GB922124A - Component mounting for printed circuits - Google Patents

Abstract

922,124. Circuit assemblies; variable resistors. GLOBE-UNION Inc. Feb. 18, 1960, No. 5830/60. Class 37. An electrical component is sealed in a recess in one face of a printed circuit ceramic plate, with its terminals projecting through holes passing from the recess to the opposite side of the plate and soldered to metallized areas around the holes, one of the areas being connected to an impedance element bonded to the surface of the plate. A transistor 58, Fig. 6, is sealed in a recess in plate 60, Figs. 5 and 7, and a disc capacitor 62 is mounted on, and with one electrode connected to a resistor 70 on, the top of plate 60, the other capacitor electrode being connected via ribbon 66 to lead 68, Fig. 8. Spring clip wiper 72 slides along both resistor 70 and a conductive strip, on the bottom of plate 60, which connects one terminal of the transistor to lead 88. A second transistor terminal is connected to lead 84, and the third is grounded to cover plate 59. Method of sealing component in recess.-Component 14, Fig. 1, may be sealed in cylindrical recess 12 by a metal cover plate 26, which may be a solder disc. The plate and the terminal 16 are soldered to metallized areas 20 and 22. A second embodiment (Fig. 2, not shown) employs a nickel ring placed in the recess, a flange at its upper end being soldered to the metallized areas 22 before insertion of the component, subsequent to which a nickel cover plate is soldered to the flange by concentric welding electrodes or by resistance heating. A further embodiment (Fig. 4, not shown) employs high-temperature solder between a ring contained in the recess and the metallized areas 22, and lowtemperature solder for sealing the top of the metal casing of the component to the ring, and for sealing the terminals. More than one component can be sealed in a recess in vacuum or nitrogen; a transistor so sealed may dispense with a metal container and encapsulating resin.