roll
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB752963A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Garlock Inc
Original Assignee
Garlock Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Garlock Inc filed Critical Garlock Inc
Publication of GB994852A publication Critical patent/GB994852A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

994,852. Laminates and laminating. GARLOCK Inc. Feb. 25, 1963 [March 5, 1962], No. 7529/63. Drawings to Specification. Heading B5N. [Also in Division H1] Printed circuit assemblies are made from flexible laminated sheets comprising at least one sheet of electrodeposited unoxidized copper directly bonded to the surface of a flexible base of a copolymer of from 5-50% by weight of hexafluoropropylene and from 95-50% by weight of tetrafluoroethylene using heat and pressure. The circuit may be formed by etching unwanted portions of the copper to form a predetermined conductive path, a further layer of the same copolymer being placed over the copper sheet and pressure being applied to cause it to flow into exposed areas of the base and unite therewith. A sheet of the copolymer may be drawn from a roll, pre-heated in a heating tunnel, and passed between a pair of rolls together with a sheet of unoxidized electrodeposited copper with the grainy side of the copper in contact with the copolymer sheet. The roll in contact with the copolymer is heated either by gas or electrically, to melt the resin surface, sufficient pressure being exerted to effect bonding with the copper. The roll in contact with the copper may be either hot or cold. The laminate so formed is then passed between two sets of water-cooled rollers to cool it in two stages. A further sheet of copolymer resin is subsequently bonded to the exposed areas of the first sheet to completely enclose the copper. Alternatively a platen press may be used using a release foil to prevent adherence between the resin sheet and the platen, the copper sheet being pressed on to the resin sheet and baked; it is then etched and a further resin copolymer layer is applied. The Specification includes information relating to the properties of the resin copolymer.
GB752963A 1962-03-05 1963-02-25 Improvements in or relating to insulated electric circuit assemblies Expired GB994852A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17740062A 1962-03-05 1962-03-05

Publications (1)

Publication Number Publication Date
GB994852A true GB994852A (en) 1965-06-10

Family

ID=22648452

Family Applications (1)

Application Number Title Priority Date Filing Date
GB752963A Expired GB994852A (en) 1962-03-05 1963-02-25 Improvements in or relating to insulated electric circuit assemblies

Country Status (2)

Country Link
DE (1) DE1465571B1 (en)
GB (1) GB994852A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4354895A (en) * 1981-11-27 1982-10-19 International Business Machines Corporation Method for making laminated multilayer circuit boards
DE3205591A1 (en) * 1982-02-17 1983-09-29 Siemens AG, 1000 Berlin und 8000 München BASIC MATERIAL FOR FLEXIBLE PRINTED CIRCUITS

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2549935A (en) * 1946-06-18 1951-04-24 Du Pont Polymers of hexafluoropropene
NL108173C (en) * 1954-06-25
AT215517B (en) * 1959-08-19 1961-06-12 Elektro App Werke Veb Process for the production of printed circuits by high vacuum vapor deposition for electrical devices
US2997521A (en) * 1960-04-11 1961-08-22 Sanders Associates Inc Insulated electric circuit assembly

Also Published As

Publication number Publication date
DE1465571B1 (en) 1970-08-20

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