GB862044A - Semiconductor assembling apparatus - Google Patents

Semiconductor assembling apparatus

Info

Publication number
GB862044A
GB862044A GB24982/59A GB2498259A GB862044A GB 862044 A GB862044 A GB 862044A GB 24982/59 A GB24982/59 A GB 24982/59A GB 2498259 A GB2498259 A GB 2498259A GB 862044 A GB862044 A GB 862044A
Authority
GB
United Kingdom
Prior art keywords
portions
holder
semi
sub
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB24982/59A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of GB862044A publication Critical patent/GB862044A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Abstract

862,044. Semi-conductor devices. TEXAS INSTRUMENTS Inc. July 21, 1959 [July 31, 1958], No. 24982/59. Class 39. [Also in Group XXIII] In apparatus for assembling a semi-conductor element and. a contact element in a desired engaging relationship and for enclosing them in an envelope, comprising a holder having two separable portions, one of which holds the semiconductor element and part of the envelope and the other of which holds the contact element and the remainder of the envelope, the two portions having mating surfaces such that when the portions are assembled the semi-conductor and contact elements assume the desired engaging relationship, the joint between the envelope parts is fused by heat produced by R.F. currents and concentrated in the locality of the joint by a conductive heating member carried by one of the portions of the holder, the heating member being totally enclosed within the holder when the latter is assembled, thus prolonging the life of the heating member by protecting it from oxidation. As shown, a holder 10 comprises a lower portion 14 adapted to hold a sub-assembly consisting of a semi-conductor element 24 mounted on a molybdenum plug 25 which is sealed into a glass tube 22 and to which is connected a lead 18, and an upper portion 12 adapted to hold a second sub-assembly consisting of a cat's whisker 26, a lead 16, and a glass bead 20. Upper and lower portions 12, 14 comprise sections 28, 42, made of boron nitride, alumina, or other material capable of withstanding high thermal shock, having tapered surfaces which fit together thus positioning the two sub-assemblies with respect to one another. The axial position of the first sub-assembly may be adjusted by moving, by means of a threaded plug 60, a tube 58 of brass, copper, &c., which is located in a bore in the lower portion 14 and which serves to support the glass tube 22 and to accommodate the lead 18. The lead 16 is held by a magnet 38, and the pressure on cat's whisker 26 is applied by a weight or plunger 40. The glass bead 20 fits into the mouth of the glass tube 22 and is sealed therein by R.F. energy supplied to a coil 65 and concentrated around the area of fusion by means of a conducting annular heating member 56, preferably of graphite.
GB24982/59A 1958-07-31 1959-07-21 Semiconductor assembling apparatus Expired GB862044A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US752308A US2962574A (en) 1958-07-31 1958-07-31 Semiconductor assembling apparatus

Publications (1)

Publication Number Publication Date
GB862044A true GB862044A (en) 1961-03-01

Family

ID=25025747

Family Applications (1)

Application Number Title Priority Date Filing Date
GB24982/59A Expired GB862044A (en) 1958-07-31 1959-07-21 Semiconductor assembling apparatus

Country Status (2)

Country Link
US (1) US2962574A (en)
GB (1) GB862044A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3070683A (en) * 1960-01-27 1962-12-25 Joseph J Moro-Lin Cementing of semiconductor device components
US3093719A (en) * 1961-04-07 1963-06-11 Texas Instruments Inc Method of forming clean iron-lead telluride high temperature pressure contacts

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2779134A (en) * 1952-01-03 1957-01-29 Sylvania Electric Prod Semiconductor assembling apparatus
US2803732A (en) * 1952-01-17 1957-08-20 Sylvania Electric Prod High-speed r. f. sealing

Also Published As

Publication number Publication date
US2962574A (en) 1960-11-29

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