GB876744A - Improvements in or relating to methods of manufacturing semi-conductive devices - Google Patents
Improvements in or relating to methods of manufacturing semi-conductive devicesInfo
- Publication number
- GB876744A GB876744A GB10858/58A GB1085858A GB876744A GB 876744 A GB876744 A GB 876744A GB 10858/58 A GB10858/58 A GB 10858/58A GB 1085858 A GB1085858 A GB 1085858A GB 876744 A GB876744 A GB 876744A
- Authority
- GB
- United Kingdom
- Prior art keywords
- semi
- space
- relating
- methods
- april
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thin Film Transistor (AREA)
- Junction Field-Effect Transistors (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
876,744. Semi-conductor devices. PHILIPS ELECTRICAL INDUSTRIES Ltd. April 3, 1958 [April 8, 1957], No. 10858/58. Drawings to Specification. Class 37. In a method of encapsulating semi-conductor devices to include a predetermined amount of water vapour inside the envelope, the semiconductor devices are stored, without their envelopes, in a dry space at a low temperature, e.g. - 20‹ C., and subsequently transferred to a second space maintained at a higher temperature, e.g. +20‹ C., and a constant relative humidity, e.g. 20%, whereupon moisture condenses on them and they are sealed in vacuum tight envelopes, e.g. by cementing or coldwelding so as not to disturb the temperature conditions in the second space.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL358867X | 1957-04-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB876744A true GB876744A (en) | 1961-09-06 |
Family
ID=19785325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB10858/58A Expired GB876744A (en) | 1957-04-08 | 1958-04-03 | Improvements in or relating to methods of manufacturing semi-conductive devices |
Country Status (5)
Country | Link |
---|---|
CH (1) | CH358867A (en) |
DE (1) | DE1052574B (en) |
FR (1) | FR1194289A (en) |
GB (1) | GB876744A (en) |
NL (2) | NL216173A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1192323B (en) * | 1960-11-02 | 1965-05-06 | Siemens Ag | Method for producing welds between the parts of a housing enclosing a semiconductor element in a gastight manner and arrangements for carrying out this method |
-
0
- NL NL107368D patent/NL107368C/xx active
- FR FR1194289D patent/FR1194289A/fr not_active Expired
- NL NL216173D patent/NL216173A/xx unknown
-
1958
- 1958-04-03 GB GB10858/58A patent/GB876744A/en not_active Expired
- 1958-04-05 DE DEN14907A patent/DE1052574B/en active Pending
- 1958-04-05 CH CH358867D patent/CH358867A/en unknown
Also Published As
Publication number | Publication date |
---|---|
DE1052574B (en) | 1959-03-12 |
NL107368C (en) | 1900-01-01 |
NL216173A (en) | 1900-01-01 |
FR1194289A (en) | 1959-11-09 |
CH358867A (en) | 1961-12-15 |
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