GB942755A - Improvements in or relating to glassy compositions - Google Patents
Improvements in or relating to glassy compositionsInfo
- Publication number
- GB942755A GB942755A GB7570/60A GB757060A GB942755A GB 942755 A GB942755 A GB 942755A GB 7570/60 A GB7570/60 A GB 7570/60A GB 757060 A GB757060 A GB 757060A GB 942755 A GB942755 A GB 942755A
- Authority
- GB
- United Kingdom
- Prior art keywords
- component consisting
- pict
- glasseous
- elements
- iodine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/32—Non-oxide glass compositions, e.g. binary or ternary halides, sulfides or nitrides of germanium, selenium or tellurium
- C03C3/321—Chalcogenide glasses, e.g. containing S, Se, Te
- C03C3/323—Chalcogenide glasses, e.g. containing S, Se, Te containing halogen, e.g. chalcohalide glasses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
- H01B3/087—Chemical composition of glass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/161—Containers comprising no base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
- H10W76/42—Fillings
- H10W76/48—Fillings including materials for absorbing or reacting with moisture or other undesired substances
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S65/00—Glass manufacturing
- Y10S65/15—Nonoxygen containing chalogenides
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Coating By Spraying Or Casting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US817747A US3024119A (en) | 1959-06-03 | 1959-06-03 | Glass composition and coated article |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB942755A true GB942755A (en) | 1963-11-27 |
Family
ID=25223790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB7570/60A Expired GB942755A (en) | 1959-06-03 | 1960-03-03 | Improvements in or relating to glassy compositions |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3024119A (enExample) |
| BE (1) | BE581920A (enExample) |
| ES (1) | ES258547A1 (enExample) |
| GB (1) | GB942755A (enExample) |
| NL (1) | NL251725A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4954874A (en) * | 1979-12-12 | 1990-09-04 | Tokyo Shibaura Denki Kabushiki Kaisha | Package semiconductor device using chalcogenide glass sealing |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3117013A (en) * | 1961-11-06 | 1964-01-07 | Bell Telephone Labor Inc | Glass composition |
| GB1020482A (en) * | 1961-11-07 | 1966-02-16 | Pilkington Brothers Ltd | Improvements in or relating to glass |
| DE1273082B (de) * | 1962-04-03 | 1968-07-18 | Jenaer Glaswerk Schott & Gen | Verwendung von Glaesern der Mehrstoffsysteme Arsen-Schwefel-Halogen fuer die lichtempfindlichen Teile von Fotowiderstaenden |
| US3300841A (en) * | 1962-07-17 | 1967-01-31 | Texas Instruments Inc | Method of junction passivation and product |
| NL6507796A (enExample) * | 1964-06-19 | 1965-12-20 | ||
| NL6507894A (enExample) * | 1964-06-19 | 1965-12-20 | ||
| DE1596900A1 (de) * | 1964-06-19 | 1971-04-01 | Minnesota Mining & Mfg | Glaszusammensetzung |
| DE1274736C2 (de) * | 1964-12-03 | 1974-02-07 | Verfahren zur herstellung einer halbleitervorrichtung | |
| US3474310A (en) * | 1967-02-03 | 1969-10-21 | Hitachi Ltd | Semiconductor device having a sulfurtreated silicon compound thereon and a method of making the same |
| US4492763A (en) * | 1982-07-06 | 1985-01-08 | Texas Instruments Incorporated | Low dispersion infrared glass |
| BE1019409A5 (nl) | 2010-07-07 | 2012-07-03 | Octonus Finland Oy | Verbeterde werkwijze voor het analyseren van een edelsteen. |
| DE102014103560A1 (de) | 2013-03-15 | 2014-09-18 | Schott Corporation | Optisches Binden durch die Verwendung von optischem Glas mit niedrigem Erweichungspunkt für optische IR-Anwendungen und gebildete Produkte |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2112968A (en) * | 1926-10-11 | 1938-04-05 | Rca Corp | Process and device for making cathodes |
| US2328096A (en) * | 1938-05-21 | 1943-08-31 | Western Electric Co | Method of treating strands |
| DE889913C (de) * | 1942-03-05 | 1953-09-14 | Siemens Ag | Verfahren zum UEberziehen von sehr duennen Draehten mit einer Schicht eines staubfoermigen Isolierstoffes, insbesondere Glas |
| US2883292A (en) * | 1957-05-23 | 1959-04-21 | Servo Corp Of America | Glass compositions |
| US2883294A (en) * | 1957-06-27 | 1959-04-21 | Servo Corp Of America | Glass composition |
-
0
- NL NL251725D patent/NL251725A/xx unknown
-
1959
- 1959-06-03 US US817747A patent/US3024119A/en not_active Expired - Lifetime
- 1959-08-22 BE BE581920A patent/BE581920A/fr unknown
-
1960
- 1960-03-03 GB GB7570/60A patent/GB942755A/en not_active Expired
- 1960-05-24 ES ES0258547A patent/ES258547A1/es not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4954874A (en) * | 1979-12-12 | 1990-09-04 | Tokyo Shibaura Denki Kabushiki Kaisha | Package semiconductor device using chalcogenide glass sealing |
Also Published As
| Publication number | Publication date |
|---|---|
| BE581920A (fr) | 1960-12-16 |
| NL251725A (enExample) | 1900-01-01 |
| US3024119A (en) | 1962-03-06 |
| ES258547A1 (es) | 1960-09-01 |
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