GB876744A - Improvements in or relating to methods of manufacturing semi-conductive devices - Google Patents
Improvements in or relating to methods of manufacturing semi-conductive devicesInfo
- Publication number
- GB876744A GB876744A GB10858/58A GB1085858A GB876744A GB 876744 A GB876744 A GB 876744A GB 10858/58 A GB10858/58 A GB 10858/58A GB 1085858 A GB1085858 A GB 1085858A GB 876744 A GB876744 A GB 876744A
- Authority
- GB
- United Kingdom
- Prior art keywords
- semi
- space
- relating
- methods
- april
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 abstract 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thin Film Transistor (AREA)
- Junction Field-Effect Transistors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL358867X | 1957-04-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB876744A true GB876744A (en) | 1961-09-06 |
Family
ID=19785325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB10858/58A Expired GB876744A (en) | 1957-04-08 | 1958-04-03 | Improvements in or relating to methods of manufacturing semi-conductive devices |
Country Status (5)
Country | Link |
---|---|
CH (1) | CH358867A (enrdf_load_html_response) |
DE (1) | DE1052574B (enrdf_load_html_response) |
FR (1) | FR1194289A (enrdf_load_html_response) |
GB (1) | GB876744A (enrdf_load_html_response) |
NL (2) | NL216173A (enrdf_load_html_response) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1192323B (de) * | 1960-11-02 | 1965-05-06 | Siemens Ag | Verfahren zum Herstellen von Schweissstellen zwischen den Teilen eines ein Halbleiterelement gasdicht einschliessenden Gehaeuses und Anordnungen zur Durchfuehrung dieses Verfahrens |
-
0
- NL NL107368D patent/NL107368C/xx active
- FR FR1194289D patent/FR1194289A/fr not_active Expired
- NL NL216173D patent/NL216173A/xx unknown
-
1958
- 1958-04-03 GB GB10858/58A patent/GB876744A/en not_active Expired
- 1958-04-05 CH CH358867D patent/CH358867A/de unknown
- 1958-04-05 DE DEN14907A patent/DE1052574B/de active Pending
Also Published As
Publication number | Publication date |
---|---|
DE1052574B (de) | 1959-03-12 |
CH358867A (de) | 1961-12-15 |
NL216173A (enrdf_load_html_response) | 1900-01-01 |
NL107368C (enrdf_load_html_response) | 1900-01-01 |
FR1194289A (enrdf_load_html_response) | 1959-11-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CH359789A (de) | Halbleiteranordnung mit vakuumdichter Hülle | |
GB876744A (en) | Improvements in or relating to methods of manufacturing semi-conductive devices | |
ES244241A1 (es) | Un método de fabricacion de un sistema de capa de bloqueo semiconductor | |
AU236187B2 (en) | Improvements in or relating to lead-in arrangements for electrical devices having hermetically sealed. envelopes | |
AU5051959A (en) | Improvements in or relating to lead-in arrangements for electrical devices having hermetically sealed. envelopes | |
AU290130B2 (en) | Improvements in or relating to encapsulated semiconductor | |
GB950592A (en) | Improvements in or relating to semiconductor valves | |
GB810361A (en) | Improvements in or relating to semi-conductor devices | |
AU211095B2 (en) | Improvements in or relating to silicon semiconductor devices | |
AU221714B2 (en) | Improvements relating to sealed semiconductor assemblies | |
CA521576A (en) | High current gain semi-conductor devices | |
AU1792656A (en) | Improvements in or relating to silicon semiconductor devices | |
AU165327B2 (en) | Improvements in or relating tothe manufacture of electrical devices having a sealed evacuated envelope | |
CA545567A (en) | Silicon semiconductor devices | |
AU2599857A (en) | Improvements relating to sealed semiconductor assemblies | |
AU236875B2 (en) | Improvements relating to hermetically sealed semiconductor devices | |
CA527887A (en) | Glass envelope manufacturing machine | |
AU211920B2 (en) | Semiconductor devices | |
AU218159B2 (en) | Improvements in or relating tothe manufacture of semiconductor devices | |
AU211667B2 (en) | Improvements in semiconductor devices | |
AU217770B2 (en) | Improvements relating to circuit arrangements incorporating semiconductor devices | |
CA524303A (en) | Vacuum concentrator | |
AU212848B2 (en) | Improvements in or relating to semiconductor devices | |
AU2175653A (en) | Improvements in or relating tothe manufacture of electrical devices having a sealed evacuated envelope | |
AU5067759A (en) | Improvements relating to hermetically sealed semiconductor devices |