GB876744A - Improvements in or relating to methods of manufacturing semi-conductive devices - Google Patents

Improvements in or relating to methods of manufacturing semi-conductive devices

Info

Publication number
GB876744A
GB876744A GB10858/58A GB1085858A GB876744A GB 876744 A GB876744 A GB 876744A GB 10858/58 A GB10858/58 A GB 10858/58A GB 1085858 A GB1085858 A GB 1085858A GB 876744 A GB876744 A GB 876744A
Authority
GB
United Kingdom
Prior art keywords
semi
space
relating
methods
april
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB10858/58A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electrical Industries Ltd
Original Assignee
Philips Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electrical Industries Ltd filed Critical Philips Electrical Industries Ltd
Publication of GB876744A publication Critical patent/GB876744A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

876,744. Semi-conductor devices. PHILIPS ELECTRICAL INDUSTRIES Ltd. April 3, 1958 [April 8, 1957], No. 10858/58. Drawings to Specification. Class 37. In a method of encapsulating semi-conductor devices to include a predetermined amount of water vapour inside the envelope, the semiconductor devices are stored, without their envelopes, in a dry space at a low temperature, e.g. - 20‹ C., and subsequently transferred to a second space maintained at a higher temperature, e.g. +20‹ C., and a constant relative humidity, e.g. 20%, whereupon moisture condenses on them and they are sealed in vacuum tight envelopes, e.g. by cementing or coldwelding so as not to disturb the temperature conditions in the second space.
GB10858/58A 1957-04-08 1958-04-03 Improvements in or relating to methods of manufacturing semi-conductive devices Expired GB876744A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL358867X 1957-04-08

Publications (1)

Publication Number Publication Date
GB876744A true GB876744A (en) 1961-09-06

Family

ID=19785325

Family Applications (1)

Application Number Title Priority Date Filing Date
GB10858/58A Expired GB876744A (en) 1957-04-08 1958-04-03 Improvements in or relating to methods of manufacturing semi-conductive devices

Country Status (5)

Country Link
CH (1) CH358867A (en)
DE (1) DE1052574B (en)
FR (1) FR1194289A (en)
GB (1) GB876744A (en)
NL (2) NL216173A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1192323B (en) * 1960-11-02 1965-05-06 Siemens Ag Method for producing welds between the parts of a housing enclosing a semiconductor element in a gastight manner and arrangements for carrying out this method

Also Published As

Publication number Publication date
NL107368C (en) 1900-01-01
FR1194289A (en) 1959-11-09
NL216173A (en) 1900-01-01
CH358867A (en) 1961-12-15
DE1052574B (en) 1959-03-12

Similar Documents

Publication Publication Date Title
GB876744A (en) Improvements in or relating to methods of manufacturing semi-conductive devices
ES244241A1 (en) Semi-conductive device and method of making
AU236187B2 (en) Improvements in or relating to lead-in arrangements for electrical devices having hermetically sealed. envelopes
GB873490A (en) Improvements in or relating to methods of manufacturing semi-conductive bodies
AU5051959A (en) Improvements in or relating to lead-in arrangements for electrical devices having hermetically sealed. envelopes
AU290130B2 (en) Improvements in or relating to encapsulated semiconductor
CA548523A (en) Semiconductor translating devices
CA534987A (en) Envelope
GB950592A (en) Improvements in or relating to semiconductor valves
GB810361A (en) Improvements in or relating to semi-conductor devices
AU211095B2 (en) Improvements in or relating to silicon semiconductor devices
AU221714B2 (en) Improvements relating to sealed semiconductor assemblies
CA521576A (en) High current gain semi-conductor devices
AU1792656A (en) Improvements in or relating to silicon semiconductor devices
AU165327B2 (en) Improvements in or relating tothe manufacture of electrical devices having a sealed evacuated envelope
CA545567A (en) Silicon semiconductor devices
CA538109A (en) Method of the manufacture of selenium dry rectifiers
AU2599857A (en) Improvements relating to sealed semiconductor assemblies
AU236875B2 (en) Improvements relating to hermetically sealed semiconductor devices
CA528088A (en) Envelope type radial seal
AU211920B2 (en) Semiconductor devices
AU218159B2 (en) Improvements in or relating tothe manufacture of semiconductor devices
AU211667B2 (en) Improvements in semiconductor devices
CA520390A (en) Semi-conductor translating devices
AU217770B2 (en) Improvements relating to circuit arrangements incorporating semiconductor devices