GB992580A - Improvements in or relating to semi-conductor devices - Google Patents

Improvements in or relating to semi-conductor devices

Info

Publication number
GB992580A
GB992580A GB3133560A GB3133560A GB992580A GB 992580 A GB992580 A GB 992580A GB 3133560 A GB3133560 A GB 3133560A GB 3133560 A GB3133560 A GB 3133560A GB 992580 A GB992580 A GB 992580A
Authority
GB
United Kingdom
Prior art keywords
rim
base
cup
semi
forced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3133560A
Inventor
Donald Moore Barton
David John Hunter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Mobility Ltd
Original Assignee
Westinghouse Brake and Signal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DENDAT1250563D priority Critical patent/DE1250563B/de
Application filed by Westinghouse Brake and Signal Co Ltd filed Critical Westinghouse Brake and Signal Co Ltd
Priority to GB3133560A priority patent/GB992580A/en
Priority to FR872560A priority patent/FR1299467A/en
Publication of GB992580A publication Critical patent/GB992580A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

992,580. Semi-conductor devices. WESTINGHOUSE BRAKE & SIGNAL CO. Ltd. Sept. 4, 1961 [Sept. 12, 1960; Dec. 9, 1960; June 13, 1961], Nos. 31335/60, 42424/60 and 21234/61. Heading H1K. The sealed housing of a semi-conductor device is formed by forcing a cup-shaped housing part, the rim of which is inclined with respect to the axis of the cup, into contact with a second housing part. The rim is forced inwardly or outwardly into engagement with an edge structure on the second part to form a seal therewith. In a typical assembly, Fig. 6, the rim 3 which is frusto-conical before assembly is forced flat by axial pressure to bite into the foot of the annular rim 4 of the base part. In alternative forms of this assembly the semi-conductor device 7 is mounted on a stud extending through the base part or on a metal plate placed within the rim of the base. As a further alternative the rim of the cup may be inclined inwardly and forced into edge engagement with a boss formed in the base. In this ease the channel formed between the side walls of the boss and cup may be filled with solder or plastic to reinforce the seal. In other arrangements (Figs. 9 and 11) the inclined part formed by cutting a groove in the rim is forced to bite into the outside surface of annular rim 18 (Fig. 9) or the wall of a circular recess 20 (Fig. 11) in the base by application of axial pressure. When a soft material is used for the base, rim 27 (Fig. 14) can be reinforced by inserting a ring 26 of hard metal into an annular groove formed outside the rim. In this case the axial pressure is used to flatten the frustoconical rim 3 of the cup and dig it into the rim.
GB3133560A 1960-09-12 1960-09-12 Improvements in or relating to semi-conductor devices Expired GB992580A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DENDAT1250563D DE1250563B (en) 1960-09-12
GB3133560A GB992580A (en) 1960-09-12 1960-09-12 Improvements in or relating to semi-conductor devices
FR872560A FR1299467A (en) 1960-09-12 1961-09-07 Process for the production of a waterproof housing for devices with asymmetric conductivity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3133560A GB992580A (en) 1960-09-12 1960-09-12 Improvements in or relating to semi-conductor devices

Publications (1)

Publication Number Publication Date
GB992580A true GB992580A (en) 1965-05-19

Family

ID=10321604

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3133560A Expired GB992580A (en) 1960-09-12 1960-09-12 Improvements in or relating to semi-conductor devices

Country Status (2)

Country Link
DE (1) DE1250563B (en)
GB (1) GB992580A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112951773A (en) * 2021-01-28 2021-06-11 安阳师范学院 Welding and sealing structure of high-power semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112951773A (en) * 2021-01-28 2021-06-11 安阳师范学院 Welding and sealing structure of high-power semiconductor device

Also Published As

Publication number Publication date
DE1250563B (en)

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