GB9622822D0 - Semiconductor device and method of manufacture - Google Patents

Semiconductor device and method of manufacture

Info

Publication number
GB9622822D0
GB9622822D0 GBGB9622822.6A GB9622822A GB9622822D0 GB 9622822 D0 GB9622822 D0 GB 9622822D0 GB 9622822 A GB9622822 A GB 9622822A GB 9622822 D0 GB9622822 D0 GB 9622822D0
Authority
GB
United Kingdom
Prior art keywords
manufacture
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB9622822.6A
Other versions
GB2306780A (en
GB2306780B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
Hyundai Electronics Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Industries Co Ltd filed Critical Hyundai Electronics Industries Co Ltd
Publication of GB9622822D0 publication Critical patent/GB9622822D0/en
Publication of GB2306780A publication Critical patent/GB2306780A/en
Application granted granted Critical
Publication of GB2306780B publication Critical patent/GB2306780B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/32—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
    • H01L21/76221—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO with a plurality of successive local oxidation steps

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Element Separation (AREA)
GB9622822A 1995-11-03 1996-11-01 Semiconductor device and method of manufacture Expired - Fee Related GB2306780B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950039693A KR100197651B1 (en) 1995-11-03 1995-11-03 Method of forming an element isolation film of semiconductor device

Publications (3)

Publication Number Publication Date
GB9622822D0 true GB9622822D0 (en) 1997-01-08
GB2306780A GB2306780A (en) 1997-05-07
GB2306780B GB2306780B (en) 2000-03-08

Family

ID=19432953

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9622822A Expired - Fee Related GB2306780B (en) 1995-11-03 1996-11-01 Semiconductor device and method of manufacture

Country Status (7)

Country Link
US (1) US5719086A (en)
JP (1) JP2875787B2 (en)
KR (1) KR100197651B1 (en)
CN (1) CN1073745C (en)
DE (1) DE19645440C2 (en)
GB (1) GB2306780B (en)
TW (1) TW312039B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100209367B1 (en) * 1996-04-22 1999-07-15 김영환 Insulating film forming method of semiconductor device
KR100232899B1 (en) * 1997-06-02 1999-12-01 김영환 Semiconductor element isolation film manufacturing method
KR100235950B1 (en) * 1997-06-26 1999-12-15 김영환 Method of forming a device field oxide film of semiconductor device
US5940718A (en) * 1998-07-20 1999-08-17 Advanced Micro Devices Nitridation assisted polysilicon sidewall protection in self-aligned shallow trench isolation
KR100369776B1 (en) * 1999-12-28 2003-01-30 페어차일드코리아반도체 주식회사 a surface treatment method for a thin film of a semiconductor device and photolithography method thereof
KR100672761B1 (en) * 2001-06-28 2007-01-22 주식회사 하이닉스반도체 The method for forming contact plug
US6495430B1 (en) * 2002-05-21 2002-12-17 Macronix International Co., Ltd. Process for fabricating sharp corner-free shallow trench isolation structure
KR100672753B1 (en) 2003-07-24 2007-01-22 주식회사 하이닉스반도체 Method for preventing electron trapping of trench isolation
US7804143B2 (en) * 2008-08-13 2010-09-28 Intersil Americas, Inc. Radiation hardened device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5965445A (en) * 1982-10-05 1984-04-13 Matsushita Electronics Corp Formation of semiconductor element isolation region
JPS5975667A (en) * 1982-10-25 1984-04-28 Oki Electric Ind Co Ltd Manufacture of semiconductor device
JPS6072245A (en) * 1983-09-28 1985-04-24 Toshiba Corp Manufacture of semiconductor device
US5256895A (en) * 1987-02-24 1993-10-26 Sgs-Thomson Microelectronics, Inc. Pad oxide protect sealed interface isolation
DE3832450A1 (en) * 1987-10-19 1989-04-27 Ncr Co Method for forming field-oxide regions in a silicon substrate
NL8800903A (en) * 1988-04-08 1989-11-01 Koninkl Philips Electronics Nv METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE WITH A SILICONE SUBSTRATE WITH WHOLE OR PARTLY SUNCILLED FIELD OXIDE AREAS.
US5298451A (en) * 1991-04-30 1994-03-29 Texas Instruments Incorporated Recessed and sidewall-sealed poly-buffered LOCOS isolation methods
US5087586A (en) * 1991-07-03 1992-02-11 Micron Technology, Inc. Process for creating fully-recessed field isolation regions by oxidizing a selectively-grown epitaxial silicon layer
KR940003224B1 (en) * 1991-10-12 1994-04-16 금성일렉트론 주식회사 Segregation method for semiconductor device
KR960005553B1 (en) * 1993-03-31 1996-04-26 현대전자산업주식회사 Manufacturing method of field oxide

Also Published As

Publication number Publication date
CN1073745C (en) 2001-10-24
DE19645440A1 (en) 1997-05-07
KR100197651B1 (en) 1999-06-15
DE19645440C2 (en) 2002-06-20
JP2875787B2 (en) 1999-03-31
CN1156325A (en) 1997-08-06
KR970030626A (en) 1997-06-26
GB2306780A (en) 1997-05-07
TW312039B (en) 1997-08-01
JPH09181069A (en) 1997-07-11
GB2306780B (en) 2000-03-08
US5719086A (en) 1998-02-17

Similar Documents

Publication Publication Date Title
EP0690497A3 (en) Semiconductor device and method of forming
GB2306779B (en) Method of fabricating semiconductor device
GB2304995B (en) Semiconductor laser device and method of fabricating semiconductor laser device
HK1004843A1 (en) Semiconductor device and manufacture method of same
GB2329069B (en) Semiconductor device and method of manufacture
EP0680086A3 (en) Semiconductor device and method of producing said semiconductor device.
GB2307595B (en) Optical semiconductor device and method of manufacturing thereof
GB2286082B (en) Semiconductor device and method of fabrication therefor
GB2332777B (en) Semiconductor device and method of manufacture
GB2314682B (en) A semiconductor device and method of manufacture
GB2290165B (en) Semiconductor device and method of fabrication thereof
EP0798776A3 (en) Semiconductor device and method of producing same
GB2306780B (en) Semiconductor device and method of manufacture
GB9612263D0 (en) Semiconductor device and method of manufacture
GB2279806B (en) Semiconductor device and method of making same
GB2307790B (en) Semiconductor device and method of manufacture
GB9514996D0 (en) Semiconductor devices and methods of manufacturing them
EP0723297A3 (en) Semiconductor memory device and method of making the same
GB2295049B (en) Semiconductor cut-off device and method of manufacture
GB2275569B (en) Semiconductor device and method of making same
GB2293485B (en) Semiconductor device and method of making the semiconductor device
GB2302986B (en) Semiconductor device and fabricating method thereof
GB2327535B (en) Semiconductor device and method of forming semiconductor device
GB2301707B (en) Semiconductor device and method of making same
GB2304997B (en) Method of fabricating semiconductor device

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20071101